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A comparison between 635/808 nm dual-wavelength semiconductor laser and He-Ne laser irradiation in the healing of surgical incisions / 国际生物医学工程杂志
International Journal of Biomedical Engineering ; (6): 111-114, 2014.
Artículo en Chino | WPRIM | ID: wpr-447587
ABSTRACT
Objective To compare healing effects of surgical incisions using 635 /808 nm dualwavelength semiconductor laser and He-Ne laser irradiation.Methods 168 cases of non-malignant tumor surgery patients were randomly divided into 2 groupstest group including 83 cases which were treated on the surgical incisions by laser irradiation of the semiconductor illumination with low-intensity power; positive control group with 85 cases treated with He-Ne laser.Observation was carried out on incision healing by the clinic manifestations including redness,heat,swelling,pain,exudation,wound open,adverse event and the incision length offset.Results There was no significant difference between experimental group and the control group on incision healing (P>0.05).Conclusions The treatment efficacy of the dual-wavelength semiconductor laser on surgical incisions healing is similar with that of the He-Ne laser.

Texto completo: Disponible Índice: WPRIM (Pacífico Occidental) Idioma: Chino Revista: International Journal of Biomedical Engineering Año: 2014 Tipo del documento: Artículo

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Texto completo: Disponible Índice: WPRIM (Pacífico Occidental) Idioma: Chino Revista: International Journal of Biomedical Engineering Año: 2014 Tipo del documento: Artículo