ABSTRACT
Statement of the Problem: Similar to conventional amalgam, high-copper amalgam alloy may also undergo corrosion, but it takes longer time for the resulting products to reduce microleakage by sealing the micro-gap at the tooth/amalgam interface
Purpose: The aim of this study was to evaluate the effect of self-etch adhesives with different pH levels on the interfacial corrosion behavior of high-copper amalgam restoration and its induction potential for self-sealing ability of the micro-gap in the early hours after setting by means of Electro-Chemical Tests [ECTs]
Materials and Method: Thirty cylindrical cavities of 4.5mm x 4.7mm were prepared on intact bicuspids. The samples were divided into five main groups of application of Adhesive Resin [AR]/ liner/ None [No], on the cavity floor. The first main group was left without an AR/ liner [No]. In the other main groups, the types of AR/liner used were I-Bond [IB], Clearfil S[3] [S[3]], Single Bond [SB] and Varnish [V]. Each main group [n=6] was divided into two subgroups [n=3] according to the types of the amalgams used, either admixed ANA 2000 [ANA] or spherical Tytin [Tyt]. The ECTs, Open Circuit Potential [OCP], and the Linear Polarization Resistance [LPR] for each sample were performed and measured 48 hours after the completion of the samples
Results: The Tyt-No and Tyt-IB samples showed the highest and lowest OCP values respectively. In LPR tests, the R[p] values of ANA-V and Tyt-V were the highest [lowest corrosion rate] and contrarily, the ANA-IB and Tyt-IB samples, with the lowest pH levels, represented the lowest R[p] values [highest corrosion rates]
Conclusion: Some self-etch adhesives may increase interfacial corrosion potential and self-sealing ability of high-copper amalgams