ABSTRACT
In this work, novel airborne capacitive micromachined ultrasonic transducers (CMUTs) based on a dual-backplate (DBP) technology are presented. In contrast to conventional CMUTs, these transducers use a three-electrode-based capacitive system, where the membrane is placed between two highly-perforated counter electrodes, enabling enlarged displacement amplitudes in electrostatic actuation and wide and tunable bandwidth (BW) due to a ventilated air cavity. Fabricated DBP-CMUT prototypes therefore show exceptionally high receive and transmit sensitivities of -34.5 dB(V/Pa) and 259 nm/V, respectively, in their 84-kHz resonance. The viscous dissipation introduced by ventilating the cavity results in a wide factional BW (FBW) of 29%. Applicability of the developed CMUT for airborne ranging is demonstrated in pulse-echo-based ranging measurements, where the distance of a sound-reflecting metal plate can be clearly detected by a single CMUT operated in a transceiver mode.
ABSTRACT
Background: Chronic nerve compression is the most common indication for nerve surgery. However, the clinical diagnosis still relies on surrogate parameters since devices for direct nerve compression pressure measurement (DNCPM) are clinically unavailable yet. Objectives: To review previous approaches to DNCPM and evaluate presently available microsensor systems for their feasibility and reliability in preclinical nerve compression models. Methods: A scoping literature review was conducted in accordance with the PRISMA-ScR guidelines. A subsequent market research aimed at identifying commercially available sensor systems potentially suitable for DNCPM. Sensors were evaluated for feasibility and safety of perineural sensor positioning, tissue compatibility and measurement reliability in a synthetic nerve compression model and an ex-vivo chicken leg model. Results: A scoping literature review identified 197 potentially eligible studies of which 65 were included in the analysis. Previous approaches to DNCPM predominantly used pressure sensing catheters designed for fluid- or intra-compartmental pressure measurement. A market research identified two piezoresistive sensor systems (IntraSense, SMi, United States; Mikro-Cath, Millar, United States) as potentially suitable for intraoperative DNCPM. In both preclinical models, the detected compression pressure differed significantly between sensors and systems showed substantial measurement variability with a median percent coefficient of variation between 15.5% and 32%. Sensor position was accountable for up to 99.1% of the variance. Conclusion: Measurement variability caused by unreliable sensor positioning is a key limitation of presently available sensors when applied for nerve compression measurements. Redesigned systems with small, flat-shaped and longitudinally oriented sensors and dedicated introducers would facilitate sensor positioning and therefore may allow for reliable measurements.
ABSTRACT
Aim of this work is to improve the bond between a strain sensor and a device on which the strain shall be determined. As strain sensor, a CMOS-integrated chip featuring piezoresistive sensor elements was used which is capable of wireless energy and data transmission. The sensor chip was mounted on a standardized tensile test specimen of stainless steel by a bonding process using reactive multilayer systems (RMS). RMS provide a well-defined amount of heat within a very short reaction time of a few milliseconds and are placed in-between two bonding partners. RMS were combined with layers of solder which melt during the bonding process. Epoxy adhesive films were used as a reference bonding process. Under mechanical tensile loading, the sensor bonded with RMS shows a linear strain sensitivity in the whole range of tested forces whereas the adhesive-bonded sensor has slightly nonlinear behavior for low forces. Compared to the adhesive-bonded chips, the sensitivity of the reactively bonded chips is increased by a factor of about 2.5. This indicates a stronger mechanical coupling by reactive bonding as compared to adhesive bonding.
ABSTRACT
An analytical model is presented that describes the acoustical impedance of cylindrical tubes and concentrically connected systems of such tubes valid up to the ultrasonic application. This allows the evaluation of microsized geometries encountered in acoustical microdevices, such as housing enclosures and sound port Helmholtz resonators. Each tube is treated as an acoustic transmission line (TL). Connected tubes are described using a coupling impedance, which accounts for viscous and inertial effects due to duct size changes. The acoustic TL model is directly derived from Navier-Stokes and energy equation, including frequency dependent boundary layer effects of the viscous and thermal dissipation. The results for various evaluated enclosure and resonator geometries are in good agreement with finite element method (FEM) simulation in both audio and ultrasonic frequency range and are compared to dedicated lumped element models referenced in literature. The presented model provides benefits in three ways: it is faster than FEM simulation and allows an implementation into analytical models and circuit simulation tools. Finally, it allows geometries with characteristic dimensions close to and above the wavelength to be treated with high precision in contrast to lumped element models.
