Leaching studies for tin recovery from waste e-scrap.

Printed circuit boards (PCBs) are the most essential components of all electrical and electronic equipments, which contain noteworthy quantity of metals, some of which are toxic to life and all of which are valuable resources. Therefore, recycling of PCBs is necessary for the safe disposal/utilization of these metals. Present paper is a part of developing Indo-Korean recycling technique consists of organic swelling pre-treatment technique for the liberation of thin layer of metallic sheet and the treatment of epoxy resin to remove/recover toxic soldering material. To optimize the parameters required for recovery of tin from waste PCBs, initially the bench scale studies were carried out using fresh solder (containing 52.6% Sn and 47.3% Pb) varying the acid concentration, temperature, mixing time and pulp density. The experimental data indicate that 95.79% of tin was leached out from solder material using 5.5M HCl at fixed pulp density 50 g/L and temperature 90°C in mixing time 165 min. Kinetic studies followed the chemical reaction controlled dense constant size cylindrical particles with activation energy of 117.68 kJ/mol. However, 97.79% of tin was found to be leached out from solder materials of liberated swelled epoxy resin using 4.5M HCl at 90°C, mixing time 60 min and pulp density 50 g/L. From the leach liquor of solder materials of epoxy resin, the precipitate of sodium stannate as value added product was obtained at pH 1.9. The Pb from the leach residue was removed by using 0.1M nitric acid at 90°C in mixing time 45 min and pulp density 10g/L. The metal free epoxy resin could be disposed-of safely/used as filling material without affecting the environment.

Thiosulfate leaching of gold from waste mobile phones.

The present communication deals with the leaching of gold from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a copper-ammonia-thiosulfate solution, as an alternative to the conventional and toxic cyanide leaching of gold. The influence of thiosulfate, ammonia and copper sulfate concentrations on the leaching of gold from PCBs of waste mobile phones was investigated. Gold extraction was found to be enhanced with solutions containing 15-20 mM cupric, 0.1-0.14 M thiosulfate, and 0.2-0.3 M ammonia. Similar trends were obtained for the leaching of gold from two different types of scraps and PCBs of waste mobile phones. From the scrap samples, 98% of the gold was leached out using a solution containing 20 mM copper, 0.12 M thiosulfate and 0.2 M ammonia. Similarly, the leaching of gold from the PCBs samples was also found to be good, but it was lower than that of scrap samples in similar experimental conditions. In this case, only 90% of the gold was leached, even with a contact time of 10h. The obtained data will be useful for the development of processes for the recycling of gold from waste mobile phones.

Adsorption of copper from the sulphate solution of low copper contents using the cationic resin Amberlite IR 120.

In view of the increasing importance of the waste processing and recycling to meet the strict environmental regulations, the present investigation reports an adsorption process using the cationic exchanger Amberlite IR 120 for the recovery/removal of copper from the synthetic sulphate solution containing copper

Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill.

Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to <10mm were milled using a stamp mill to liberate the various metallic components, and then the milled printed circuit boards were classified into fractions of <0.6, 0.6-1.2, 1.2-2.5, 2.5-5.0, and >5.0mm. The fractions of milled printed circuit boards of size <5.0mm were separated into a light fraction of mostly non-metallic components and a heavy fraction of the metallic components by gravity separation using a zig-zag classifier. The >5.0mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards.

Recovery of H2SO4 from waste acid solution by a diffusion dialysis method.

A diffusion dialysis method using anion exchange membrane was used to recover H2SO4 from waste sulfuric acid solution produced at the diamond manufacturing process. Effects of flow rate, operation temperature, and metal ion concentration on the recovery of H2SO4 were investigated. The recovery of H2SO4 increased with the concentration of H2SO4 and operation temperature. It also increased with the flow rate ratio of water/H2SO4 solution up to 1, above which no further increase was observed. The flow rate did not affect the rejection of Fe and Ni ions. About 80% of H2SO4 could be recovered from waste sulfuric acid which contained 4.5M free-H2SO4 at the flow rate of 0.26x10(-3) m3/hm3. The concentration of recovered H2SO4 was 4.3M and the total impurity was 2000 ppm. Preliminary economic evaluation has revealed that the dialysis system is highly attractive one that has payback period of only few months.