ABSTRACT
Photovoltaic (PV) power generation plays a significant role with the increase of installed capacity of renewable energy. The effects of environmental stress on insulating backsheets have been considered as the main cause of failure in PV systems. However, traditional aging models are difficult to realize the comprehensive evaluation of the lifetime of insulating backsheets. In this paper, the analytical method of complex chemical degradation related to the insulation was replaced by a physics-based method to quantify the elongation at the break as a function of time corresponding to temperature and radiation. In contrast to traditional aging models, this model simply used one parameter, namely drop-off rate (v), to reflect the degradation of polymers under various environmental stresses. The effect of ultraviolet (UV) radiation on the model was considered. Moreover, the electrical degradation, chemical changes, and mechanical properties caused by UV radiation were investigated to provide the reference for the lifetime of evaluation. The research is significant for comprehensively evaluating the lifetime of insulating materials for PV systems and other power equipment.
ABSTRACT
Polyimides (PI) are a class of dielectric polymer used in a wide range of electronics and electrical engineering applications from low-voltage microelectronics to high voltage isolation. They are well appreciated because of their excellent thermal, electrical, and mechanical properties, each of which need to be optimized uniquely depending on the end application. For example, for high-voltage applications, the final polymer breakdown field and dielectric properties must be optimized, both of which are dependent on the curing process and the final physico-chemical properties of PI. The majority of studies to date have focused on a limited set of properties of the polymer and have analyzed the effect of curing from a physicochemical-, mechanical- or electrical-centric viewpoint. This paper seeks to overcome this, unifying all of these characterizations in the same study to accurately describe the universal effect of the cure temperature on the properties of PI and at an industrial processing scale. This paper reports the widest-ranging study of its kind on the effect that cure temperature has on the physico-chemical, mechanical, thermal and electrical properties of polyimide, specifically poly (pyromellitic dianhydride-co-4, 4'-oxydianiline) (PMDA/ODA). The optimization of the cure temperature is accurately studied not only regarding the degree of imidization (DOI), but also considering the entire physical properties. Particularly, the analysis elucidates the key role of the charge-transfer complex (CTC) on these properties. The results show that while the thermal and mechanical properties improve with both DOI and CTC formation, the electrical properties, particularly at high field conditions, show an antagonistic behavior enhancing with increasing DOI while degrading at higher temperatures as the CTC formation increases. The electrical characterization at low field presents an enhancement of the final PI properties likely due to the DOI. On the contrary, at high electric field, the conductivity results show an improvement at an intermediate temperature emphasizing an ideal compromise between a high DOI and PI chain packing when the thermal imidization process is performed over this equilibrium. This balance enables maximum performance to be obtained for the PI film with optimized electrical properties and, overall, optimal thermal and mechanical properties are achieved.
ABSTRACT
Applications of polymeric materials in electrical engineering increasingly require improvements in operating voltages, performance, reliability, and size reduction. However, the resulting increase on the electric field in electrical systems can prevent achieving these goals. Polymer composites, functionalized with conductive or semiconductive particles, can allow us to reduce the electric field, thus grading the field within the system. In this paper, a comprehensive review of field-grading materials, their properties, and recent developments and applications is provided to realize high-performance high-voltage engineering applications.
