Your browser doesn't support javascript.
loading
Mostrar: 20 | 50 | 100
Resultados 1 - 1 de 1
Filtrar
Añadir filtros








Intervalo de año
1.
The Journal of Advanced Prosthodontics ; : 294-301, 2017.
Artículo en Inglés | WPRIM | ID: wpr-22208

RESUMEN

PURPOSE: Temperature increase of 5.5 ℃ can cause damage or necrosis of the pulp. Increasing temperature can be caused not only by mechanical factors, e.g. grinding, but also by exothermic polymerization reactions of resin materials. The aim of this study was to evaluate influences of the form material on the intrapulpal temperature during the polymerization of different self-curing resin materials for temporary restorations. MATERIALS AND METHODS: 30 provisonal bridges were made of 5 resin materials: Prevision Temp (Pre), Protemp 4 (Pro), Luxatemp Star (Lux), Structure 3 (Str) and an experimental material (Exp). Moulds made of alginate (A) and of silicone (S) and vacuum formed moulds (V) were used to build 10 bridges each on a special experimental setup. The intrapulpal temperatures of three abutment teeth (a canine, a premolar, and a molar,) were measured during the polymerization every second under isothermal conditions. Comparisons of the maximum temperature (T(Max)) and the time until the maximum temperature (t(TMax)) were performed using ANOVA and Tukey Test. RESULTS: Using alginate as the mould material resulted in a cooling effect for every resin material. Using the vacuum formed mould, T(Max) increased significantly compared to alginate (P<.001) and silicone (P<.001). In groups Lux, Pro, and Pre, t(TMax) increased when the vacuum formed moulds were used. In groups Exp and Str, there was no influence of the mould material on t(TMax). CONCLUSION: All of the mould materials are suitable for clinical use if the intraoral application time does not exceed the manufacturer's instructions for the resin materials.


Asunto(s)
Diente Premolar , Necrosis , Polimerizacion , Polímeros , Silicio , Siliconas , Diente , Vacio
SELECCIÓN DE REFERENCIAS
DETALLE DE LA BÚSQUEDA