ABSTRACT
The emergence of defects during the early production phases of ferrous-alloy additively manufactured (AM) parts poses a serious threat to their versatility and adversely impacts their overall mechanical performance in industries ranging from aerospace engineering to medicine. Lack of fusion and gas entrapment during the manufacturing stages leads to increased surface roughness and porosities in the finished part. In this study, the efficacy of employing electroless nickel-boron (Ni-B) deposition to fill and level simulated AM defects was evaluated. The approach to levelling was inspired by the electrochemical deposition techniques used to fill vias in the electronics industry that (to some extent) resemble the size and shape of AM-type defects. This work investigated the use of surfactants to attenuate surface roughness in electroless nickel coatings, thereby achieving the preferential inhibition of the coating thickness on the surface and promoting the filling of the simulated defects. A cationic surfactant molecule, CTAB (cetyltrimethyl ammonium bromide), and a nonpolar surfactant, PEG (polyethylene glycol), at different concentrations were tested using a Ni-B electrolyte for the levelling study. It was found that the use of electroless Ni-B to fill simulated defects on ferrous alloys was strongly influenced by the concentration and nature of the surfactant. The highest levelling percentages were obtained for the heavy-molecular-weight PEG-mediated coatings at 1.2 g/L. The results suggest that electroless Ni-B deposition could be a novel and facile approach to filling defects in ferrous-based AM parts.
ABSTRACT
The electroless copper plating of textiles, which have been previously printed with a catalyst, is a promising method to selectively metallise them to produce high-reliability e-textiles, sensors and wearable electronics with wide-ranging applications in high-value sectors such as healthcare, sport, and the military. In this study, polyester textiles were ink-jet printed using differing numbers of printing cycles and printing directions with a functionalised copper-silver nanoparticle catalyst, followed by electroless copper plating. The catalyst was characterised using Transmission Electron Microscopy (TEM) and Ultraviolet/Visible (UV/Vis) spectroscopy. The electroless copper coatings were characterised by copper mass gain, visual appearance and electrical resistance in addition to their morphology and the plating coverage of the fibres using Scanning Electron Microscopy (SEM). Stiffness, laundering durability and colour fastness of the textiles were also analysed using a stiffness tester and Launder Ometer, respectively. The results indicated that in order to provide a metallised pattern with the desired conductivity, stiffness and laundering durability for e-textiles, the printing design, printing direction and the number of printing cycles of the catalyst should be carefully optimised considering the textile's structure. Achieving a highly conductive complete copper coating, together with an almost identical and sufficiently low stiffness on both sides of the textile can be considered as useful indicators to judge the suitability of the process.
