Dataset on simulated microbond tests using finite element method: Simulation cases about different geometrical influences, material behavior, damage evolution, and element meshes.

This data article provides an extensive dataset obtained from finite element (FE) simulations of microbond (MB) tests. The simulations cover a wide range of structural effects and artifacts that influence the results of the MB tests. A total of 432 simulations were performed,taking into account the various factors such as blade geometry and position, plastic behaviour of thermoset and thermoplastic droplets, material properties of the fibres, residual stresses, fracture modes at interfaces, and FE mesh sensitivity analysis. Each FE simulation consists of blade reaction force, blade displacement, fibre displacement, fibre strain and various energy metrics such as interface strain energy, total strain energy, damage energy and plastic dissipation energy. For ease of reference, the individual data files are organised in a systematic naming sequence based on the simulation matrices, detailing the specific abbreviations for each file. A user-friendly interface is also provided to read and visualisethe data from the output files in relation to the simulation matrix. For more information on the interpretation and analysis of this data, please refer to a research article entitled "Mutual dependence of experimental and data analysis features in characterization of fibre-matrix interface via microdroplets (R. Dsouza et al., 2023)".

Multi-Axis Fatigue Experimentation System of Intramedullary Implants for Femur and Tibia.

Current designs of leg-lengthening implants have faced serious failures due to inadequacies in the mechanical design. The failure typically is the result of fatigue induced by a combined loading condition with axial and shear components acting in the tubular body of the implant. One of the reasons leading to the failure is improper verification testing for the design of the fatigue limit. The current test standards for pre-clinical design phases of nail implants are relatively straightforward and widely accepted yet cannot produce the three-dimensional stress state representative of the anticipated operation in a patient during the consolidation phase. This work introduces a major improvement toward a method for verifying fatigue life of tubular as well as solid implants under combined torque, axial load, and bending. The report describes a new loading fixture, a calibration method, and compares the qualification results of finite element simulation analyses and experimental measurements during cyclic loading tests. The findings state that the fixture produces controlled multi-axial loadings to study varied osteotomy locations, quasi-static strength and fatigue of intramedullary implants at an intermediate, 2 Hz, cycle rate. © 2019 The Authors. Journal of Orthopaedic Research® published by Wiley Periodicals, Inc. on behalf of Orthopaedic Research Society. J Orthop Res 38:984-995, 2020.

The Effect of Encapsulation Geometry on the Performance of Stretchable Interconnects.

The stretchability of electronic devices is typically obtained by tailoring the stretchable interconnects that link the functional units together. The durability of the interconnects against environmental conditions, such as deformation and chemicals, is therefore important to take into account. Different approaches, including encapsulation, are commonly used to improve the endurance of stretchable interconnects. In this paper, the geometry of encapsulation layer is initially investigated using finite element analysis. Then, the stretchable interconnects with a narrow-to-wide layout are screen-printed using silver flake ink as a conductor on a thermoplastic polyurethane (TPU) substrate. Printed ultraviolet (UV)-curable screen-printed dielectric ink and heat-laminated TPU film are used for the encapsulation of the samples. The electromechanical tests reveal a noticeable improvement in performance of encapsulated samples compared to non-protected counterparts in the case of TPU encapsulation. The improvement is even greater with partial coverage of the encapsulation layer. A device with a modified encapsulation layer can survive for 10,000 repetitive cycles at 20% strain, while maintaining the electrical and mechanical performance.