Luminescent Surfaces with Tailored Angular Emission for Compact Dark-Field Imaging Devices.

Dark-field microscopy is a standard imaging technique widely employed in biology that provides high image contrast for a broad range of unstained specimens1. Unlike bright-field microscopy, it accentuates high spatial frequencies and can therefore be used to emphasize and resolve small features. However, the use of dark-field microscopy for reliable analysis of blood cells, bacteria, algae, and other marine organisms often requires specialized, bulky microscope systems, and expensive additional components, such as dark-field-compatible objectives or condensers2,3. Here, we propose to simplify and downsize dark-field microscopy equipment by generating the high-angle illumination cone required for dark field microscopy directly within the sample substrate. We introduce a luminescent photonic substrate with a controlled angular emission profile and demonstrate its ability to generate high-contrast dark-field images of micrometre-sized living organisms using standard optical microscopy equipment. This new type of substrate forms the basis for miniaturized lab-on-chip dark-field imaging devices, compatible with simple and compact light microscopes.

A New Approach for Microfabrication of Printed Circuit Boards with Ultrafine Traces.

The advances in micro/nanofabrication techniques have enabled miniaturization of printed circuit boards (PCBs) for various applications such as portable devices, smart sensors, and IoTs, to name a few. PCBs provide electrical connectivity between the components as well as mechanical support. Down-scaling of PCBs is crucial for miniaturization of large systems and devices. Currently, microtraces down to 25 µm can be microfabricated with the current microfabrication processes at an industrial scale. In the present work, we report a new approach for microfabrication of PCBs with trace widths down to 3 µm on commercially available PCB substrates. We used electroplating/electroetching, sputtering, and photolithography to achieve these fine trace sizes. The proposed fabrication technique can be used in microelectronics, system on chip, MEMS, and miniaturized circuits and systems in general.

A robust nanoscale experimental quantification of fracture energy in a bilayer material system.

Accurate measurement of interfacial properties is critical any time two materials are bonded--in composites, tooth crowns, or when biomaterials are attached to the human body. Yet, in spite of this importance, reliable methods to measure interfacial properties between dissimilar materials remain elusive. Here we present an experimental approach to quantify the interfacial fracture energy Γi that also provides unique mechanistic insight into the interfacial debonding mechanism at the nanoscale. This approach involves deposition of an additional chromium layer (superlayer) onto a bonded system, where interface debonding is initiated by the residual tensile stress in the superlayer, and where the interface can be separated in a controlled manner and captured in situ. Contrary to earlier methods, our approach allows the entire bonded system to remain in an elastic range during the debonding process, such that Γi can be measured accurately. We validate the method by showing that moisture has a degrading effect on the bonding between epoxy and silica, a technologically important interface. Combining in situ through scanning electron microscope images with molecular simulation, we find that the interfacial debonding mechanism is hierarchical in nature, which is initiated by the detachment of polymer chains, and that the three-dimensional covalent network of the epoxy-based polymer may directly influence water accumulation, leading to the reduction of Γi under presence of moisture. The results may enable us to design more durable concrete composites that could be used to innovate transportation systems, create more durable buildings and bridges, and build resilient infrastructure.