High-resolution electrohydrodynamic inkjet printing of stretchable metal oxide semiconductor transistors with high performance.

As demands for high pixel densities and wearable forms of displays increase, high-resolution printing technologies to achieve high performance transistors beyond current amorphous silicon levels and to allow low-temperature solution processability for plastic substrates have been explored as key processes in emerging flexible electronics. This study describes electrohydrodynamic inkjet (e-jet) technology for direct printing of oxide semiconductor thin film transistors (TFTs) with high resolution (minimum line width: 2 µm) and superb performance, including high mobility (∼230 cm2 V-1 s-1). Logic operations of the amplifier circuits composed of these e-jet-printed metal oxide semiconductor (MOS) TFTs demonstrate their high performance. Printed In2O TFTs with e-jet printing-assisted high-resolution S/D electrodes were prepared, and the direct printing of passivation layers on these channels enhanced their gate-bias stabilities significantly. Moreover, low process temperatures (<250 °C) enable the use of thin plastic substrates; highly flexible and stretchable TFT arrays have been demonstrated, suggesting promise for next-generation printed electronics.

Titanium oxide film for the bottom antireflective layer in deep ultraviolet lithography.

Titanium oxide thin film, fabricated with tetraisopropyltitanate and oxygen by electron cyclotron resonance-plasma-enhanced chemical vapor deposition, is investigated as a potential candidate for the antireflective layer in KrF excimer laser (248-nm) lithography. The oxygen flow-rate dependence of the optical properties such as the refractive index (n) and the extinction coefficient (k) of the film at the 248-nm wavelength has been characterized, and the films with the expected combinations of n and k values for the antireflective layer have been deposited. Simulation results indicate that reflectance values of less than 4% and as low as 1.2% can be reached at the interface between the photoresist and the film postulating the structures of the photoresist/300-A TiO(x) film/c-Si substrate and the W-Si substrate, respectively, by selected proper combinations of n and k values. Moreover the reflectance can be further reduced to almost zero by changing the film thickness. Thus it is found that titanium oxide thin films can be used as the bottom antireflective layer in KrF excimer laser lithography.