Effect of diode laser irradiation on the bond strength of polymerized non-simplified adhesive systems after 12 months of water storage

Abstract Objectives: The aim of this in vitro study was to evaluate the bonding strength of non-simplified dentin bonding systems (DBS) to dentin irradiated with a diode laser (970 nm) immediately and after 12 months of water storage following either primer or bond application. Material and methods: The experimental design included three different factors: DBS type [AdperTM Scotchbond Multipurpose (MP) and Clearfil™ SE Bond (CSE)], irradiation [without irradiation - control (C), irradiation after primer application (AP), and irradiation after bond application (AB)], and time [initial (I) and after 12 months of water storage (12 m)]. Sixty sound human third molars (n = 10) were obtained, and their flat occlusal dentin areas were prepared and standardized. Laser irradiation was performed in the contact mode perpendicular to the dental surface over an automatically selected scanning area at a pulse energy of 0.8 W, frequency of 10 Hz, and energy density of 66.67 J/cm2. After 7 days of treatment, the specimens were cut, and half of them were subjected to microtensile testing (500 N/0.05 mm/min), whereas the remaining sticks were examined after 12 months of water storage. The obtained data were analyzed by three-way analysis of variance (ANOVA) followed by a Tukey test (p<0.05). The observed fracture modes were investigated using a portable digital microscope with a magnification of 40x. Results: Among the utilized DBS, MP generally exhibited higher bond strengths, but did not always differ from CSE under similar conditions. The irradiation factor was statistically significant only for the MP/AB groups. After 12 months of storage, all groups demonstrated a significant reduction in the bond strength, whereas the results of fracture analysis showed a predominance of the adhesive type. Conclusions: The laser treatment of non-simplified DBS was not able to stabilize their bonding characteristics after 12 months.

Does laser diode irradiation improve the degree of conversion of simplified dentin bonding systems?

Abstract Simplified dentin-bonding systems are clinically employed for most adhesive procedures, and they are prone to hydrolytic degradation. Objective This study aimed to investigate the effect of laser diode irradiation on the degree of conversion (DC), water sorption (WS), and water solubility (WSB) of these bonding systems in an attempt to improve their physico-mechanical resistance. Material and Methods Two bonding agents were tested: a two-step total-etch system [Adper™ Single Bond 2, 3M ESPE (SB)] and a universal system [Adper™ Single Bond Universal, 3M ESPE (SU)]. Square-shaped specimens were prepared and assigned into 4 groups (n=5): SB and SU (control groups - no laser irradiation) and SB-L and SU-L [SB and SU laser (L) - irradiated groups]. DC was assessed using Fourier transform infrared spectroscopy with attenuated total reflectance. Additional uncured resin samples (≈3.0 µL, n=5) of each adhesive were also scanned for final DC calculation. For WS/WSB tests, similar specimens (n=10) were prepared and measured by monitoring the mass changes after dehydration/water storage cycles. For both tests, adhesive fluids were dropped into standardized Teflon molds (6.0×6.0×1.0 mm), irradiated with a 970-nm laser diode, and then polymerized with an LED-curing unit (1 W/cm2). Results Laser irradiation immediately before photopolymerization increased the DC (%) of the tested adhesives: SB-L>SB>SU-L>SU. For WS/WSB (μg/mm3), only the dentin bonding system (DBS) was a significant factor (p<0.05): SB>SU. Conclusion Irradiation with a laser diode improved the degree of conversion of all tested simplified dentin bonding systems, with no impact on water sorption and solubility.

Efeito da irradiação com laser de diodo sobre adesivos dentinários: estudo in vitro / Effect of diode laser irradiation on dentin-bonding agents

A irradiação de sistemas adesivos com laser tem obtido resultados promissores, no entanto, seu mecanismo de ação, bem como a longevidade da camada híbrida obtida após a irradiação com laser ainda não estão bem estabelecidos na literatura. A presente tese teve como objetivo: avaliar a absorvância do laser de Diodo por diferentes sistemas adesivos por meio de espectroscopia no infravermelho próximo; avaliar a evaporação de água e solventes proporcionada pelo laser por meio da variação da massa analisada em balança de precisão; avaliar a resistência de união por meio de teste de microtração após envelhecimento de 12 meses. Os dados obtidos foram analisados por modelos de ANOVA, seguidos de teste Tukey (p<0,05) e os resultados demonstraram que: a irradiação no infravermelho próximo, área do espectro eletromagnético que compreende o laser de Diodo, não apresenta interação com os sistemas adesivos testados; o laser de Diodo é capaz de proporcionar maior alteração de massa, mesmo após contínua evaporação dos solventes com jatos de ar por 60s; sistemas adesivos simplificados apresentaram valores de resistência de união imediato semelhantes aos valores obtidos após 12 meses de envelhecimento. Os dados obtidos neste estudo sugerem que a irradiação com laser de Diodo pode contribuir favoravelmente para a adesão em dentina com sistemas adesivos simplificados após 1 ano.(AU)

The laser irradiation of adhesive systems has obtained promising results, however, its mechanism of action, as well as the longevity of the hybrid layer obtained after laser irradiation are still not yet well established in the literature. This thesis aimed to: assess the diode laser interaction with different adhesive systems by means of near infrared spectroscopy; evaluate the evaporation of solvents and water provided by the laser through the mass variation analyzed at a precision balance; evaluate the bond strength through microtensile bond strength test after 12 months of aging. The data was analyzed through ANOVA models, followed by Tukey test (p<0.05), and the results demonstrated that: in the near-infrared irradiation area, the electromagnetic spectrum comprising the diode laser, shows no interaction with the adhesive systems tested; the diode laser was able to provide greater mass variation, even after continual evaporation of solvents with air jets for 60s; simplified adhesive systems presented immediate bond strength values similar to the ones verified after 12 months of aging. The data obtained in this study suggest that the Diode laser irradiation can contribute favorably for the adhesion between dentin and simplified adhesive systems after 1 year.(AU)

Impact of adhesive and photoactivation method on sealant integrity and polymer network formation

We evaluated the influence of photoactivation method and hydrophobic resin (HR) application on the marginal and internal adaptation, hardness (KHN), and crosslink density (CLD) of a resin-based fissure sealant. Model fissures were created in bovine enamel fragments (n = 10) and sealed using one of the following protocols: no adhesive system + photoactivation of the sealant using continuous light (CL), no adhesive system + photoactivation of the sealant using the soft-start method (SS), HR + CL, or HR + SS. Marginal and internal gaps and KHN were assessed after storage in water for 24 h. The CLD was indirectly assessed by repeating the KHN measurement after 24 h of immersion in 100% ethanol. There was no difference among the samples with regard to marginal or internal adaptation. The KHN and CLD were similar for samples cured using either photoactivation method. Use of a hydrophobic resin prior to placement of fissure sealants and curing the sealant using the soft-start method may not provide any positive influence on integrity or crosslink density.

Effect of light-activation on the antibacterial activity of dentin bonding agents

Aim: This study evaluated the effect of light-activation on the antibacterial activity of dentin bonding systems. Methods: Inocula of Streptococcus mutans and Lactobacillus casei cultures were spread on the surface of BHI agar and the materials were applied and subjected or not to light-activation. Zones of bacterial growth inhibition around the discs were measured. Results: Excite, Single Bond and the bond of Clearfil SE Bond (SE) and Clearfil Protect Bond (CP) did not show any antibacterial activity. The strongest inhibitory activity was observed for the primers of CP and Prompt (PR) against S. mutans and the primers of SE andPB against L. casei. Conclusion: Light-activation significantly reduced or suppressed the antibacterial activity of the initially active uncured dentin bonding systems.

[ effect of the light activation mode on incompatibility between one-bottle adhesives and light-cured composites: an in-vitro shear bond strength study]

Adverse surface interactions between one-bottle adhesives and self-cured composites may occur similarly with light-cured composites during the use of different modes of light activation. The study examined the effect of different light activation modes of light-cured composite on the shear bond strength of 2 one-bottle adhesives with different acidity to the dentin. The experimental study was performed on 110 extracted sound molars. Then, the teeth were randomly divided into 10 equal groups [n=11]. One-Step plus [OS] and Prime and Board NT [P and B NT] were [SSI]. Soft- Start II [SSII], Pulse-Delay I [PDI], Pulse- Delay II [PDII]. Then, shear bond strength [SBS] test was performed, using an Instron at 1mm/min. The SBS was recorded in MPa. Statistical analysis included two way ANOVA with a significance level of 0.05. The highest SBS [MPa] was shown in OS conventional group [19.62] and the lowest in P and B NT, PDII [5.43]. In each group of 5 curing mode, mean SBS in P and B NT was significantly lower than that in OS as follows: In conventional; P and B NT [17.27] vs OS [19.82] in SSI; P and B NT [10.89] vs OS [13.09] in SSII; P and B NT [14.48] vs. OS [18.79] in PDI; P and B NT [5.93] vs OS [11.97] and in PDII; P and B NT [11.82] vs OS [16], [p<0.001]. In each of 2 adhesives, ranking of SBS from minimum to maximum was as follows: PDI

Polymerization shrinkage stress of composites photoactivated by different light sources

The purpose of this study was to compare the polymerization shrinkage stress of composite resins (microfilled, microhybrid and hybrid) photoactivated by quartz-tungsten halogen light (QTH) and light-emitting diode (LED). Glass rods (5.0 mm x 5.0 cm) were fabricated and had one of the surfaces air-abraded with aluminum oxide and coated with a layer of an adhesive system, which was photoactivated with the QTH unit. The glass rods were vertically assembled, in pairs, to a universal testing machine and the composites were applied to the lower rod. The upper rod was placed closer, at 2 mm, and an extensometer was attached to the rods. The 20 composites were polymerized by either QTH (n=10) or LED (n=10) curing units. Polymerization was carried out using 2 devices positioned in opposite sides, which were simultaneously activated for 40 s. Shrinkage stress was analyzed twice: shortly after polymerization (t40s) and 10 min later (t10min). Data were analyzed statistically by 2-way ANOVA and Tukey's test (a=5 percent). The shrinkage stress for all composites was higher at t10min than at t40s, regardless of the activation source. Microfilled composite resins showed lower shrinkage stress values compared to the other composite resins. For the hybrid and microhybrid composite resins, the light source had no influence on the shrinkage stress, except for microfilled composite at t10min. It may be concluded that the composition of composite resins is the factor with the strongest influence on shrinkage stress.

Este estudo comparou a contração de polimerização de resinas compostas fotoativadas por luz halógena (QTH) e diodo emissor de luz (LED). Foram confeccionados bastões de vidro (5,0 mm x 5,0 cm), e uma de suas extremidades sofreu jateamento com óxido de alumínio, sobre a qual foi aplicado um adesivo e fotoativado com luz halógena. Os bastões de vidro foram acoplados verticalmente, em pares, em uma máquina universal de ensaios (EMIC DL-2000) e as resinas compostas aplicadas no bastão inferior. A distância entre os bastões foi padronizada em 2 mm e um extensômetro foi acoplado a eles. As resinas foram fotoativadas (n=20), sendo 10 por QTH e 10 por LED utilizando dois aparelhos posicionados em lados opostos, acionados simultaneamente por 40 s. A tensão de contração foi analisada em dois momentos: logo após a polimerização (t40s) e 10 min após (t10min). A tensão de contração apresentada por todas as resinas foi maior em t10min do que em t40s, independente da fonte ativadora. A resina de micropartículas apresentou menores valores de tensão de contração com valores estatisticamente significantes em relação às demais resinas. Para as resinas híbrida e microhíbrida não houve influência da unidade ativadora sobre a tensão de contração, com exceção para a resina de micropartículas em t10min. Concluiu-se que a composição da resina composta foi o fator que mais interferiu na tensão de contração da resina composta.

Effect of gamma irradiation on fluoride release and antibacterial activity of resin dental materials

This study evaluated the effect of gamma irradiation on fluoride release and antibacterial activity of FluroShield (FS) and Clearfil Protect Bond (CPB). Four groups were formed: G1-FS + gamma; G2-FS without gamma; G3-CPB + gamma; G4-CPB without gamma. For fluoride release analysis, 12 disks of each material were prepared and covered with nail polish, except for one side (50.4 mm² area). G1 and G3 were sterilized with a 14.5 KGy dose at 27ºC for 24 h, while G2 and G4 (controls) were not sterilized and were maintained under the same time and temperature conditions. Fluoride release measurements were made in duplicate (n=6) by an ion specific electrode. The antibacterial activity of the CPB and FS against Streptococcus mutans after gamma sterilization was evaluated by the agar-disc diffusion method. The diameter of the zones of microbial growth inhibition was recorded after 48 h. Data were analyzed statistically by ANOVA and Tukey's test (α=5 percent). Gamma sterilization decreased the fluoride release of FS by approximately 50 percent, while CPB was not affected. There was no statistically significant difference (p>0.05) in the antibacterial effect of CPB between gamma and non-gamma sterilization groups. FS presented no antibacterial activity. Gamma irradiation decreased the fluoride release of FS, but did not affect the antibacterial activity of the studied materials.

Este estudo avaliou o efeito da esterilização com raios-gama na liberação de flúor e atividade antibacteriana de materiais resinosos, Fluroshield (FS) e Clearfil Protect Bond (CPB). Quatro grupos foram formados: G1-FS e gama; G2-FS sem gama; G3-CPB e gama; G4-CPB sem gama. Doze discos de cada material foram preparados para análise de liberação de flúor, os quais foram cobertos com esmalte de unha, exceto em um lado com 50,4 mm² de área. G1 e G3 foram esterilizados com dose de 14,5 KGy por 24 h/27ºC, enquanto G2 e G4 (controles) não foram esterilizados e foram mantidos sob as mesmas condições de tempo e temperatura. As leituras de liberação de flúor foram feitas em duplicata (n=6) por um eletrodo específico. A atividade antibacteriana foi avaliada pelo teste de difusão em agar. Os halos de inibição foram medidos após 48 h. Os dados foram analisados pelos testes ANOVA e Tukey (α=5 por cento). A esterilização gama diminuiu a liberação de flúor de FS em cerca de 50 por cento, enquanto CPB não foi afetado. Não houve diferença estatisticamente significante entre os grupos esterilizados e controle no efeito antibacteriano do CPB. FS não apresentou atividade antibacteriana. A esterilização gama diminuiu a liberação de flúor de FS, mas não afetou a atividade antibacteriana dos materiais estudados.

Effect of different modes of light modulation on the bond strength and knoop hardness of a dental composite

This study evaluated the bond strength and Knoop hardness of Z250 composite resin, light activated with XL2500 curing unit, using different protocols: continuous mode - high intensity (CH) (700 mW/cm²) for 20 s; continuous mode - low intensity (CL) (150 mW/cm²) for 20 s; and pulse-delay with 150 mW/cm² for 2(P2), 3(P3), 5(P5), 10(P10) or 15 s (P15), with a 1-min delay, followed by 700 mW/cm² for 20 s. For the push-out test (n=10), the bond strength values were obtained using a universal test machine at a crosshead speed of 0.5 mm/min. For Knoop hardness (n=5), the specimens were made using the same light-activation protocols. The hardness measurements were made with a hardness tester at six depths (top, 1, 2, 3, 4, and 5 mm). The data were subjected to ANOVA and Tukey's test at 5 percent significance level. For bond strength, CL and P5 presented significantly higher mean values (p<0.05) than the other groups. There was no statistically significant difference (p>0.05) between P2, P3, P10, P15 and CH. For Knoop hardness, CH and P15 presented the highest mean values from top surface up to 4 mm depth , while CL presented the lowest hardness mean values (p<0.05). From the depth of 3 mm to 5 mm, the mean values of all groups were significantly lower (p<0.05) than those recorded on top surface. In conclusion, for the pulse-delay method, the initial exposure time can influence bond strength and Knoop hardness of composites.

Este estudo verificou a resistência de união e a dureza Knoop do compósito Z250 (3M/ESPE), fotoativado com luz de lâmpada halógena (XL2500, 3M/ESPE), utilizando diferentes protocolos: modo contínuo alta intensidade (CH) (700mW/cm²) por 20s; modo contínuo baixa intensidade (CL) (150mW/cm²) por 20s; pulse-delay com 150mW/cm² por 2(P2), 3(P3), 5(P5), 10(P10) ou 15(P15) segundos, com 1 min de espera, seguido por 700mW/cm² por 20s. Para o teste de união push-out (n=10), os valores de resistência de união foram obtidos em máquina de ensaio universal Instron. Para o ensaio de dureza Knoop (n=5) os espécimes foram fotoativados pelos mesmos protocolos utilizados no ensaio de resistência de união. As medidas de dureza foram realizadas em um microdurômetro (Shimadzu) em 6 profundidades (topo, 1, 2, 3, 4 e 5 mm). Os dados foram submetidos à Análise de Variância e ao teste de Tukey com nível de significância de 5 por cento. Os resultados mostraram que P5 e CL apresentaram resistência de união estatisticamente superior a todos os grupos. Não houve diferença entre os grupos P2, P3, P10, P15 e CH. Para dureza Knoop, CH apresentou os maiores valores, estatisticamente superiores a P2 e CL até 4 mm. A partir de 3 mm, a dureza de todos os grupos foi inferior a dureza do topo. O tempo de exposição inicial para o modo pulse-delay pode influenciar a resistência de união e a dureza Knoop.