Improving the High-Temperature Gate Bias Instabilities by a Low Thermal Budget Gate-First Process in p-GaN Gate HEMTs.

In this study, we report a low ohmic contact resistance process on a 650 V E-mode p-GaN gate HEMT structure. An amorphous silicon (a-Si) assisted layer was inserted in between the ohmic contact and GaN. The fabricated device exhibits a lower contact resistance of about 0.6 Ω-mm after annealing at 550 °C. In addition, the threshold voltage shifting of the device was reduced from -0.85 V to -0.74 V after applying a high gate bias stress at 150 °C for 10-2 s. The measured time to failure (TTF) of the device shows that a low thermal budget process can improve the device's reliability. A 100-fold improvement in HTGB TTF was clearly demonstrated. The study shows a viable method for CMOS-compatible GaN power device fabrication.

Embedded Integration of Sb2Se3 Film by Low-Temperature Plasma-Assisted Chemical Vapor Reaction with Polycrystalline Si Transistor for High-Performance Flexible Visible-to-Near-Infrared Photodetector.

Flexible optoelectronics have garnered considerable interest for applications such as optical communication, motion capture, biosignal detection, and night vision. Transition-metal dichalcogenides are widely used as flexible photodetectors owing to their outstanding electrical and optical properties and high flexibility. Herein, a two-dimensional (2D) Sb2Se3 film-based one transistor-one resistor (1T1R) flexible photodetector with high photosensing current and detection ranges from visible to near-infrared was developed. The flexible 1T1R was fabricated using an efficient field-effect transistor platform with the 2D Sb2Se3 film directly deposited on the sensing region using a low-temperature plasma-assisted chemical vapor reaction. The photodetector could achieve a maximum Iphoto/Idark of 15,000 under white light with a power density of 26 mW/cm2, in which the photodetector showed quick rising and falling response times of 0.16 and 0.28 s, respectively. The 2D Sb2Se3 film exhibits broadband absorption in the visible and IR regions, yielding an excellent photoresponse under laser illumination with different wavelengths. To investigate the flexibility and stability of the 1T1R photodetector, the photoresponses were measured under different bending cycles and curvatures, which maintained its functions and exhibited high stability under convex and concave bending at a curvature radius of 20 mm.

Get Rid of Mr. Virus: The Effect of Injurant Anthropomorphism on the Intention to Engage in Protective Behavior.

Injurant anthropomorphism is defined as the anthropomorphism of disease-causing agents with humanlike characteristics, emotions, intentions, or behavior. More and more health product brands and health care organizations are depicting disease causing injurants (e.g., enterovirus or PM2.5 pollutants) with human characteristics in their advertising. However, the effect of injurant anthropomorphism on consumer perceptions and decision making remains unclear. This paper investigates how consumers feel and react to injurant anthropomorphism in the context of heath product promotion. The results of four lab and field experiments show that participants will develop a higher intention to engage in protective behavior (e.g., use a PM 2.5 anti-pollution mask) when the injurant is anthropomorphized than when it is not. However, the effect disappears if the injurant triggers a high behavioral immune response (BIR), or is imbued with a crying humanlike face. In addition, the perceived threat of disease is found to mediate this effect. Briefly, the present study contributes to the health communication literature and real-world practices by systematically examining the impact of injurant anthropomorphism on the health protective response, the process through which it exerts influence, or the boundary conditions for the effect.

I-line photolithographic metalenses enabled by distributed optical proximity correction with a deep-learning model.

High pattern fidelity is paramount to the performance of metalenses and metasurfaces, but is difficult to achieve using economic photolithography technologies due to low resolutions and limited process windows of diverse subwavelength structures. These hurdles can be overcome by photomask sizing or reshaping, also known as optical proximity correction (OPC). However, the lithographic simulators critical to model-based OPC require precise calibration and have not yet been specifically developed for metasurface patterning. Here, we demonstrate an accurate lithographic model based on Hopkin's image formulation and fully convolutional networks (FCN) to control the critical dimension (CD) patterning of a near-infrared (NIR) metalens through a distributed OPC flow using i-line photolithography. The lithographic model achieves an average ΔCD/CD = 1.69% due to process variations. The model-based OPC successfully produces the 260 nm CD in a metalens layout, which corresponds to a lithographic constant k1 of 0.46 and is primarily limited by the resolution of the photoresist. Consequently, our fabricated NIR metalens with a diameter of 1.5 mm and numerical aperture (NA) of 0.45 achieves a measured focusing efficiency of 64%, which is close to the calculated value of 69% and among the highest reported values using i-line photolithography.

Low-Temperature Growth of Hydrogenated Amorphous Silicon Carbide Solar Cell by Inductively Coupled Plasma Deposition Toward High Conversion Efficiency in Indoor Lighting.

A p-a-SiC:H window layer was used in amorphous Si thin film solar cells to boost the conversion efficiency in an indoor lighting of 500 lx. The p-a-SiC:H window layer/p-a-Si:H buffer layer scheme moderates the abrupt band bending across the p/i interface for the enhancement of VOC, JSC and FF in the solar spectra of short wavelengths. The optimized thickness of i-a-Si:H absorber layer is 400 nm to achieve the conversion efficiency of ~9.58% in an AM1.5 G solar spectrum. However, the optimized thickness of the absorber layer can be changed from 400 to 600 nm in the indoor lighting of 500 lx, exhibiting the maximum output power of 25.56 µW/cm2. Furthermore, various durability tests with excellent performance were investigated, which are significantly beneficial to harvest the indoor lights for applications in the self-powered internet of thing (IoT).

High Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) Circuits.

Development of manufacture trend for TFTs technologies has focused on improving electrical properties of films with the cost reduction to achieve commercialization. To achieve this goal, high-performance sub-50 nm TFTs-based MOSFETs with ON-current (Ion)/subthreshold swing (S.S.) of 181 µA/µm/107 mV/dec and 188 µA/µm/98 mV/dec for NMOSFETs and PMOSFETs in a monolithic 3D circuit were demonstrated by a low power with low thermal budget process. In addition, a stackable static random access memory (SRAM) integrated with TFTs-based MOSFET with static noise margins (SNM) equals to 390 mV at VDD = 1.0 V was demonstrated. Overall processes include a low thermal budget via ultra-flat and ultra-thin poly-Si channels by solid state laser crystallization process, chemical-mechanical polishing (CMP) planarization, plasma-enhanced atomic layer deposition (ALD) gate stacking layers and infrared laser activation with a low thermal budget. Detailed material and electrical properties were investigated. The advanced 3D architecture with closely spaced inter-layer dielectrics (ILD) enables high-performance stackable MOSFETs and SRAM for power-saving IoT/mobile products at a low cost or flexible substrate.

Generality and cultural variation in the experience of regret.

Regret is the prototypical decision-related emotion. Most theory and research on regret comes from the United States and Europe, but recent research has suggested potential cross-cultural differences in regret. We examined generality and cultural variation in the experience of regret. A cross-cultural study compared experiences of regret with those of disappointment and guilt as reported by participants from the United States (n = 143), the Netherlands (n = 147), Israel (n = 148), and Taiwan (n = 115). We found strong evidence for generality of the distinct emotion components of regret, compared with those of disappointment and guilt. We also found cultural variation in the frequency and intensity of regret in intrapersonal situations (regrets about outcomes affecting the self) and interpersonal regrets (regrets about outcomes affecting others). Whereas in the U.S. sample, regret was experienced more intensely in intrapersonal than interpersonal situations, both emotions were experienced more intensely in interpersonal situations in the Taiwanese sample.