ABSTRACT
This study presents a novel three-dimensional (3D) printable gallium-carbon black-styrene isoprene styrene block copolymer (Ga-CB-SIS), offering a versatile solution for the rapid fabrication of stretchable and integrated sensor-heater-battery systems in wearable and recyclable electronics. The composite exhibits sinter-free characteristics, allowing for printing on various substrates, including heat-sensitive materials. Unlike traditional conductive inks, the Ga-CB-SIS composite, composed of gallium, carbon black, and styrene isoprene block copolymers, combines electrical conductivity, stretchability, and digital printability. By introducing carbon black as a filler material, the composite achieves promising electromechanical behavior, making it suitable for low-resistance heaters, batteries, and electrical interconnects. The fabrication process involves a simultaneous mixing and ball-milling technique, resulting in a homogeneous composition with a CB/Ga ratio of 4.3%. The Ga-CB-SIS composite showcases remarkable adaptability for digital printing on various substrates. Its self-healing property and efficient recycling technique using a deep eutectic solvent contribute to an environmentally conscious approach to electronic waste, with a high gallium recovery efficiency of â¼98%. The study's innovation extends to applications, presenting a fully digitally printed stretchable Ga-CB-SIS battery integrated with strain sensors and heaters, representing a significant leap in LM-based composites. This multifunctional and sustainable Ga-CB-SIS composite emerges as a key player in the future of wearable electronics, offering integrated circuits with sensing, heating, and energy storage elements.
ABSTRACT
E-waste is rapidly turning into another man-made disaster. It is proposed that a paradigm shift toward a more sustainable future can be made through soft-matter electronics that are resilient, repairable if damaged, and recyclable (3R), provided that they achieve the same level of maturity as industrial electronics. This includes high-resolution patterning, multilayer implementation, microchip integration, and automated fabrication. Herein, a novel architecture of materials and methods for microchip-integrated condensed soft-matter 3R electronics is demonstrated. The 3R function is enabled by a biphasic liquid metal-based composite, a block copolymer with nonpermanent physical crosslinks, and an electrochemical technique for material recycling. In addition, an autonomous laser-patterning method for scalable circuit patterning with an exceptional resolution of <30 µm in seconds is developed. The phase-shifting property of the BCPs is utilized for vapor-assisted "soldering" circuit repairing and recycling. The process is performed entirely at room temperature, thereby opening the door for a wide range of heat-sensitive and biodegradable polymers for the next generation of green electronics. The implementation and recycling of sophisticated skin-mounted patches with embedded sensors, electrodes, antennas, and microchips that build a digital fingerprint of the human electrophysiological signals is demonstrated by collecting mechanical, electrical, optical, and thermal data from the epidermis.
Subject(s)
Wearable Electronic Devices , Electrodes , Electronics , Humans , Metals , Polymers/chemistryABSTRACT
We tackle two well-known problems in the fabrication of stretchable electronics: interfacing soft circuit wiring with silicon chips and fabrication of multi-layer circuits. We demonstrate techniques that allow integration of embedded flexible printed circuit boards (FPCBs) populated with microelectronics into soft circuits composed of liquid metal (LM) interconnects. These methods utilize vertical interconnect accesses (VIAs) that are produced by filling LM alloy into cavities formed by laser ablation. The introduced technique is versatile, easy to perform, clean-room free, and results in reliable multi-layer stretchable hybrid circuits that can withstand over 80% of strain. We characterize the fabrication parameters of such VIAs and demonstrated several applications, including a stretchable touchpad and pressure detection film, and an all-integrated multi-layer electromyography (EMG) circuit patch with five active layers including acquisition electrodes, on-board processing and Bluetooth communication modules.
ABSTRACT
Coating inkjet-printed traces of silver nanoparticle (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity by six-orders of magnitude and significantly improves tolerance to tensile strain. This enhancement is achieved through a room-temperature "sintering" process in which the liquid-phase EGaIn alloy binds the AgNP particles (≈100 nm diameter) to form a continuous conductive trace. Ultrathin and hydrographically transferrable electronics are produced by printing traces with a composition of AgNP-Ga-In on a 5 µm-thick temporary tattoo paper. The printed circuit is flexible enough to remain functional when deformed and can support strains above 80% with modest electromechanical coupling (gauge factor ≈1). These mechanically robust thin-film circuits are well suited for transfer to highly curved and nondevelopable 3D surfaces as well as skin and other soft deformable substrates. In contrast to other stretchable tattoo-like electronics, the low-cost processing steps introduced here eliminate the need for cleanroom fabrication and instead requires only a commercial desktop printer. Most significantly, it enables functionalities like "electronic tattoos" and 3D hydrographic transfer that have not been previously reported with EGaIn or EGaIn-based biphasic electronics.
