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1.
J Nanosci Nanotechnol ; 11(6): 5532-8, 2011 Jun.
Article in English | MEDLINE | ID: mdl-21770215

ABSTRACT

The development of low temperature, thin film transistor processes that have enabled flexible displays also present opportunities for flexible electronics and flexible integrated systems. Of particular interest are possible applications in flexible sensor systems for unattended ground sensors, smart medical bandages, electronic ID tags for geo-location, conformal antennas, radiation detectors, etc. In this paper, we review the impact of gate dielectrics, contacts and semiconductor materials on thin film transistors for flexible electronics applications. We present our recent results to fully integrate hybrid complementary metal oxide semiconductors comprising inorganic and organic-based materials. In particular, we demonstrate novel gate dielectric stacks and semiconducting materials. The impact of source and drain contacts on device performance is also discussed.


Subject(s)
Electronics, Medical , Transistors, Electronic , Semiconductors , Telemetry
2.
Rev Sci Instrum ; 78(10): 104702, 2007 Oct.
Article in English | MEDLINE | ID: mdl-17979444

ABSTRACT

The C-V electrical characterization of microstructures on a standard probe station is limited by the magnification of the imaging system and the precision of the probe manipulators. To overcome these limitations, we examine the combination of in situ electrical probing and a dual column scanning electron microscope/focused ion beam system. The imaging parameters and probing procedures are carefully chosen to reduce e-beam damage to the metal oxide semiconductor capacitor device under test. Estimation of shunt capacitance is critical when making femtofarad level measurements. C-V measurements of micron size metal-oxide-silicon capacitors are demonstrated.


Subject(s)
Electric Capacitance , Equipment Failure Analysis/instrumentation , Metals/chemistry , Microscopy, Electron, Scanning/instrumentation , Microscopy, Scanning Probe/instrumentation , Nanotechnology/instrumentation , Transducers , Electric Impedance , Electronics , Equipment Design , Equipment Failure Analysis/methods , Microscopy, Electron, Scanning/methods , Microscopy, Scanning Probe/methods , Nanotechnology/methods , Oxides/chemistry , Reproducibility of Results , Sensitivity and Specificity
3.
Langmuir ; 21(3): 950-5, 2005 Feb 01.
Article in English | MEDLINE | ID: mdl-15667173

ABSTRACT

The adsorption kinetics of octadecanethiol (ODT) and p-nitrobenzenethiol (NBT) from ethanol solutions has been studied by means of contact angle, optical ellipsometry, angle-resolved X-ray photoelectron spectroscopy (ARXPS), and grazing angle attenuated total reflection Fourier transform infrared (FTIR) measurements. ODT data were used as a reference for the kinetics studies of film growth. The growth of self-assembled monolayers from dilute solutions follows Langmuir isotherm adsorption kinetics. A saturated film is formed within 5 h after immersion in solutions of concentrations ranging from 0.0005 to 0.01 mM. The density of the monolayer depends on the concentration of the solution.

4.
Dent Mater J ; 12(2): 118-26, 1993 Dec.
Article in English | MEDLINE | ID: mdl-8004906

ABSTRACT

The surface layers formed on both a zinc-free and a zinc-containing dental amalgam after polishing and aging in air, water, or saline, were characterized using x-ray photoelectron spectroscopy (XPS) to determine the compositions of the surface layers which might govern the release of mercury from amalgam. The XPS data revealed that the formation of the surface layer on the zinc-containing amalgam was affected by the environment in which the amalgam was polished and aged, whereas that on the zinc-free amalgam was not affected. In addition, among the elements contained in amalgam, zinc was the most reactive with the environment, and was preferentially dissolved from amalgam into water or saline. Mercury atoms existed in the metallic state in the surface layer.


Subject(s)
Dental Amalgam/chemistry , Mercury/chemistry , Zinc/chemistry , Air , Copper/chemistry , Corrosion , Oxides/chemistry , Silver/chemistry , Sodium Chloride/chemistry , Spectrometry, X-Ray Emission , Surface Properties , Tin/chemistry , Water
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