Defects Contributing to Hysteresis in Few-Layer and Thin-Film MoS2 Memristive Devices.

Molybdenum disulfide, a two-dimensional material extensively explored for potential applications in non-von Neumann computing technologies, has garnered significant attention owing to the observed hysteresis phenomena in MoS2 FETs. The dominant sources of hysteresis reported include charge trapping at the channel-dielectric interface and the adsorption/desorption of molecules. However, in MoS2 FETs with different channel thicknesses, the specific nature and density of defects contributing to hysteresis remain an intriguing aspect requiring further investigation. This study delves into memristive devices with back-gate modulated channel layers based on CVD-deposited flake-based and thin-film-based MoS2 FETs, with a few-layer (FL) and thin-film (TF) channel thickness. Analysis of current-voltage (I-V) and conductance-frequency (Gp/ω-f) measurements led to the conclusion that the elevated hysteresis observed in TF MoS2 devices, as opposed to FL devices, stems from a substantial contribution from intrinsic defects within the channel volume, surpassing that of interface defects. This study underscores the significance of considering both intrinsic defects within the bulk and the interface defects of the channel when analyzing hysteresis in MoS2 FETs, particularly in TF FETs. The selection between FL and TF MoS2 devices depends on the requirements for memristive applications, considering factors such as hysteresis tolerance and scaling capabilities.

Three-dimensional platinum nanoparticle-based bridges for ammonia gas sensing.

This study demonstrates the fabrication of self-aligning three-dimensional (3D) platinum bridges for ammonia gas sensing using gas-phase electrodeposition. This deposition scheme can guide charged nanoparticles to predetermined locations on a surface with sub-micrometer resolution. A shutter-free deposition is possible, preventing the use of additional steps for lift-off and improving material yield. This method uses a spark discharge-based platinum nanoparticle source in combination with sequentially biased surface electrodes and charged photoresist patterns on a glass substrate. In this way, the parallel growth of multiple sensing nodes, in this case 3D self-aligning nanoparticle-based bridges, is accomplished. An array containing 360 locally grown bridges made out of 5 nm platinum nanoparticles is fabricated. The high surface-to-volume ratio of the 3D bridge morphology enables fast response and room temperature operated sensing capabilities. The bridges are preconditioned for ~ 24 h in nitrogen gas before being used for performance testing, ensuring drift-free sensor performance. In this study, platinum bridges are demonstrated to detect ammonia (NH3) with concentrations between 1400 and 100 ppm. The sensing mechanism, response times, cross-sensitivity, selectivity, and sensor stability are discussed. The device showed a sensor response of ~ 4% at 100 ppm NH3 with a 70% response time of 8 min at room temperature.

Localized and Programmable Chemical Vapor Deposition Using an Electrically Charged and Guided Molecular Flux.

Chemical vapor deposition is a widely used material deposition technique. It commonly provides a uniform material flux to the substrate to cause uniform thin film growth. However, the ability to precisely adjust the local deposition rate would be highly preferable. This communication reports on a chemical vapor deposition method performed in a localized and programmable fashion by introducing an electrically charged and guided molecular flux. This allows for local adjustments of the deposition rate and three-dimensional shape by controlling the electric fields. Specifically, the precursor molecules are charged and then guided by arrays of electrodynamic funnels, which are created by a patterned dielectric layer, to predetermined deposition locations with a minimal spot size of 250 nm. Furthermore, nearest neighbor coupling is reported as a shaping method to cause the deposition of three-dimensional nanostructures. Additionally, the integration of individually addressable domain electrodes offers programmable charge dissipation to achieve an ON/OFF control. The described method is applicable to a wide variety of materials and precursors. Here, the localized and programmable deposition of three-dimensional copper oxide, chromium oxide, zinc oxide, and carbon nanowires is demonstrated.

Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix.

Conventional rigid electronic systems use a number of metallization layers to route all necessary connections to and from isolated surface mount devices using well-established printed circuit board technology. In contrast, present solutions to prepare stretchable electronic systems are typically confined to a single stretchable metallization layer. Crossovers and vertical interconnect accesses remain challenging; consequently, no reliable stretchable printed circuit board (SPCB) method has established. This article reports an industry compatible SPCB manufacturing method that enables multilayer crossovers and vertical interconnect accesses to interconnect isolated devices within an elastomeric matrix. As a demonstration, a stretchable (260%) active matrix with integrated electronic and optoelectronic surface mount devices is shown that can deform reversibly into various 3D shapes including hemispherical, conical or pyramid.

Gas Phase Electrodeposition Enabling the Programmable Three-Dimensional Growth of a Multimodal Room Temperature Nanobridge Gas Sensor Array.

Parallel three-dimensional (3D) growth of different nanomaterials with submicrometer resolution is a promising approach to overcome some technological and economic limits encountered in planar integrated homogeneous films. The programmable multimaterial gas phase nanoparticle electrodeposition concept enables the fabrication of a 3D multimodal conductometric gas sensor array. The approach requires the deposition of more than one nanomaterial to achieve orthogonal sensing capabilities and multigas sensitivity and selectivity. The demonstrated "electronic nose"-like array contains 1080 self-aligning 3D nanobridge-based electrical connections of platinum, nickel oxide, and gold on a single chip. The nanobridges form through a nearest neighbor Coulombic interaction. Each gas sensitive bridge is a 3D structure composed of a porous but electrically conducting nanoparticle network. It was found that this architecture is unique, because it does not require external heating to operate. A trimodal sensor array will be demonstrated to detect various levels of ammonia (NH3), carbon monoxide (CO), and hydrogen sulfide (H2S). A 3 × 3 transfer matrix will be discussed to correlate the recorded signals with the gas composition.

Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points.

This communication presents fluidic self-assembly of Si-chip on a sequentially electroplated multilayer solder bump with tailored transformation imprinted melting points. The multilayer solder bump is a lead free ternary solder system, which provides a route to transform the melting point of interconnects for applications in solder directed fluidic self-assembly. The outermost metal layers form a low melting point Bi33.7In66.3 solder shell (72 °C). This solder shell enables fluidic self-assembly and self-alignment of freely in water suspended Si-dies at relatively low temperature (75 °C) leading to well-ordered chip arrays. The reduction of the free surface energy of the shell-water interface provides the driving force for the self-assembly. The lowermost metal layer is a high melting point solder and acts as a core. After the self-assembly is complete, a short reflow causes the transformation of the core and the shell yielding a stable high melting point solder with adjustable melting points. The chosen ternary solder system enables the realization of interconnects with melting points in the range of 112 °C to 206 °C.

Core-Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects.

We demonstrate the realization of core-shell transformation-imprinted solder bumps to enable low-temperature chip assembly, while providing a route to high-temperature interconnects through transformation. The reported core-shell solder bump uses a lower melting point BiIn-based shell and a higher melting point Sn core in the initial stage. The bumps enable fluidic self-assembly and self-alignment at relatively low temperatures (60-80 °C). The bumps use the high surface free energy of the liquid shell during the self-assembly to capture freely suspended Si dies inside a heated (80 °C) water bath, leading to well-ordered defect-free chip arrays; the molten liquid shell wets the metal contact (binding site) on the chips and yields self-aligned and electrically connected devices. The solid core provides the anchor point to the substrate. After the completion of the assembly, a short reflow raises the melting point, yielding a solid electrical connection. The low melting point liquid diffuses into the high melting point core. The tuning of the material ratios leads to tailored transformation-imprinted solders with high melting points (160-206 °C) in the final structure.

Approaching Gas Phase Electrodeposition: Process and Optimization to Enable the Self-Aligned Growth of 3D Nanobridge-Based Interconnects.

A nanowire bonding process referred to as gas-phase electrodeposition is reported to form nanobridge-based interconnects. The process is able to grow free-standing point-to-point electrical connections using metallic wires. As a demonstration, programmable interconnects and an interdigitated electrode array are shown. The process is more material efficient when compared with conventional vapor deposition since the material is directed to the point of use.

Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries.

This publication provides an overview and discusses some challenges of surface tension directed fluidic self-assembly of semiconductor chips which are transported in a liquid medium. The discussion is limited to surface tension directed self-assembly where the capture, alignment, and electrical connection process is driven by the surface free energy of molten solder bumps where the authors have made a contribution. The general context is to develop a massively parallel and scalable assembly process to overcome some of the limitations of current robotic pick and place and serial wire bonding concepts. The following parts will be discussed: (2) Single-step assembly of LED arrays containing a repetition of a single component type; (3) Multi-step assembly of more than one component type adding a sequence and geometrical shape confinement to the basic concept to build more complex structures; demonstrators contain (3.1) self-packaging surface mount devices, and (3.2) multi-chip assemblies with unique angular orientation. Subsequently, measures are discussed (4) to enable the assembly of microscopic chips (10 µm⁻1 mm); a different transport method is introduced; demonstrators include the assembly of photovoltaic modules containing microscopic silicon tiles. Finally, (5) the extension to enable large area assembly is presented; a first reel-to-reel assembly machine is realized; the machine is applied to the field of solid state lighting and the emerging field of stretchable electronics which requires the assembly and electrical connection of semiconductor devices over exceedingly large area substrates.

Millimeter Thin and Rubber-Like Solid-State Lighting Modules Fabricated Using Roll-to-Roll Fluidic Self-Assembly and Lamination.

A millimeter thin rubber-like solid-state lighting module is reported. The fabrication of the lighting module incorporates assembly and electrical connection of light-emitting diodes (LEDs). The assembly is achieved using a roll-to-roll fluidic self-assembly. The LEDs are sandwiched in-between a stretchable top and bottom electrode to relieve the mechanical stress. The top contact is realized using a lamination technique that eliminates wire-bonding.

Active matrix-based collection of airborne analytes: an analyte recording chip providing exposure history and finger print.

In the field of sensors that target the detection of airborne analytes, Corona/lens-based-collection provides a new path to achieve a high sensitivity. An active-matrix-based analyte collection approach referred to as "airborne analyte memory chip/recorder" is demonstrated, which takes and stores airborne analytes in a matrix to provide an exposure history for off-site analysis.

A first implementation of an automated reel-to-reel fluidic self-assembly machine.

A first automated reel-to-reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high-speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm-wide web) over large-area substrates. The optimization of the system (>99% assembly yield) is based on identification, calculation, and optimization of the relevant forces. As an application, the production of a solid-state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.

Effective collection and detection of airborne species using SERS-based detection and localized electrodynamic precipitation.

Three different delivery concepts (standard diffusion, global electrodynamic precipitation, and localized nanolens-based precipitation) and three different SERS enhancement layers (a silver film, a nanolens-based localized silver nanoparticle film, and the standard AgFON) are compared. The nanolens concept is applied to increase the SERS signal: a factor of 633, when compared to a standard mechanism of diffusion, is observed.

Effective localized collection and identification of airborne species through electrodynamic precipitation and SERS-based detection.

Various nanostructured sensor designs currently aim to achieve or claim single molecular detection by a reduction of the active sensor size. However, a reduction of the sensor size has the negative effect of reducing the capture probability considering the diffusion-based analyte transport commonly used. Here we introduce and apply a localized programmable electrodynamic precipitation concept as an alternative to diffusion. The process provides higher collection rates of airborne species and detection at lower concentration. As an example, we compare an identical nanostructured surfaced-enhanced Raman spectroscopy sensor with and without localized delivery and find that the sensitivity and detection time is improved by at least two orders of magnitudes. Localized collection in an active-matrix array-like fashion is also tested, yielding hybrid molecular arrays on a single chip over a broad range of molecular weights, including small benzenethiol (110.18 Da) and 4-fluorobenzenethiol (128.17 Da), or large macromolecules such as anti-mouse IgG (~150 kDa).

Nanocontact electrification: patterned surface charges affecting adhesion, transfer, and printing.

Contact electrification creates an invisible mark, overlooked and often undetected by conventional surface spectroscopic measurements. It impacts our daily lives macroscopically during electrostatic discharge and is equally relevant on the nanoscale in areas such as soft lithography, transfer, and printing. This report describes a new conceptual approach to studying and utilizing contact electrification beyond prior surface force apparatus and point-contact implementations. Instead of a single point contact, our process studies nanocontact electrification that occurs between multiple nanocontacts of different sizes and shapes that can be formed using flexible materials, in particular, surface-functionalized poly(dimethylsiloxane) (PDMS) stamps and other common dielectrics (PMMA, SU-8, PS, PAA, and SiO(2)). Upon the formation of conformal contacts and forced delamination, contacted regions become charged, which is directly observed using Kelvin probe force microscopy revealing images of charge with sub-100-nm lateral resolution. The experiments reveal chemically driven interfacial proton exchange as the dominant charging mechanism for the materials that have been investigated so far. The recorded levels of uncompensated charges approach the theoretical limit that is set by the dielectric breakdown strength of the air gap that forms as the surfaces are delaminated. The macroscopic presence of the charges is recorded using force-distance curve measurements involving a balance and a micromanipulator to control the distance between the delaminated objects. Coulomb attraction between the delaminated surfaces reaches 150 N/m(2). At such a magnitude, the force finds many applications. We demonstrate the utility of printed charges in the fields of (i) nanoxerography and (ii) nanotransfer printing whereby the smallest objects are ∼10 nm in diameter and the largest objects are in the millimeter to centimeter range. The printed charges are also shown to affect the electronic properties of contacted surfaces. For example, in the case of a silicon-on-insulator field effect transistors are in contact with PDMS and subsequent delamination leads to threshold voltage shifts that exceed 500 mV.

Nanocontact electrification through forced delamination of dielectric interfaces.

This article reports patterned transfer of charge between conformal material interfaces through a concept referred to as nanocontact electrification. Nanocontacts of different size and shape are formed between surface-functionalized polydimethylsiloxane (PDMS) stamps and other dielectric materials (PMMA, SiO(2)). Forced delamination and cleavage of the interface yields a well-defined charge pattern with a minimal feature size of 100 nm. The process produces charged surfaces and associated fields that exceed the breakdown strength of air, leading to strong long-range adhesive forces and force-distance curves, which are recorded over macroscopic distances. The process is applied to fabricate charge-patterned surfaces for nanoxerography demonstrating 200 nm resolution nanoparticle prints and applied to thin film electronics where the patterned charges are used to shift the threshold voltages of underlying transistors.

Gas phase electrodeposition: a programmable multimaterial deposition method for combinatorial nanostructured device discovery.

This article reports and applies a recently discovered programmable multimaterial deposition process to the formation and combinatorial improvement of 3D nanostructured devices. The gas-phase deposition process produces charged <5 nm particles of silver, tungsten, and platinum and uses externally biased electrodes to control the material flux and to turn deposition ON/OFF in selected domains. Domains host nanostructured dielectrics to define arrays of electrodynamic 10 × nanolenses to further control the flux to form <100 nm resolution deposits. The unique feature of the process is that material type, amount, and sequence can be altered from one domain to the next leading to different types of nanostructures including multimaterial bridges, interconnects, or nanowire arrays with 20 nm positional accuracy. These features enable combinatorial nanostructured materials and device discovery. As a first demonstration, we produce and identify in a combinatorial way 3D nanostructured electrode designs that improve light scattering, absorption, and minority carrier extraction of bulk heterojunction photovoltaic cells. Photovoltaic cells from domains with long and dense nanowire arrays improve the relative power conversion efficiency by 47% when compared to flat domains on the same substrate.

Mimicking electrodeposition in the gas phase: a programmable concept for selected-area fabrication of multimaterial nanostructures.

An in situ gas-phase process that produces charged streams of Au, Si, TiO(2), ZnO, and Ge nanoparticles/clusters is reported together with a programmable concept for selected-area assembly/printing of more than one material type. The gas-phase process mimics solution electrodeposition whereby ions in the liquid phase are replaced with charged clusters in the gas phase. The pressure range in which the analogy applies is discussed and it is demonstrated that particles can be plated into pores vertically (minimum resolution 60 nm) or laterally to form low-resistivity (48 microOmega cm) interconnects. The process is applied to the formation of multimaterial nanoparticle films and sensors. The system works at atmospheric pressure and deposits material at room temperature onto electrically biased substrate regions. The combination of pumpless operation and parallel nozzle-free deposition provides a scalable tool for printable flexible electronics and the capability to mix and match materials.

Self-assembly of microscopic chiplets at a liquid-liquid-solid interface forming a flexible segmented monocrystalline solar cell.

This paper introduces a method for self-assembling and electrically connecting small (20-60 micrometer) semiconductor chiplets at predetermined locations on flexible substrates with high speed (62500 chips/45 s), accuracy (0.9 micrometer, 0.14 degrees), and yield (> 98%). The process takes place at the triple interface between silicone oil, water, and a penetrating solder-patterned substrate. The assembly is driven by a stepwise reduction of interfacial free energy where chips are first collected and preoriented at an oil-water interface before they assemble on a solder-patterned substrate that is pulled through the interface. Patterned transfer occurs in a progressing linear front as the liquid layers recede. The process eliminates the dependency on gravity and sedimentation of prior methods, thereby extending the minimal chip size to the sub-100 micrometer scale. It provides a new route for the field of printable electronics to enable the integration of microscopic high performance inorganic semiconductors on foreign substrates with the freedom to choose target location, pitch, and integration density. As an example we demonstrate a fault-tolerant segmented flexible monocrystalline silicon solar cell, reducing the amount of Si that is used when compared to conventional rigid cells.