ABSTRACT
The design, fabrication and functional evaluation of the radio-frequency dielectric heating of liquids in an LTCC-based ceramic microfluidic system are described and discussed. The device, which relies on the dielectric heating of liquids, was fabricated using a low temperature co-fired ceramic (LTCC) technology. A multilayered ceramic structure with integrated electrodes, buried channels and cavities in micro and millimetre scales was fabricated. The structure with the dimensions of 35 mm × 22 mm × 2.4 mm includes a buried cavity with a diameter of 17.3 mm and a volume of 0.3 mL. The top and bottom faces of the cavity consist of silver/palladium electrodes protected with 100 µm thick layers of LTCC. The power, used to heat a polar liquid (water) in the cavity with the volume of 0.3 mL, ranges from 5 to 40 W. This novel application of RF dielectric heating could enable the miniaturization of microfluidic systems in many applications. The working principle of such a device and its efficiency are demonstrated using water as the heated medium.
ABSTRACT
Piezoelectric ceramic resonant pressure sensors have shown potential as sensing elements for harsh environments, such as elevated temperatures. For operating temperatures exceeding ~250 °C, conventional and widely used Pb(Zr,Ti)O3 (PZT) piezoelectrics should be replaced. Here, a ceramic pressure sensor from low-temperature co-fired ceramics (LTCC) was constructed by integrating a piezoelectric actuator made from bismuth ferrite (BiFeO3) on a diaphragm. This ferroelectric material was selected because of its high Curie temperature (TC = 825 °C) and as a lead-free piezoelectric extensively investigated for high-temperature applications. In order to construct a sensor with suitable pressure sensitivity, numerical simulations were used to define the optimum construction dimensions. The functionality of the pressure sensor was tested up to 201 °C. The measurements confirmed a pressure sensitivity, i.e., resonance frequency shift of the sensor per unit of pressure, of -8.7 Hz/kPa up to 171 °C. It was suggested that the main reason for the hindered operation at the elevated temperatures could lie in the thermo-mechanical properties of the diaphragm and the adhesive bonding at the actuator-diaphragm interconnection.
ABSTRACT
An exploratory study of the impact of housing on the characteristics of a low-temperature co-fired ceramic (LTCC) pressure sensor is presented. The ceramic sensor structure is sealed in a plastic housing. This may have non-negligible effect on the final characteristics and should be considered in the early design phase. The manufacturability issue mainly concerning the selection of available housing and the most appropriate materials was considered with respect to different requirements for low and high pressure ranges of operation. Numerical predictions showed the trends and helped reveal the critical design parameters. Proper selection of the adhesive material remains an essential issue. Curing of the epoxy adhesive may introduce non-negligible residual stresses, which considerably influence the sensor's characteristics.
ABSTRACT
This paper presents the design of a wireless pressure-monitoring system for harsh-environment applications. Two types of ceramic pressure sensors made with a low-temperature cofired ceramic (LTCC) were considered. The first type is a piezoresistive strain gauge pressure sensor. The second type is a capacitive pressure sensor, which is based on changes of the capacitance values between two electrodes: one electrode is fixed and the other is movable under an applied pressure. The design was primarily focused on low power consumption. Reliable operation in the presence of disturbances, like electromagnetic interference, parasitic capacitances, etc., proved to be contradictory constraints. A piezoresistive ceramic pressure sensor with a high bridge impedance was chosen for use in a wireless pressure-monitoring system and an acceptable solution using energy-harvesting techniques has been achieved. The described solution allows for the integration of a sensor element with an energy harvester that has a printed thick-film battery and complete electronics in a single substrate packaged inside a compact housing.
