Recent Progress of Low Dielectric and High-Performance Polybenzoxazine-Based Composites.

With the rapid advancement of intelligent electronics, big data platforms, and other cutting-edge technologies, traditional low dielectric polymer matrix composites are no longer sufficient to satisfy the application requirements of high-end electronic information materials, particularly in the realm of high integration and high-frequency, high-speed electronic communication device manufacturing. Consequently, resin-based composites with exceptional low dielectric properties have garnered unprecedented attention. In recent years, benzoxazine-based composites have piqued the interest of scholars in the fields of high-temperature-resistant, low dielectric electronic materials due to their remarkable attributes such as high strength, high modulus, high heat resistance, low curing shrinkage, low thermal expansion coefficient, and excellent flame retardancy. This article focuses on the design and development of modification of polybenzoxazine based on low dielectric polybenzoxazine modification methods. Studies on manufacturing polybenzoxazine co-polymers and benzoxazine-based nanocomposites have also been reviewed.

Study of the Self-Polymerization of Epoxy/Phthalonitrile Copolymers and Their High-Performance Fiber-Reinforced Laminates.

Self-polymerization epoxy/phthalonitrile (APPEN) pre-polymers were studied systematically, and then, gelation time and differential scanning calorimetry (DSC) were employed to investigate their curing behaviors. Taking advantage of orthogonal test analysis, the key factors that affected the co-polymerization of APPEN were defined and the appropriate pre-polymerization conditions were analyzed. A possible curing mechanism of APPEN was proposed. Then, the thermomechanical and mechanical properties of glass-fiber-reinforced APPEN laminates (APPEN/GF) prepared at 180 °C were analyzed to understand the cross-linked and aggregation structures. Fracture surface of the composite laminates was also investigated to reveal the copolymerization degree and the interfacial binding. The results indicated that APPEN/GF composites exhibit outstanding mechanical and thermomechanical properties (flexural strength, 712 MPa, flexural modulus, 38 GPa, and Tg > 185 °C). The thermal stability (T5% > 334 °C and IPDT reached 1482 °C) of APPEN/GF composites was also investigated to further reveal the copolymerization between epoxy resin and aminophthalonitrile, which may be beneficial to the application of epoxy-matrix-based composites in the field of high-performance polymer composites.