Flexible polyimide films hybrid with functionalized boron nitride and graphene oxide simultaneously to improve thermal conduction and dimensional stability.

Coupling agent-functionalized boron nitride (f-BN) and glycidyl methacrylate-grafted graphene (g-TrG) are simultaneously blended with polyimide (PI) to fabricate a flexible, electrically insulating and thermally conductive PI composite film. The silk-like g-TrG successfully fills in the gap between PI and f-BN to complete the thermal conduction network. In addition, the strong interaction between surface functional groups on f-BN and g-TrG contributes to the effective phonon transfer in the PI matrix. The thermal conductivity (TC) of the PI/f-BN composite films containing additional 1 wt % of g-TrG is at least doubled to the value of PI/f-BN and as high as 16 times to that of the pure PI. The hybrid film PI/f-BN-50/g-TrG-1 exhibits excellent flexibility, sufficient insulating property, the highest TC of 2.11 W/mK, and ultralow coefficient of thermal expansion of 11 ppm/K, which are perfect conditions for future flexible substrate materials requiring efficient heat dissipation.

Thermally conductive and electrically insulating epoxy nanocomposites with thermally reduced graphene oxide-silica hybrid nanosheets.

We herein report on the preparation of epoxy nanocomposites, which had enhanced thermal conductivities but were still electrical insulators, incorporating hybrid nanosheets (NSs) with sandwich structures composed of thermally reduced graphene oxide (TRGO) and silica. The silica layer covered the surface of the TRGO, hindering electrical conduction and effectively forming a 3D phonon transport channel that had a unique effect on the electrical and thermal properties of the epoxy matrix. A 1 wt% TRGO-silica NS epoxy nanocomposite maintained an electrical resistivity of 2.96 × 10(11)Ω cm, and its thermal conductivity was 0.322 W m(-1) K(-1), which is 61% higher than the conductivity of an epoxy nanocomposite without TRGO-silica NSs (0.2 W m(-1) K(-1)).