adsorption of quinoline at the mercury solution interface

ABSTRACT

Little work has been carried out on the adsorption of quinoline at metal surfaces. Lovercek and Cipris [1] reported that the increase of quinoline concentration in 0.1N - HC1 brought about a decrease in the electro-capillary curves. The study was of a semi-qualitative nature, and no detailed data were given. On the other hand, Bordi and Papeschi [2] examined in detail the adsorption of quinoline on Hg in l.0 M KNO[3], using the electrocapillary technique. Two families of curves representing the lowering in the interfacial tension were given corresponding to two plateaux for the F/c relationship. These were assumed to be due to the adsorption of quinoline in the planer and vertical orientation. Quinoline is frequently used as additive to improve etching and to decrease corrosiveness in Ni electroplating baths [3], and to inhibit the corrosion of Fe by HC1 [4]. Accordingly, a thorough understanding of the factors affecting the adsorption and orientation of this additive at metal interfaces should be of value. In this work, the results of measurements of the parameters of the electrocapillary maximum of mercury, sigma max and E max, are reported for molar aqueous solutions of KNO[3], KCI and HC1 and in 0.5M Na[2]SO containing increasing concentrations of quinoline