Key material parameters driving CBRAM device performances.

This study is focused on Conductive Bridging Random Access Memory (CBRAM) devices based on chalcogenide electrolyte and Cu-supply materials, and aims at identifying the key material parameters controlling memory properties. The CBRAM devices investigated are integrated on CMOS select transistors, and are constituted by either Ge-Se or Ge-Te electrolyte layers of various compositions combined with a Cu2GeTe3 active chalcogenide electrode. By means of extensive physical and electrical characterization, we show for a given electrolyte system that slower write is obtained for a denser electrolyte layer, which is directly correlated with a lower atomic percentage of the chalcogen element in the layer. We also evidence that the use of Ge-Se electrolyte results in larger write energy (voltage and time), however with improved state retention properties than for Ge-Te electrolyte materials. We associate these results with the stronger chemical bonding of Cu with Se, resulting both in a stabilized Cu filament and a slower Cu cation motion. More robust processing thermal stability is also observed for Ge-Se compared to Ge-Te compounds, allowing more flexibility in the integration flow design.

Influence of the Chalcogen Element on the Filament Stability in CuIn(Te,Se,S)2/Al2O3 Filamentary Switching Devices.

In this paper, we report on the use of CuInX2 (X = Te, Se, S) as a cation supply layer in filamentary switching applications. Being used as absorber layers in solar cells, we take advantage of the reported Cu ionic conductivity of these materials to investigate the effect of the chalcogen element on filament stability. In situ X-ray diffraction showed material stability attractive for back-end-of-line in semiconductor industry. When integrated in 580 µm diameter memory cells, more volatile switching was found at low compliance current using CuInS2 and CuInSe2 compared to CuInTe2, which is ascribed to the natural tendency for Cu to diffuse back from the switching layer to the cation supply layer because of the larger difference in electrochemical potential using Se or S. Low-current and scaled behavior was also confirmed using conductive atomic force microscopy. Hence, by varying the chalcogen element, a method is presented to modulate the filament stability.

Combinatorial Study of Ag-Te Thin Films and Their Application as Cation Supply Layer in CBRAM Cells.

In this work, we investigate binary Ag-Te thin films and their functionality as a cation supply layer in conductive bridge random access memory devices. A combinatorial sputter deposition technique is used to deposit a graded Ag(x)Te(1-x) (0 < x < 1) layer with varying composition as a function of the position on the substrate. The crystallinity, surface morphology, and material stability under thermal treatment as a function of the composition of the material are investigated. From this screening, a narrow composition range between 33 and 38 at% Te is selected which shows a good morphology and a high melting temperature. Functionality of a single Ag(2-δ)Te composition as cation supply layer in CBRAM with dedicated Al2O3 switching layer is then investigated by implementing it in 580 µm diameter dot Pt/Ag(2-δ)Te/Al2O3/Si cells. Switching properties are investigated and compared to cells with a pure Ag cation supply layer. An improved cycling behavior is observed when Te is added compared to pure Ag, which we relate to the ionic conducting properties of Ag2Te and the preferred formation of Ag-Te phases.

Influence of carbon alloying on the thermal stability and resistive switching behavior of copper-telluride based CBRAM cells.

We report the improved thermal stability of carbon alloyed Cu0.6Te0.4 for resistive memory applications. Copper-tellurium-based memory cells show enhanced switching behavior, but the complex sequence of phase transformations upon annealing is disadvantageous for integration in a device. We show that addition of about 40 at % carbon to the Cu-telluride layer results in an amorphous material up to 360 °C. This material was then integrated in a TiN/Cu0.6Te0.4-C/Al2O3/Si resistive memory cell, and compared to pure Cu0.6Te0.4. Very attractive endurance (up to 1 × 10(3) cycles) and retention properties (up to 1 × 10(4) s at 85 °C) are observed. The enhanced thermal stability and good switching behavior make this material a promising candidate for integration in memory devices.

Comparison of two single-image phase-retrieval algorithms for in-line x-ray phase-contrast imaging.

The attenuation of x-rays in a material forms the basis of x-ray radiography and tomography. By measuring the transmission of the x-rays over a large amount of raypaths, the three-dimensional (3D) distribution of the x-ray linear attenuation coefficient can be reconstructed in a 3D volume. In x-ray microtomography (µCT), however, the x-ray refraction yields a significant signal in the transmission image and the 3D distribution of the refractive index can be reconstructed in a 3D volume. To do so, several methods exist, on both a hardware and software level. In this paper, we compare two similar software methods, the modified Bronnikov algorithm and the simultaneous phase-and-amplitude retrieval. The first method assumes a pure phase object, whereas the latter assumes a homogeneous object. Although these assumptions seem very restrictive, both methods have proven to yield good results on experimental data.