ABSTRACT
This paper describes microassembly techniques for an out-of-plane three-dimensional microelectrode array for neural stimulating and recording in the central nervous system. An interlocking mechanism has been introduced into the microassembly components to facilitate the process, increase the robustness of the assembled device and improve the yield of the overall system. In-vivo testing has demonstrated full functionality of the microassembled 3D array.
Subject(s)
Electrodes, Implanted , Microelectrodes , Neurons/pathology , Amplifiers, Electronic , Animals , Auditory Cortex/pathology , Computer Simulation , Electric Stimulation , Equipment Design , Guinea Pigs , Imaging, Three-Dimensional , Microcomputers , Nervous System , Signal Processing, Computer-Assisted , Transistors, ElectronicABSTRACT
This paper describes a low-profile three-dimensional silicon/parylene microelectrode array as basis for practical neural prostheses for use in the central nervous system. The circuit areas of the silicon probes, containing mixed-signal CMOS circuitry for neural stimulation/recording, can be folded over to reduce the overall height of the microassembled array above the cortical surface. The low- profile structure is implemented using multiple gold beams spaced by orthogonal silicon braces. An integrated silicon/parylene batch process is introduced to encapsulate these interconnects and achieve high yield.