ABSTRACT
In general, although abundant literature studies are available on epoxy resin systems, a complete description of the curing kinetics in epoxy-cyanate ester composites relevant to the microelectronics industry is still lacking. Herein, curing behaviors of Ajinomoto build-up films, which are epoxy/silica composites, were studied by the non-isothermal differential scanning calorimetry method, and then, three non-isothermal curing kinetics models and model-free curing methods were used to analyze curing behaviors. In addition, a copper layer was also deposited onto the surface of the build-up film, and its interfacial adhesion property was also analyzed at different pre-curing conditions. The results showed that the curing reaction of the build-up film contains two curing reaction processes, and the first curing process is suited for the autocatalytic curing model, while the other curing process is suited for the Kamal curing kinetics model. Three model-free curing methods were used to calculate the activating energy at different degrees of curing, which indicated that the activating energy is variable during the whole curing process. The interfacial adhesion strength between the build-up film and copper layer decreased with the increase in the degree of curing, which is attributed to the contribution of mechanical anchoring. This work will offer guidance in curing behaviors for improving interfacial bonding force and controlling warpage behavior for chip substrates in the future.
ABSTRACT
Polymeric materials that simultaneously possess excellent mechanical properties and high self-healing ability at room temperature, convenient healing, and facile fabrication are always a huge challenge. Herein, we report on surface-energy-driven self-healing energetic linear polyurethane elastomers (EPU) that were facilely fabricated by two-step methods to acquire high healing efficiency and mechanical properties. By constructing surface energy and dynamic hard domains, energetic linear polyurethane elastomers not only obtained high healing ability and mechanical properties at high or room temperature but also avoid the use of some assisted healing conditions and complex chemical structure design and decrease manufacturing difficulty. Based on the interfacial healing physical model, various trends of surface tension, radius, and depth of the crack bottom were calculated to analyze the healing mechanism. We propose that polyurethane elastomers with low junction density could generate excess surface energy resulting from damage and drive self-healing, and incorporating a small amount of disulfide bonds increases the slightly packed hard phase and decreases the healing energy barrier. This work may offer a novel strategy for improving mechanical tensile and healing ability in the field of self-healing material application.
ABSTRACT
The curing kinetics between PGN and N100 were studied by Fourier transform infrared spectroscopy and dynamic torsional vibration method. The results showed that the entire curing process of adhesives was divided into three stages. Infrared spectroscopy can only monitor the first and second stages, while dynamic torsional vibration method monitors the second and third stages. Combining the two analysis methods allows the complete monitoring of the entire curing process in this system. Besides, differential scanning calorimeter is not suitable for studying this process.
