Your browser doesn't support javascript.
Show: 20 | 50 | 100
Results 1 - 2 de 2
Add filters

Document Type
Year range
71st IEEE Electronic Components and Technology Conference, ECTC 2021 ; 2021-June:570-576, 2021.
Article in English | Scopus | ID: covidwho-1705856


Due to the full-scale start-up of 5G communications as well as increase in use of online video sharing services and various teleworking services due to the impact of COVID-19, investments in data centers and high performance servers are accelerating leading to higher data transmission speed requirements in semiconductor device used in high performance computing (HPC). Technological breakthrough not only in silicon technologies but packaging technologies have become more crucial to enable these demands. One such technology, 2.5D packaging utilizing silicon interposers have emerged with increasing number of dies being placed in a single package, thereby making the size of silicon interposers larger. This has also led to advanced organic build-up laminated substrates, commonly used in these devices to connect the die/interposer to the PCBs, becoming ever complex and larger in size, requiring many features such as low insertion loss at high frequency even at elevated temperatures and high humidity conditions. Furthermore, maintaining reliability of these substrates are becoming more challenging as the size of the substrates continue to increase and greater stress is exerted on the substrates. In this paper, we present a newly developed dielectric build-up material;one of the main component of advanced organic build-up substrates, with designs to enable lower insertion loss even at elevated humidity and temperature. Furthermore, flexible segment was introduced into the resin to enable higher fracture toughness in an attempt to enable better reliability of larger substrates. The material design philosophy as well as the data showing the contribution of the flexible component to suppress substrate cracking and thus, enabling higher fracture toughness even at low temperatures, and the result of Thermal Shock Cycle Reliability Test will be presented. © 2021 IEEE

Jaids-Journal of Acquired Immune Deficiency Syndromes ; 87(2):E182-E187, 2021.
Article in English | Web of Science | ID: covidwho-1688416


Background: During the COVID-19 outbreak, facility capacity for HIV testing has been limited. Furthermore, people may have opted against HIV testing during this period to avoid COVID-19 exposure. We investigated the influence of the COVID-19 pandemic on HIV testing and the number of reported HIV cases in Japan. Methods: We analyzed quarterly HIV/AIDS-related data from 2015 to the second quarter of 2020 using an anomaly detection approach. The data included the number of consultations, the number of HIV tests performed by public health centers or municipalities, and the number of newly reported HIV cases with and without an AIDS diagnosis. We further performed the same analysis for 2 subgroups: men who have sex with men (MSM) and non-Japanese persons. Results: The number of HIV tests (9,584 vs. 35,908 in the yearbefore period) and consultations (11,689 vs. 32,565) performed by public health centers significantly declined in the second quarter of 2020, whereas the proportion of new HIV cases with an AIDS diagnosis (36.2% vs. 26.4%) significantly increased after removing the trend and seasonality effects. HIV cases without an AIDS diagnosis decreased (166 vs. 217), but the reduction was not significant. We confirmed similar trends for the men who have sex with men and non-Japanese subgroups. Conclusions: During the COVID-19 pandemic, the current HIV testing system in Japan seems to have missed more cases of HIV before developing AIDS. Continuously monitoring the situation and securing sufficient test resources by use of self-testing is essential to understand the clear epidemiological picture of HIV incidence during the COVID-19 pandemic.