ABSTRACT
Thermal assistance has been shown to significantly reduce the required operation power for spin torque transfer magnetic random access memory (STT-MRAM). Proposed heating methods include modified material stack compositions that result in increased self-heating or external heat sources. In this work we analyze the self-heating process of a standard perpendicular magnetic anisotropy STT-MRAM device through numerical simulations in order to understand the relative contributions of Joule, thermoelectric Peltier and Thomson, and tunneling junction heating. A 2D rotationally symmetric numerical model is used to solve the coupled electro-thermal equations including thermoelectric effects and heat absorbed or released at the tunneling junction. We compare self-heating for different common passivation materials, positive and negative electrical current polarity, and different device thermal anchoring and boundaries resistance configurations. The variations considered are found to result in significant differences in maximum temperatures reached. Average increases of 3 K, 10 K, and 100 K for different passivation materials, positive and negative polarity, and different thermal anchoring configurations, respectively, are observed. The highest temperatures, up to 424 K, are obtained for silicon dioxide as the passivation material, positive polarity, and low thermal anchoring with thermal boundary resistance configurations. Interestingly it is also found that due to the tunneling heat, Peltier effect, device geometry, and numerous interfacial layers around the magnetic tunnel junction (MTJ), most of the heat is dissipated on the lower potential side of the magnetic junction. This asymmetry in heating, which has also been observed experimentally, is important as thermally assisted switching requires heating of the free layer specifically and this will be significantly different for the two polarity operations, set and reset.
ABSTRACT
During the fast switching in Ge2Sb2Te5 phase change memory devices, both the amorphous and fcc crystalline phases remain metastable beyond the fcc and hexagonal transition temperatures respectively. In this work, the metastable electrical properties together with crystallization times and resistance drift behaviour of GST are studied using a high-speed, device-level characterization technique in the temperature range of 300 K to 675 K.
ABSTRACT
Blue and white light emission is observed when high voltage stress is applied using micrometer-separated tungsten probes across a nanoforest formed of ZnO nanorods. The optical spectrum of the emitted light consistently shows three fine peaks with very high amplitude in the 465-485 nm (blue) range, corresponding to atomic transitions of zinc. Additional peaks with smaller amplitudes in the 330-650 nm range and broad spectrum white light is observed depending on the excitation conditions. The spatial and spectral distribution of the emitted light, with pink-orange regions identifying percolation paths in some cases and high intensity blue and white light with center to edge variations in others, indicate that multiple mechanisms lead to light emission. Under certain conditions, the tungsten probe tips used to make electrical contact with the ZnO structures melt during the excitation, indicating that the local temperature can exceed 3422 °C, which is the melting temperature of tungsten. The distinct and narrow peaks in the optical spectra and the abrupt increase in current at high electric fields suggest that a plasma is formed by application of the electrical bias, giving rise to light emission via atomic transitions in gaseous zinc and oxygen. The broad spectrum, white light emission is possibly due to the free electron transitions in the plasma and blackbody radiation from molten silicon. The white light may also arise from the recombination through multiple defect levels in ZnO or due to the optical excitation from solid ZnO. The electrical measurements performed at different ambient pressures result in light emission with distinguishable differences in the emission properties and I-V curves, which also indicate that the dielectric breakdown of ZnO, sublimation, and plasma formation processes are the underlying mechanisms.
ABSTRACT
Thermoelectric transport in semiconductors is usually considered under small thermal gradients and when it is dominated by the role of the majority carriers. Not much is known about effects that arise under the large thermal gradients that can be established in high-temperature, small-scale electronic devices. Here, we report a surprisingly large asymmetry in self-heating of symmetric highly doped silicon microwires with the hottest region shifted along the direction of minority carrier flow. We show that at sufficiently high temperatures and strong thermal gradients (~1 K/nm), energy transport by generation, transport and recombination of minority carriers along these structures becomes very significant and overcomes convective energy transport by majority carriers in the opposite direction. These results are important for high-temperature nanoelectronics such as emerging phase-change memory devices which also employ highly doped semiconducting materials and in which local temperatures reach ~1000 K and thermal gradients reach ~10-100 K/nm.
ABSTRACT
A high resolution capacitance-voltage (C-V) characterization technique, enabling direct measurement of electronic properties at the nanoscale in devices such as nanowire field effect transistors (FETs) through the use of random fluctuations, is described. The minimum noise level required for achieving sub-aF (10(-18) F) resolution, the leveraging of stochastic resonance, and the effect of higher levels of noise are illustrated through simulations. The non-linear DeltaC(gate-source/drain)-V(gate) response of FETs is utilized to determine the inversion layer capacitance (C(inv)) and carrier mobility. The technique is demonstrated by extracting the carrier concentration and effective electron mobility in a nanoscale Si FET with C(inv) = 60 aF.
