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Cerebrovascular Diseases ; 50(SUPPL 1):1, 2021.
Article in English | Web of Science | ID: covidwho-1576568
Dig Tech Pap IEEE Int Solid State Circuits Conf ; 64:180-182, 2021.
Article in English | Scopus | ID: covidwho-1140056


COVID-19 sparked a paradigm shift for businesses, education, and social life. The measures taken have emphasized, more than ever, the importance of on-line communication platforms. Online streaming services, education tools, and workplace communication tools all experienced a multifold increase in demand in 2020 as the world population was under a lockdown. Service providers' ability to meet these demands relies on the capacity of mega-scale data centers (MSDC). Hence, capacity and bandwidth of MSDCs are expected to grow exponentially. The transition from 12.8 to 51.2Tb/s switches for data centers leaf and spine is underway, and is expected to deploy starting in 2021\sim 2022 [1]. Unfortunately, the increase of switch throughput comes with serious area, yield, and power limitations. To mitigate the problem, recent advances in chiplets and multi-die technologies for high throughput switches show a promising increase in yield and lower solution cost. Another direction is silicon photonic and ASIC co-integration, which allows for package throughput well beyond the electrical interface capability. © 2021 IEEE.