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1.
Korean Journal of Occupational and Environmental Medicine ; : 333-342, 2011.
Artigo em Coreano | WPRIM | ID: wpr-215107

RESUMO

OBJECTIVES: To associate work in the semiconductor industry, including silicon wafer fabrication, with cancer risks or mortality and other adverse health effects, the operation of wafer fabrication should initially be understood. A detailed study on the fabrication operation allows retrospective exposure to be assessed and wafer fabrication workers to be classified into similar exposure groups. Therefore, the objective of this study was to comprehensively review silicon wafer fabrication operations and related hazardous materials and agents. METHODS: The literatures related to semiconductor industry processes were reviewed from an occupational health viewpoint based on wafer manufacturing, wafer fabrication and packaging. The focus was especially related to the hazardous materials used in wafer fabrication industries. RESULTS: During the fabrication of silicon wafers, many toxic chemicals, a strong electric field and hazardous equipment are used. The process allows the integration of a three-dimensional array of electric circuits onto a silicon wafer substrate. Wafers are sliced from single crystal silicon and subject to a series of steps during the fabrication process, which alternatively adds and then selectively removes materials in layers from the surface of the wafer to create different parts of the completed integrated circuit. There are four major steps in this process; patterning, junction formation, thin film and metallization. CONCLUSIONS: In order to associate exposure to the hazard agents generated during wafer fabrication operations with adverse health effects the details of the operation should be completely studied, which will be helpful in both exposure assessments and epidemiological studies.


Assuntos
Substâncias Perigosas , Saúde Ocupacional , Embalagem de Produtos , Estudos Retrospectivos , Fatores de Risco , Semicondutores , Silício
2.
Safety and Health at Work ; : 210-217, 2011.
Artigo em Inglês | WPRIM | ID: wpr-220908

RESUMO

OBJECTIVES: The purpose of this study was to measure the concentration of volatile organic compound (VOC)s originated from the chemicals used and/or derived from the original parental chemicals in the photolithography processes of semiconductor manufacturing factories. METHODS: A total of four photolithography processes in 4 Fabs at three different semiconductor manufacturing factories in Korea were selected for this study. This study investigated the types of chemicals used and generated during the photolithography process of each Fab, and the concentration levels of VOCs for each Fab. RESULTS: A variety of organic compounds such as ketone, alcohol, and acetate compounds as well as aromatic compounds were used as solvents and developing agents in the processes. Also, the generation of by-products, such as toluene and phenol, was identified through a thermal decomposition experiment performed on a photoresist. The VOC concentration levels in the processes were lower than 5% of the threshold limit value (TLV)s. However, the air contaminated with chemical substances generated during the processes was re-circulated through the ventilation system, thereby affecting the airborne VOC concentrations in the photolithography processes. CONCLUSION: Tens of organic compounds were being used in the photolithography processes, though the types of chemical used varied with the factory. Also, by-products, such as aromatic compounds, could be generated during photoresist patterning by exposure to light. Although the airborne VOC concentrations resulting from the processes were lower than 5% of the TLVs, employees still could be exposed directly or indirectly to various types of VOCs.


Assuntos
Humanos , Coreia (Geográfico) , Luz , Pais , Fenol , Semicondutores , Solventes , Tolueno , Estimulação Elétrica Nervosa Transcutânea , Ventilação , Compostos Orgânicos Voláteis
3.
Rev. ing. bioméd ; 1(2): 69-73, graf
Artigo em Espanhol | LILACS | ID: lil-773321

RESUMO

Enfermedades hormonales como la diabetes exigen el uso frecuente de procedimientos para muestreo de fluidos y suministro de medicamentos que ocasionan traumas en los tejidos epiteliales por la penetración de agujas convencionales. Este hecho motiva el desarrollo de tecnologías alternativas que disminuyan el daño tisular y contribuyan a mejorar la calidad de vida de los pacientes, tema que constituye un campo activo de investigación en compañías y universidades alrededor del mundo. Este artículo presenta los resultados preliminares de la fabricación de arreglos de microagujas en Colombia, empleando la técnica de fotolitografía en capas gruesas de SU-8 que ha sido utilizada por el grupo de Ciencia y Tecnología de Materiales de la Universidad Nacional de Colombia Sede Medellín. Se presentan las micrografías de agujas huecas y macizas obtenidas en diferentes tamaños y se discuten las cualidades y defectos del proceso de fabricación.


Hormonal illnesses like diabetes demand the frequent use of fluid sampling and drug delivery procedures, which produces traumas on skin tissues, as a result of conventional needles penetration. This fact motivates the development of alternative technologies that decrease tissue damage and contribute to improve the quality of life of the patients. This topic constitutes an active field of research in many companies and universities around the world. This paper presents preliminary results of the fabrication of microneedle arrays, using the technique of SU-8 thick film photolithography, previously standardized by the Group of Materials Science and Technology of the National University of Colombia in Medellín. Micrographs of the obtained hollowed and solid needles of different sizes are presented and goals and limitations of the proposed methodology are discussed.

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