ABSTRACT
Single-crystal Al nanowires (NWs) were fabricated by thermally induced substitution of vapor-liquid-solid grown Ge NWs by Al. The resistivity of the crystalline Al (c-Al) NWs was determined to be ρ = (131 ± 27) × 10(-9) Ω m, i.e. approximately five times higher than for bulk Al, but they withstand remarkably high current densities of up to 1.78 × 10(12) A m(-2) before they ultimately melt due to Joule heating. The maximum current density before failure correlates with the NW diameter, with thinner NWs tolerating significantly higher current densities due to efficient heat dissipation and the reduced lattice heating in structures smaller than the electron-phonon scattering length. The outstanding current-carrying capacity of the c-Al NWs clearly exceeds those of common conductors and surpasses requirements for metallization of future high-performance devices. The linear temperature coefficient of the resistance of c-Al NWs appeared to be lower than for bulk Al and a transition to a superconducting state in c-Al NWs was observed at a temperature of 1.46 K.
ABSTRACT
Electrostatically tunable negative differential resistance (NDR) is demonstrated in monolithic metal-semiconductor-metal (Al-Ge-Al) nanowire (NW) heterostructures integrated in back-gated field-effect transistors (FETs). Unambiguous signatures of NDR even at room temperature are attributed to intervalley electron transfer. At yet higher electric fields, impact ionization leads to an exponential increase of the current in the ⟨111⟩ oriented Ge NW segments. Modulation of the transfer rates, manifested as a large tunability of the peak-to-valley ratio (PVR) and the onset of impact ionization is achieved by the combined influences of electrostatic gating, geometric confinement, and heterojunction shape on hot electron transfer and by electron-electron scattering rates that can be altered by varying the charge carrier concentration in the NW FETs.
