ABSTRACT
This paper presents an innovative approach to the integration of thermoelectric microgenerators (µTEGs) based on thick-film thermopiles of planar constantan-silver (CuNi-Ag) and calcium cobaltite oxide-silver (Ca3Co4O9-Ag) thick-film thermopiles with radio frequency identification (RFID) technology. The goal was to consider using the TEG for an active or semi-passive RFID tag. The proposed implementation would allow the communication distance to be increased or even operated without changing batteries. This article discusses the principles of planar thermoelectric microgenerators (µTEGs), focusing on their ability to convert the temperature difference into electrical energy. The concept of integration with active or semi-passive tags is presented, as well as the results of energy efficiency tests, considering various environmental conditions. On the basis of the measurements, the parameters of thermopiles consisting of more thermocouples were simulated to provide the required voltage and power for cooperation with RFID tags. The conclusions of the research indicate promising prospects for the integration of planar thermoelectric microgenerators with RFID technology, opening the way to more sustainable and efficient monitoring and identification systems. Our work provides the theoretical basis and practical experimental data for the further development and implementation of this innovative technology.
ABSTRACT
This paper has three main purposes. The first is to investigate whether it is appropriate to use a planar thick-film thermoelectric sensor to monitor the temperature difference in a processor heat sink. The second is to compare the efficiency of two heat sink models. The third is to compare two kinds of sensors, differing in length. The model of the CPU heat sink sensor system was designed for numerical simulations. The relations between the CPU, heat sink, and the thermoelectric sensor were modelled because they are important for increasing the efficiency of fast processors without interfering with their internal structure. The heat sink was mounted on the top of the thermal model of a CPU (9.6 W). The plate fin and pin fin heat sinks were investigated. Two planar thermoelectric sensors were mounted parallel to the heat sink fins. These sensors monitored changes in the temperature difference between the CPU and the upper surface of the heat sink. The system was equipped with a cooling fan. Switching on the fan changed the thermal conditions (free or forced convection). The simulation results showed the temperature gradient appearing along the sensor for different heat sinks and under different thermal conditions. Comparison of the results obtained in the simulations of the CPU heat sink sensor systems proves that changes in the cooling conditions can cause a strong, step change in the response of the thermoelectric sensor. The results suggest that usage of the pin fin heat sink model is a better solution for free convection conditions. In the case of strong forced convection the heat sink type ceases to be significant.
ABSTRACT
This paper describes the design, manufacturing and characterization of newly developed mixed thick-/thin film thermoelectric microgenerators based on magnetron sputtered constantan (copper-nickel alloy) and screen-printed silver layers. The thermoelectric microgenerator consists of sixteen thermocouples made on a 34.2 × 27.5 × 0.25 mm³ alumina substrate. One of thermocouple arms was made of magnetron-sputtered constantan (Cu-Ni alloy), the second was a Ag-based screen-printed film. The length of each thermocouple arm was equal to 27 mm, and their width 0.3 mm. The distance between the arms was equal to 0.3 mm. In the first step, a pattern mask with thermocouples was designed and fabricated. Then, a constantan layer was magnetron sputtered over the whole substrate, and a photolithography process was used to prepare the first thermocouple arms. The second arms were screen-printed onto the substrate using a low-temperature silver paste (Heraeus C8829A or ElectroScience Laboratories ESL 599-E). To avoid oxidation of constantan, they were fired in a belt furnace in a nitrogen atmosphere at 550/450 °C peak firing temperature. Thermoelectric and electrical measurements were performed using the self-made measuring system. Two pyrometers included into the system were used for temperature measurement of hot and cold junctions. The estimated Seebeck coefficient, α was from the range 35 - 41 µV/K, whereas the total internal resistances R were between 250 and 3200 ohms, depending on magnetron sputtering time and kind of silver ink (the resistance of a single thermocouple was between 15.5 and 200 ohms).
