Surface Defect Mitigation of Additively Manufactured Parts Using Surfactant-Mediated Electroless Nickel Coatings.

The emergence of defects during the early production phases of ferrous-alloy additively manufactured (AM) parts poses a serious threat to their versatility and adversely impacts their overall mechanical performance in industries ranging from aerospace engineering to medicine. Lack of fusion and gas entrapment during the manufacturing stages leads to increased surface roughness and porosities in the finished part. In this study, the efficacy of employing electroless nickel-boron (Ni-B) deposition to fill and level simulated AM defects was evaluated. The approach to levelling was inspired by the electrochemical deposition techniques used to fill vias in the electronics industry that (to some extent) resemble the size and shape of AM-type defects. This work investigated the use of surfactants to attenuate surface roughness in electroless nickel coatings, thereby achieving the preferential inhibition of the coating thickness on the surface and promoting the filling of the simulated defects. A cationic surfactant molecule, CTAB (cetyltrimethyl ammonium bromide), and a nonpolar surfactant, PEG (polyethylene glycol), at different concentrations were tested using a Ni-B electrolyte for the levelling study. It was found that the use of electroless Ni-B to fill simulated defects on ferrous alloys was strongly influenced by the concentration and nature of the surfactant. The highest levelling percentages were obtained for the heavy-molecular-weight PEG-mediated coatings at 1.2 g/L. The results suggest that electroless Ni-B deposition could be a novel and facile approach to filling defects in ferrous-based AM parts.

Using fish scales as a new biosorbent for adsorption of nickel and copper ions from wastewater and investigating the effects of electric and magnetic fields on the adsorption process.

In this study, fish scales (Pomadasys kaakan's scales) were used as new biosorbent for removing Ni2+ and Cu2+ ions from wastewater. The effects of electric and magnetic fields on the absorption efficiency were also investigated. The effects of sorbent content, ion concentration, contact time, pH, electric field (EF), and magnetic field (MF) on absorption efficiency were assertained. In addition, the isotherm of absorption was studied in this work. This study revealed that electric field and magnetic field have significant effects on the absorption efficiency of ions from wastewater. An increase in the electric field enhanced the removal percentage of the ions and accelerated the absorption process by up to 40% in comparison with the same condition without an electric field or a magnetic field. By increasing contact time from 10 to 120 min, the removal of Ni2+ ions was increased from 1% to 40% and for Cu2+ ions, the removal increased from 20% to almost 95%, respectively. In addition, increasing pH, ion concentration and scales dose increased removal percentage effectively. The results indicated that using fish scales for Cu2+ ions absorption is ideal due to the very high removal percentage (approximately 95%) without using either an electric or magnetic field.

Selective Electroless Copper Plating of Ink-Jet Printed Textiles Using a Copper-Silver Nanoparticle Catalyst.

The electroless copper plating of textiles, which have been previously printed with a catalyst, is a promising method to selectively metallise them to produce high-reliability e-textiles, sensors and wearable electronics with wide-ranging applications in high-value sectors such as healthcare, sport, and the military. In this study, polyester textiles were ink-jet printed using differing numbers of printing cycles and printing directions with a functionalised copper-silver nanoparticle catalyst, followed by electroless copper plating. The catalyst was characterised using Transmission Electron Microscopy (TEM) and Ultraviolet/Visible (UV/Vis) spectroscopy. The electroless copper coatings were characterised by copper mass gain, visual appearance and electrical resistance in addition to their morphology and the plating coverage of the fibres using Scanning Electron Microscopy (SEM). Stiffness, laundering durability and colour fastness of the textiles were also analysed using a stiffness tester and Launder Ometer, respectively. The results indicated that in order to provide a metallised pattern with the desired conductivity, stiffness and laundering durability for e-textiles, the printing design, printing direction and the number of printing cycles of the catalyst should be carefully optimised considering the textile's structure. Achieving a highly conductive complete copper coating, together with an almost identical and sufficiently low stiffness on both sides of the textile can be considered as useful indicators to judge the suitability of the process.

Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation.

This paper describes the ultrasound assisted dispersal of a low wt./vol.% copper nanopowder mixture and determines the optimum conditions for de-agglomeration. A commercially available powder was added to propan-2-ol and dispersed using a magnetic stirrer, a high frequency 850 kHz ultrasonic cell, a standard 40 kHz bath and a 20 kHz ultrasonic probe. The particle size of the powder was characterized using dynamic light scattering (DLS). Z-Average diameters (mean cluster size based on the intensity of scattered light) and intensity, volume and number size distributions were monitored as a function of time and energy input. Low frequency ultrasound was found to be more effective than high frequency ultrasound at de-agglomerating the powder and dispersion with a 20 kHz ultrasonic probe was found to be very effective at breaking apart large agglomerates containing weakly bound clusters of nanoparticles. In general, the breakage of nanoclusters was found to be a factor of ultrasonic intensity, the higher the intensity the greater the de-agglomeration and typically micron sized clusters were reduced to sub 100 nm particles in less than 30 min using optimum conditions. However, there came a point at which the forces generated by ultrasonic cavitation were either insufficient to overcome the cohesive bonds between smaller aggregates or at very high intensities decoupling between the tip and solution occurred. Absorption spectroscopy indicated a copper core structure with a thin oxide shell and the catalytic performance of this dispersion was demonstrated by drop coating onto substrates and subsequent electroless copper metallization. This relatively inexpensive catalytic suspension has the potential to replace precious metal based colloids used in electronics manufacturing.