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Journal of Medical Postgraduates ; (12): 509-511, 2018.
Artigo em Chinês | WPRIM | ID: wpr-700863

RESUMO

Objective During the process of growing cells on coverslips by traditional method , damages like detachment and fragmentation always happen to slips , which affect the experimental process .The article aimed to introduce a new method of growing cells on coverslips, which facilitated experimental operation and simplified the experiment procedure .Methods 1 mL pipette tips were made into cylindrical chambers for use by cutting 20mm from the end.Neutral balsam group: The prepared pipette tips were atta-ched onto the slide by neutral balsam in a symmetrical double row .Glue stick heating group: The glue stick was applied slowly and e -venly on the outer sides along the end of the pipette tips after it was heated .The ends were glued to the slide with the end downward , forming a symmetrical double-row arrangement.Autoclaving was followed after drying and fixing .A comparison was made between the effects of traditional coverslips and hot -melt coverslips.HE staining was used to observe the cell growth . Results The tubes in glue stick heating group were easy to remove from the slides , while the neutral balsam group showed stronger adhesion .During the removing process: there were neutral balsam residues on the slide after the pipette tips were removed in neutral balsam group , while the adhesives could be bluntly removed from the slide in the form of a rubber ring in glue stick heating group .Similar to the traditional meth-od of growing cells on coverdslips , there were no cell contamination or proliferation restriction in the coverslip device made by hot glue .The cells were in good growth and even distribution , without any detachment from the slides. Conclusion The self-made coverslip de-vice by hot-melt adhesive method makes experiment more simplified and convenient , which can be applied in integrated multigroup cov -erslips.Recycling and reusing of consumables during the preparation process save experiment expenses .

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