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Repairing Diabetic Wounds with Polysaccharides from Traditional Chinese Medicines: A Review / 中国实验方剂学杂志
Chinese Journal of Experimental Traditional Medical Formulae ; (24): 258-266, 2022.
Article in Chinese | WPRIM | ID: wpr-940751
ABSTRACT
As of 2020, there are more than 120 million diabetic patients in China. Diabetic wounds is one of the common complications of diabetes with increasing incidence and has the potential to cause disability and mortality. Traditional Chinese medicine (TCM) has a long history in treating diabetic wounds, demonstrating significant efficacy and safety. In recent years, increasing researchers have explored the mechanisms of polysaccharides from TCM in the repair of diabetic wounds. Polysaccharides are the main active ingredients of TCM and employ one or more blood sugar-lowering mechanisms. However, most studies focus on the repair mechanism of single polysaccharides, and there is little in-depth discussion and summary. To provide a new therapy for diabetic wounds, which meets international standards and has the characteristics of TCM, and provide reference for the clinical treatment of diabetic wounds, we reviewed relevant literature to summarize the mechanisms of TCM polysaccharides in treating diabetic wounds. The mechanisms include inhibiting inflammation to improve wound microenvironment, lowering blood sugar, promoting fibroblast migration and proliferation, regulating wound growth factor to promote angiogenesis, inhibiting oxidative stress response, and regulating immune function. Finally, we put forward some possible research directions in the future.

Full text: Available Index: WPRIM (Western Pacific) Type of study: Practice guideline / Qualitative research Language: Chinese Journal: Chinese Journal of Experimental Traditional Medical Formulae Year: 2022 Type: Article

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Full text: Available Index: WPRIM (Western Pacific) Type of study: Practice guideline / Qualitative research Language: Chinese Journal: Chinese Journal of Experimental Traditional Medical Formulae Year: 2022 Type: Article