ABSTRACT
The aim of this study was to evaluate various methods of removing bacterial and fungus biofilm, to simulate orthodontic arch wires cleaning before reinsertion in the patients appliance. Rectangular Nickel Titanium (NiTi), Stainless Steel (SS) and Titanium Molybdenum (TMA) wires were divided into five groups, then contaminated with strains of Streptococcus mutans and Candida albicas. Four segments of each group served as control and were not contaminated. Six cleanings methods were used to remove the biofilm: cotton roll and a chemical agent (chlorhexidine, sodium hypochlorite, 70% alcohol), cotton roll and water, steel woll and immersion on enzymatic detergent. There was a control group not decontaminated Then wires were placed in broth separately, and after an incubation period the optical density (OD) was measured, observing whether there was microbial growth. A wire segment of each subgroup of SS 3M® was taken to the Scanning Electron Microscope (SEM) for visualization of the treatment response. The results were submitted to one-way ANOVA test and Tukey post-test. With the exception of 70% alcohol, the disinfection means behaved similarly regardless the type of wire. Two percent Chlorhexidine and 1% Sodium Hypochlorite totally removed the microorganisms while other agents left a high microbial concentration. Chemical cleaning is necessary to remove biofilm in orthodontic wires; 1% Sodium Hypochlorite and 2% Chlorhexidine are good disinfectants for this purpose.