Characterization of chemical speciation in ultrathin uranium oxide layered films.

A unique approach to detect chemical speciation and distribution on nanometer-scale nuclear materials has been achieved by the combination of neutron reflectometry and shell-isolated surface-enhanced Raman spectroscopy. Both surface and underlying layers of the uranium oxide materials were determined with angstrom-level resolution. Our results reveal that the UO(x) film is composed of three sublayers: an ∼38 Å thick layer of U(3)O(8) formed along the UO(x)/substrate interface; the adjacent sublayer consists of an ∼900 Å thick single phase of α-UO(3), and the top layer is γ-UO(3) with a thickness of ∼115 Å.

Reactive gas magnetron sputtering of lithium hydride and lithium fluoride thin films.

We report the preparation and structural characterization of lithium hydride and lithium fluoride thin films. These materials, due to their low absorption in the soft x-ray range, may have a role as spacer layers in multilayer mirrors. Theoretical reflection calculations suggest that an epitaxial crystalline multilayer stack of a nitride and a lithium compound spacer layer could produce respectable reflectance for short soft x-ray wavelengths (λ < 10 nm). Lithium targets were magnetron sputtered in the presence of hydrogen or ammonia to prepare the LiH films and nitrogen trifluoride to prepare the LiF films. The films were deposited on room temperature Si (100) or MgO (100) substrates. A near IR-Visible-UV spectrometer indicated a drop in reflectance at ~250 nm for a 100-nm-thick LiH film. This corresponds to a 5-eV band gap (characteristic of LiH). UV fluorescence indicated characteristic LiH defect bands at 2.5, 3.5, and 4.4 eV. The UV fluorescence characterization also indicated a possible lithium oxide (Li2O) contamination peak at 3.1 eV in some of our thin films. Film surface morphology, examined by scanning electron microscopy, appeared extremely rough. The roughness size varied with reactive gas pressure and the type of substrate surface. A LiH/MoN multilayer was constructed, but no significant d spacing peak was seen in a low angle CuKα XRD scan. It is believed that the roughness of the LiH film prevented smooth, uniform planar growth of the multilayer stack. Possible reasons of rough growth are briefly discussed.

The Structure of W/C (0.15 < γ < 0.8) Multilayers Annealed in Argon or Air.

We report the effect that thermal annealing in inert and oxidizing atmospheres, and with and without encapsulating layers, has on the structure of tungsten/carbon [W/C] multilayer thin films. This study focuses on the tungsten component and deals mainly with multilayers where the ratio of thickness of tungsten layers is equal to or greater than for the carbon layers (that is, γ ≤ 0.5). This is in contrast to prior studies where the tungsten layer thickness was generally held constant and the carbon layer was varied. Thermal annealing in inert atmospheres produces reactions and other structural changes in the tungsten and carbide layers which depend on the as-deposited multilayer structure which depends, in turn, on the thickness of the tungsten layer. In samples where both the tungsten and carbide fractions of the multilayer are completely amorphous as deposited, which is the case for thin tungsten layers (thickness of tungsten (tw) < 4 nm/period), the reactions in the tungsten layer forming crystalline tungsten and tungsten carbide occur at annealing temperatures above 900°C. The layer pair spacing, or period, (d), in this group shows an expansion of up to 10-15% of the original value as has been reported in the past. Changes in both the tungsten and carbide layers, and their interfaces, contribute to changes in d spacing and relative thickness of the high and low Z components. When the tungsten layer thickness exceeds 4 nm per period the tungsten is partially crystallized in as-prepared samples. In such multilayers interfacial reactions, producing an oriented partially crystalline W2C/C superlattice, occur at temperatures of 600°C and below. The fact that W2C crystallites in one period can form a structure which is correlated to W2C crystallites in neighboring layers is somewhat surprising, since layers are presumably still separated by amorphous carbon which is still visible via Raman. The expansion of the layer pair spacing is relatively small (<5%) in this group and, more importantly, mostly involves increases in the thickness of the high Z components. Samples annealed in air at temperatures below 300°C are progressively destroyed by the oxidation of both tungsten and carbide layers. Encapsulation of similar multilayers with a thin (30 nm) dielectric layer of any of several types can retard oxidation to 600°C. The silicon-containing encapsulants generally perform better. Failure at this temperature is seen to occur from pinhole formation.

Raman spectroscopic analysis of mo/si multilayers.

Raman spectra are reported from MoSi2 polycrystalline powder and soft x-ray Mo/Si multilayers. The sharp lines at 323 and 438 cm-1 are all due to crystalline MoSi2. These lines in the powder sample intensify with annealing. The Raman spectra of as-deposited multilayers shows a broad asymmetric peak, highest at about 480 cm-1. We attribute this to α-Si which is highly disordered. In contrast to α-Si in semiconductor/semiconductor and semiconductor/dielectric multilayers, in the Mo/Si samples the Raman signal can vanish after modest heating. This provides evidence that the composition of the silicon component of the multilayer changes even with 200°C annealing. Further annealing also produces the signature for crystalline MoSi2 in the multilayer samples. This is the first report of the characterization of Mo/Si soft x-ray multilayers by Raman spectroscopy, and it indicates that Raman spectroscopy may be an effective technique for characterizing these soft x-ray multilayers and may be useful in studying their interfaces.