ABSTRACT
In this paper, a polyacrylic elastomer latex with butyl acrylate (BA) as the core and methyl methacrylate (MMA) copolymerized with glycidyl methacrylate (GMA) as the shell, named poly(BA-MMA-GMA) (PBMG), was synthesized by seeded emulsion polymerization. Cellulose nanocrystal (CNC) was dispersed in the polyacrylic latex to prepare PBMG/CNC dispersions with different CNC contents. The dried product was mixed with polylactic acid (PLA) to fabricate PLA/PBMG/CNC blends. The addition of PBMG and PBMG/CNC improved the mechanical properties of the PLA matrix. Differential scanning calorimetry (DSC) was used to investigate the non-isothermal crystallization kinetics. The Avrami equation modified by the Jeziorny, Ozawa and Mo equations was used to analyze the non-isothermal crystallization kinetics of PLA and its blends. Analysis of the crystallization halftime of non-isothermal conditions indicated that the overall rate of crystallization increased significantly at 1 wt% content of CNC. This seemed to result from the increase of nucleation density and the acceleration of segment movement in the presence of the CNC component. This phenomenon was verified by polarizing microscope observation.
ABSTRACT
In this manuscript, the durability of the E-glass/epoxy composite was determined under a seawater environment. The effect of harsh environment was investigated in terms of seawater absorption, microstructure and degradation in mechanical properties. E-glass epoxy composite specimens were conditioned in gulf seawater at 23 °C, 65 °C and 90 °C for the period of 12 months. It was observed that the mass of the samples increased after the immersion of 12 months at 23 °C and 65 °C whereas it reduced at 90 °C. The salt deposition was observed at the surface of specimens without any crack for the seawater conditioning at 23 °C and 65 °C. The swelling and crack formation were significantly visible on the surface of the specimen immersed for 12 months at 90 °C. It indicates that the degradation mechanism accelerated at elevated temperature results fiber/matrix debonding. The tensile test indicates slight variation in the elastic modulus and reduction in strength of E-glass epoxy composite by 1% and 9% for specimens immersed at 23 °C and 65 °C respectively. However, at 90 °C, the tensile strength sharply decreased to 7% and elastic modulus significantly increased in the exposure of 12 months. A prediction approach based on a time-shift factor (TSF) was used. This model predicted that the strength retention of E-glass/Epoxy composite will be reduced to 7% in 450 years after immersion in seawater at 23 °C. Lastly, the activation energy for the degradation of the composite was calculated.
ABSTRACT
A new cyanate ester resin-based composite with higher toughness and thermal conductivity was developed. First, a poly(n-butyl acrylate)/poly(methyl methacrylate-co-acrylamide) (PBMAM) core-shell structured latex was prepared by seeded emulsion polymerization. Second, hexagonal boron nitride (h-BN) particles were modified by a surface coupling agent, 3-(2-amino ethyl amino)propyl trioxysilane, to improve the dispersion in cyanate ester resin (BADCy). Third, PBMAM and the modified boron nitride were mixed with BADCy resin to increase mechanical properties and thermal conductivity. The monomer conversion in the emulsion polymerization process of the PBMAM was monitored by determining the solid content. Its particle size was characterized by dynamic laser scattering, and the morphology of the particles was characterized using scanning and transmission electron microscopes. The modified boron nitride (ABN) was verified by FTIR and TGA measurements. The mechanical properties and thermal conductivity of the BADCy/PBMAM/ABN composites were determined at various BN contents. Results showed that the unnotched impact strength of the composite increased by 151% and the thermal conductivity increased by 85% at a PBMAM content of 5 wt% and ABN content of 6 wt%. With the enhanced properties and ease of fabrication, the developed composites have good potential for application in high-end industries such as microelectronic packaging.
ABSTRACT
A new epoxy-based composite with higher toughness and thermal conductivity was developed. First, a poly(n-butyl acrylate)/poly(methyl methacrylate-co-glycidyl methacrylate) (PBMG) core-shell structured latex was prepared by seeded emulsion polymerization to toughen the epoxy resin (EP). Second, boron nitride particles were modified into nano-scale sheets and added to the epoxy/PBMG blend to improve the thermal conductivity of the resulting composite material. The properties of the constituent materials were determined prior to fabrication and testing of the composite product. The monomer conversion in the emulsion polymerization process of the PBMG was checked by determining the solid particle content. The PBMG particle size was characterized by dynamic laser scattering, and the morphology of the particles was characterized by scanning and transmission electron microscopy. The exfoliation of the modified boron nitride (MBN) flakes was verified by TEM and Raman microscopy. The mechanical properties and the thermal conductivity of the EP/PBMG/MBN composite were determined at various constituent contents. Results showed that the unnotched impact strength of the composite increased by 147%, the flexural strength increased by 49.1%, and the thermal conductivity increased by 98% compared with pristine EP at a PBMG content of 5 wt% and MBN content of 7 wt%. With the enhanced properties and ease of fabrication, the developed composite has good potential for application in high-end industries such as microelectronics packaging.
