Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages.

Transmission X-ray diffraction imaging in both monochromatic and white beam section mode has been used to measure quantitatively the displacement and warpage stress in encapsulated silicon devices. The displacement dependence with position on the die was found to agree well with that predicted from a simple model of warpage stress. For uQFN microcontrollers, glued only at the corners, the measured misorientation contours are consistent with those predicted using finite element analysis. The absolute displacement, measured along a line through the die centre, was comparable to that reported independently by high-resolution X-ray diffraction and optical interferometry of similar samples. It is demonstrated that the precision is greater than the spread of values found in randomly selected batches of commercial devices, making the techniques viable for industrial inspection purposes.

Local strain and defects in silicon wafers due to nanoindentation revealed by full-field X-ray microdiffraction imaging.

Quantitative characterization of local strain in silicon wafers is critical in view of issues such as wafer handling during manufacturing and strain engineering. In this work, full-field X-ray microdiffraction imaging using synchrotron radiation is employed to investigate the long-range distribution of strain fields in silicon wafers induced by indents under different conditions in order to simulate wafer fabrication damage. The technique provides a detailed quantitative mapping of strain and defect characterization at the micrometer spatial resolution and holds some advantages over conventional methods.

Total reflection X-ray topography for the observation of misfit dislocation strain at the surface of a Si/Ge-Si heterostructure.

Synchrotron X-Ray Topography has been used in Total Reflection Topography (TRT) mode to observe strain induced surface bumps due to the presence of underlying misfit dislocations in strained layer SiGe on Si epitaxial heterostructures. In these experiments the x-rays approached the sample surfaces at grazing incident angles below the total external reflection critical angles for a number of reflections and hence surface strain features nominally less than a few tens of Ångstroms from the sample surface have been observed. These are similar to the surface bumpiness observed by Atomic Force Microscopy, albeit on a much larger lateral length scale. The fact that TRT mode images were taken was confirmed by the observation of clear and conventional back reflection topographic images of misfit dislocations in all samples when the grazing incidence angle became greater than the critical angle.