Micromechanical origin of heat transfer to granular flow.

Heat transfer across a granular flow is comprised of two resistances in series : near the wall and within the bulk particle bed, neither of which is well understood due to the lack of experimental probes to separate their respective contribution. Here, we use a frequency modulated photothermal technique to separately quantify the thermal resistances in the near-wall and the bulk bed regions of particles in flowing states. Compared to the stationary state, the flowing leads to a higher near-wall resistance and a lower thermal conductivity of bulk beds. Coupled with discrete element method simulation, we show that the near-wall resistance can be explained by particle diffusion in granular flows.

Ceramic-to-metal bonding using rare-earth containing Sn-Bi solder.

With the increasing miniaturization and power of optoelectronic devices, direct bonding of optical substrates like semiconductors and ceramics to metal heat sinks using low melting-point solder has gained significant interest. In this study, we demonstrated the bonding of glass to copper using Sn-58 wt% Bi solder (SB solder) doped with a small amount of rare earth (RE) elements. The RE elements act as active agents that facilitate the bonding to glasses without glass metallization. By optimizing the bonding parameters, such as reflow temperature and time, and employing an inert gas atmosphere to prevent solder or RE oxidation, we successfully achieved the highest shear strength in glass-copper solder joints using SB-RE solder, without the need for ultrasonic-assisted soldering (UAS). These results demonstrate the potential of using RE-containing solder for bonding unmetallized glass and ceramics in optoelectronic devices with metals at low soldering temperatures (< 200 °C). Furthermore, analysis of the shear strength and failure morphology of solder joints revealed only small degradation, primarily originating from the bulk solder region rather than the solder-glass interface, after both thermal aging (100 h) and cycling tests (100 cycles). The establishment of low-melting point RE-containing solders opens the possibility of direct jointing ceramic optoelectronic substrates to metal heat sinks for more efficient heat dissipation. In the meantime, our work also suggests that further optimization studies are necessary to explore its performance under more extreme working conditions.