ABSTRACT
Measurements of atmospheric gas concentrations using of NDIR gas sensors requires compensation of ambient pressure variations to achieve reliable result. The extensively used general correction method is based on collecting data for varying pressures for a single reference concentration. This one-dimensional compensation approach is valid for measurements carried out in gas concentrations close to reference concentration but will introduce significant errors for concentrations further away from the calibration point. For applications, requiring high accuracy, collecting, and storing calibration data at several reference concentrations can reduce the error. However, this method will cause higher demands on memory capacity and computational power, which is problematic for cost sensitive applications. We present here an advanced, but practical, algorithm for compensation of environmental pressure variations for relatively low-cost/high resolution NDIR systems. The algorithm consists of a two-dimensional compensation procedure, which widens the valid pressure and concentrations range but with a minimal need to store calibration data, compared to the general one-dimensional compensation method based on a single reference concentration. The implementation of the presented two-dimensional algorithm was verified at two independent concentrations. The results show a reduction in the compensation error from 5.1% and 7.3%, for the one-dimensional method, to -0.02% and 0.83% for the two-dimensional algorithm. In addition, the presented two-dimensional algorithm only requires calibration in four reference gases and the storing of four sets of polynomial coefficients used for calculations.
ABSTRACT
Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.
