Carbon nanotube embedded adhesives for real-time monitoring of adhesion failure in high performance adhesively bonded joints.

Carbon nanotubes (CNTs) embedded polymers are of increasing interest to scientific and industrial communities for multi-functional applications. In this article, CNTs have been introduced to high-strength epoxy adhesive for enabling in-situ strain sensing in adhesively bonded aluminium-to-aluminium single-lap joints to accurately indicate the onset and propagation of adhesion failure to the evolution of piezo-resistivity in varying mechanical loads. The CNT modified adhesive in bonded joints and the CNT modified adhesive alone have been tested under monothonic and cyclic tensile loads up to ultimate failure. The changes in the piezo-resistivity induced by the CNTs have been monitored in situ with respect to loading. A novel interpretation method has been developed for progressive, instantaneous adhesion failure estimation under cyclic tensile stresses from a resistivity baseline. The method indicates that the in-situ resistivity changes and the rate of the changes with strain, i.e. sensitivity, strongly correlate with the adhesion failure progression, irrespective of the CNT dispersion quality. Moreover, the effect of bond thickness on the evolution of piezo-resistivity and adhesion failure have been studied. It was observed that relatively thin adhesive bonds (0.18 mm thickness), possessing higher CNT contact points than thick bonds (0.43 mm thickness), provide 100 times higher sensitivity to varying cyclic loads.

Carbon nanotube functionalization as a route to enhancing the electrical and mechanical properties of Cu-CNT composites.

Copper-CNT (carbon nanotube) composite materials are promising alternatives to conventional conductors in applications ranging from interconnects in microelectronics to electrical cabling in aircraft and vehicles. Unfortunately, exploiting the full potential of these composites is difficult due to the poor Cu-CNT electro-mechanical interface. We demonstrate through large-scale ab initio calculations and sonication experiments that this problem can be addressed by CNT surface modification. Our calculations show that covalent functionalization of CNTs below 6.7 at% significantly improves Cu-CNT wetting and the mechanical properties of the composite. Oxidative pre-treatment of CNTs enhances the Young's modulus of the composite by nearly a factor 3 above that of pure Cu, whereas amination slightly improves the electrical current density with respect to the unmodified Cu-CNT system in the high bias regime. However, only nitrogen doping can effectively improve both the mechanical and electrical properties of the composite. As the experiments show, consistent with the calculations, substitutional doping with nitrogen effectively improves adhesion of the CNT to the Cu matrix. We also predict an improvement in the mechanical properties for the composite containing doped double-wall CNTs. Moreover, the calculations indicate that the presence of nitrogen dopants almost doubles locally the transmission through the nanotube and reduces the back scattering in the Cu matrix around the CNT. The computed electrical conductance of N-doped Cu-CNT "carpets" exceeds that of an undoped system by ∼160%.

Breaking the electrical barrier between copper and carbon nanotubes.

Improving the interface between copper and carbon nanotubes (CNTs) offers a straightforward strategy for the effective manufacturing and utilisation of Cu-CNT composite material that could be used in various industries including microelectronics, aerospace and transportation. Motivated by a combination of structural and electrical measurements on Cu-M-CNT bimetal systems (M = Ni, Cr) we show, using first principles calculations, that the conductance of this composite can exceed that of a pure Cu-CNT system and that the current density can even reach 1011 A cm-2. The results show that the proper choice of alloying element (M) and type of contact facilitate the fabrication of ultra-conductive Cu-M-CNT systems by creating a favourable interface geometry, increasing the interface electronic density of states and reducing the contact resistance. In particular, a small concentration of Ni between the Cu matrix and the CNT using either an "end contact" and or a "dot contact" can significantly improve the electrical performance of the composite. Furthermore the predicted conductance of Ni-doped Cu-CNT "carpets" exceeds that of an undoped system by ∼200%. Cr is shown to improve CNT integration and composite conductance over a wide temperature range while Al, at low voltages, can enhance the conductance beyond that of Cr.

Soldering of Carbon Materials Using Transition Metal Rich Alloys.

Joining of carbon materials via soldering has not been possible up to now due to lack of wetting of carbons by metals at standard soldering temperatures. This issue has been a severely restricting factor for many potential electrical/electronic and mechanical applications of nanostructured and conventional carbon materials. Here we demonstrate the formation of alloys that enable soldering of these structures. By addition of several percent (2.5-5%) of transition metal such as chromium or nickel to a standard lead-free soldering tin based alloy we obtained a solder that can be applied using a commercial soldering iron at typical soldering temperatures of approximately 350 °C and at ambient conditions. The use of this solder enables the formation of mechanically strong and electrically conductive joints between carbon materials and, when supported by a simple two-step technique, can successfully bond carbon structures to any metal terminal. It has been shown using optical and scanning electron microscope images as well as X-ray diffraction patterns and energy dispersive X-ray mapping that the successful formation of carbon-solder bonds is possible, first, thanks to the uniform nonreactive dispersion of transition metals in the tin-based matrix. Further, during the soldering process, these free elements diffuse into the carbon-alloy border with no formation of brazing-like carbides, which would damage the surface of the carbon materials.