Water-Triggered Self-Healing of Ti3C2Tx MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process.

MXenes, with their remarkable attributes, stand at the forefront of diverse applications. However, the challenge remains in sustaining their performance, especially concerning Ti3C2Tx MXene electrodes. Current self-healing techniques, although promising, often rely heavily on adjacent organic materials. This study illuminates a pioneering water-initiated self-healing mechanism tailored specifically for standalone MXene electrodes. Here, both water and select organic solvents seamlessly mend impaired regions. Comprehensive evaluations around solvent types, thermal conditions, and substrate nuances underline water's unmatched healing efficacy, attributed to its innate ability to forge enduring hydrogen bonds with MXenes. Optimal healing environments range from ambient conditions to a modest 50 °C. Notably, on substrates rich in hydroxyl groups, the healing efficiency remains consistently high. The proposed healing mechanism encompasses hydrogen bonding formation, capillary action-induced expansion of interlayer spacing, solvent lubrication, Gibbs free energy minimizing MXene nanosheet rearrangement, and solvent evaporation-triggered MXene layer recombination. MXenes' resilience is further showcased by their electrical revival from profound damages, culminating in the crafting of Joule-heated circuits and heaters.

Self-Repairing and Energy-Harvesting Triboelectric Sensor for Tracking Limb Motion and Identifying Breathing Patterns.

The increasing prevalence of health problems stemming from sedentary lifestyles and evolving workplace cultures has placed a substantial burden on healthcare systems. Consequently, remote health wearable monitoring systems have emerged as essential tools to track individuals' health and well-being. Self-powered triboelectric nanogenerators (TENGs) have exhibited significant potential for use as emerging detection devices capable of recognizing body movements and monitoring breathing patterns. However, several challenges remain to be addressed in order to fulfill the requirements for self-healing ability, air permeability, energy harvesting, and suitable sensing materials. These materials must possess high flexibility, be lightweight, and have excellent triboelectric charging effects in both electropositive and electronegative layers. In this work, we investigated self-healable electrospun polybutadiene-based urethane (PBU) as a positive triboelectric layer and titanium carbide (Ti3C2Tx) MXene as a negative triboelectric layer for the fabrication of an energy-harvesting TENG device. PBU consists of maleimide and furfuryl components as well as hydrogen bonds that trigger the Diels-Alder reaction, contributing to its self-healing properties. Moreover, this urethane incorporates a multitude of carbonyl and amine groups, which create dipole moments in both the stiff and the flexible segments of the polymer. This characteristic positively influences the triboelectric qualities of PBU by facilitating electron transfer between contacting materials, ultimately resulting in high output performance. We employed this device for sensing applications to monitor human motion and breathing pattern recognition. The soft and fibrous-structured TENG generates a high and stable open-circuit voltage of up to 30 V and a short-circuit current of 4 µA at an operation frequency of 4.0 Hz, demonstrating remarkable cyclic stability. A significant feature of our TENG is its self-healing ability, which allows for the restoration of its functionality and performance after sustaining damage. This characteristic has been achieved through the utilization of the self-healable PBU fibers, which can be repaired via a simple vapor solvent method. This innovative approach enables the TENG device to maintain optimal performance and continue functioning effectively even after multiple uses. After integration with a rectifier, the TENG can charge various capacitors and power 120 LEDs. Moreover, we employed the TENG as a self-powered active motion sensor, attaching it to the human body to monitor various body movements for energy-harvesting and sensing purposes. Additionally, the device demonstrates the capability to recognize breathing patterns in real time, offering valuable insights into an individual's respiratory health.

Role of Oxygen in the Ti3AlC2 MAX Phase in the Oxide Formation and Conductivity of Ti3C2-Based MXene Nanosheets.

Ti3C2Tx MXene, a two-dimensional transition metal carbide, has attracted substantial interest due to its unique physical properties and a wide range of potential applications. Although the properties of devices using MXene have been substantially enhanced in recent years, it is not fully understood how the oxygen concentration in Ti3AlC2 MAX affects oxide formation in Ti3C2-based MXene nanosheets and their fundamental properties. To this end, we compared two types of MAX phases: MAX with low oxygen content (LO-MAX) and MAX synthesized by a conventional process. Since the conventional MAX synthesis employs metal (Ti) as a primary material, it is referred to as metal-based MAX (MB-MAX) from here. The oxygen content of the LO-MAX was only 0.56 wt %, which was about 20% compared to that of MAX synthesized using conventional methods. We compared the properties of MXene nanosheets prepared from the LO-MAX with MXene nanosheets obtained from the MB-MAX. Microscopic and chemical analyses revealed smooth and wrinkle-free morphology and small amounts of oxygen in MXene nanosheets prepared from LO-MAX (LO-MXene). The LO-MXene nanosheet film exhibited an exceptionally high conductivity of 10,540 S/cm and an ultralow surface roughness of 1.7 nm, which originated from inhibited surface oxide formation. Moreover, the inhibition of oxide formation strengthened the function of -O or -OH groups on the surface of MXene, thereby facilitating strong hydrogen bonding to the polymer with hydroxyl groups. To clearly reveal these properties, we prepared a pressure sensor by coating these MXene nanosheets on nylon/polyester fibers. The fabricated sensor exhibited a high sensitivity of up to 85.6/kPa and excellent stretch stability and reliability. These results clearly revealed that lowering the oxygen content in MAX can make a decisive contribution to improving the fundamental properties of MXene nanosheets prepared therefrom.

Electronic textiles: New age of wearable technology for healthcare and fitness solutions.

Sedentary lifestyles and evolving work environments have created challenges for global health and cause huge burdens on healthcare and fitness systems. Physical immobility and functional losses due to aging are two main reasons for noncommunicable disease mortality. Smart electronic textiles (e-textiles) have attracted considerable attention because of their potential uses in health monitoring, rehabilitation, and training assessment applications. Interactive textiles integrated with electronic devices and algorithms can be used to gather, process, and digitize data on human body motion in real time for purposes such as electrotherapy, improving blood circulation, and promoting wound healing. This review summarizes research advances on e-textiles designed for wearable healthcare and fitness systems. The significance of e-textiles, key applications, and future demand expectations are addressed in this review. Various health conditions and fitness problems and possible solutions involving the use of multifunctional interactive garments are discussed. A brief discussion of essential materials and basic procedures used to fabricate wearable e-textiles are included. Finally, the current challenges, possible solutions, opportunities, and future perspectives in the area of smart textiles are discussed.

Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding.

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn-58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn-58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu-Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn-58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints.

The effects of Cu opening size on the mechanical properties of epoxy-contained Sn-58Bi solder joints were investigated by a low-speed shear test. Eight sample types were fabricated with various Cu opening sizes and solder pastes. The Cu opening sizes of the component and substrate were 200 µm or 380 µm, respectively, and the component formed a Sn-3.0Ag-0.5Cu (SAC305) solder bump which was placed on the Sn-58Bi solder paste or epoxy Sn-58Bi solder paste printed on the substrate and then reflowed. The microstructures of the solder joints were observed using scanning electron microscopy (SEM), and the chemical compositions were analyzed by energy-dispersive X-ray spectroscopy (EDS) and electron probe X-ray micro-analyzer (EPMA). Epoxy was formed around the solder joints after the reflow process, improving the bonding strength of the epoxy-contained solder joints. Specifically, the bonding strength of the epoxy Sn-58Bi solder joints increased about 2.9 times in the 200 µm (opening size of component)/380 µm (opening size of substrate) sample. When the opening size of the component and substrate differed, a fracture occurred at the smaller opening size. On the other hand, a fracture occurred at the substrate side for the SAC305 (solder paste of component)/Sn-58Bi (solder paste of substrate) solder joints, while a fracture occurred at the interface between SAC305 and Sn-58Bi at the SAC305/epoxy Sn-58Bi solder joints for samples with the same opening size between the component and substrate.

Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions.

The ball-grid array (BGA) is widely used to reduce component size and it had advantages such as high I/O pins and fine pitch. Typical Sn-Ag-Cu (SAC) solder alloys are used for formation of BGA because SAC solder has excellent characteristics among lead-free solders. However, the electronic components assembled by SAC solder were easily damaged by heat during manufacture process because SAC solder had high melting point of 220 °C. To prevent these thermal damages, SAC305 BGA component assembled by Sn-58Bi solder paste has been studied because Sn-58Bi solder had low melting point of 139 °C. In generally, Sn-58Bi solder was improved by additional elements or polymer such as epoxy because Sn-58Bi had a brittle property. However, the epoxy Sn-58Bi solder did not guaranteed high environmental reliability such as high-temperature high-humidity (HTHH) test. Thus, we evaluated the shear strength of solder joints assembled by SAC305 BGA components with Sn-58Bi solder paste and epoxy Sn-58Bi solder paste. The shear strength of solder joints was evaluated by die shear test after HTHH test at the 85 °C/85% RH conditions. The Cu6Sn5 intermetallic-compound (IMC) at the interface of solder joints was observed by scanning electron microscope (SEM). The IMC thickness of Sn-58Bi solder joints was smaller than that of epoxy Sn-58Bi solder. The shear strength was improved up to 20% by epoxy addition. The shear strength of epoxy Sn-58Bi solder joints dramatically decreased after HTHH test for 100 h.

Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test.

Microstructures and mechanical property of Sn-3.0Ag-0.5Cu (SAC305) and epoxy Sn-3.0Ag-0.5Cu (epoxy SAC) solder joints were investigated with various surface finishes; organic solderability preservative (OSP), electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). Bending property of solder joints was evaluated by 3-point bend test method. Microstructure and chemical composition of solder joints was characterized by scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDX), respectively. Epoxy did not effect on intermetallic compound (IMC) morphology. Scalloped shaped Cu6Sn5 IMC was observed at OSP surface finish. Chunky-like shaped and needle-like shaped (Ni,Cu)6Sn5 IMC were observed at the solder/ENIG joint and solder/ENEPIG joint, respectively. The bending cycles of SAC305/OSP joint, SAC305/ENIG joints and SAC305/ENEPIG joints were 720, 440 and 481 cycle numbers. The bending cycles of epoxy SAC and three types surface finished solder joints were over 1000 bending cycles. Under OSP surface finish, bending cycles of epoxy SAC solder was approximately 1.5 times higher than those of SAC305 solder joint. Bending cycles of epoxy SAC solder was over twice times higher than those of SAC305 solder with ENIG and ENEPIG surface finishes. The bending property of epoxy solder joint was enhanced due to epoxy fillet held the solder joint.

Synergistic effect of Indium and Gallium co-doping on growth behavior and physical properties of hydrothermally grown ZnO nanorods.

We synthesized ZnO nanorods (NRs) using simple hydrothermal method, with the simultaneous incorporation of gallium (Ga) and indium (In), in addition, investigated the co-doping effect on the morphology, microstructure, electronic structure, and electrical/optical properties. The growth behavior of the doped NRs was affected by the nuclei density and polarity of the (001) plane. The c-axis parameter of the co-doped NRs was similar to that of undoped NRs due to the compensated lattice distortion caused by the presence of dopants that are both larger (In3+) and smaller (Ga3+) than the host Zn2+ cations. Red shifts in the ultraviolet emission peaks were observed in all doped NRs, owing to the combined effects of NR size, band gap renormalization, and the presence of stacking faults created by the dopant-induced lattice distortions. In addition, the NR/p-GaN diodes using co-doped NRs exhibited superior electrical conductivity compared to the other specimens due to the increase in the charge carrier density of NRs and the relatively large effective contact area of (001) planes. The simultaneous doping of In and Ga is therefore anticipated to provide a broader range of optical, physical, and electrical properties of ZnO NRs for a variety of opto-electronic applications.

Facet-controlled anatase TiO2 nanoparticles through various fluorine sources for superior photocatalytic activity.

Reactive surface-exposed anatase TiO2 (a-TiO2) is highly desirable for applications requiring superior photocatalytic activity. In order to obtain a favorable surface, morphology control of the a-TiO2 using capping agents has been widely investigated. Herein, we systematically study the effects of different F sources (HF, TiF4, and NH4F) as the capping agent on the morphology control and photocatalytic activities of a-TiO2 in a hydrothermal process. When either HF or TiF4 was added, large truncated bipyramids formed with the photocatalytically active {001} facet, whereas the NH4F was not effective for facet control, yielding nanospheres similar to the pure a-TiO2. The morphology changes were related to the decomposition behaviors of the F sources in the solvent material: HF and TiF4 decomposed and supplied F(-) ions before a-TiO2 nucleation, which changed the nucleation rate and growth direction, leading to the resultant a-TiO2 morphology. On the other hand, NH4F supplied F(-) ions after a-TiO2 nucleation and could not change the growth behavior. In terms of the photocatalytic effect, the HF- and TiF4-treated a-TiO2 effectively decomposed ∼90% and ∼80% of methylene blue, respectively, in 1 h, while ∼60% was decomposed for the NH4F-treated a-TiO2. Note that pure a-TiO2 photocatalytically decomposed only ∼10% of methylene blue over the same time. These results pave the way to precise control of the facet of TiO2 through using different capping agents.

Microwave Sintering of Silver Nanoink for Radio Frequency Applications.

Microwave sintering is a promising method for low-temperature processes, as it provides advantages such as uniform, fast, and volumetric heating. In this study, we investigated the electrical characteristics of inkjet-printed silver (Ag) circuits sintered by microwaves. The microstructural evolutions of inkjet-printed Ag circuits sintered at various temperatures for different durations were observed with a field emission scanning electron microscope. The electrical properties of the inkjet-printed Ag circuits were analysed by electrical resistivity measurements and radio frequency properties including scattering-parameters in the frequency range of 20 MHz to 20 GHz. The experimental results show that the signal losses of the Ag circuits sintered by microwave heating were lower than those sintered by conventional heating as microwave heating led to granular films which were nearly fully sintered without pores on the surfaces. When the inkjet-printed Ag circuits were sintered by microwaves at 300 °C for 4 min, their electrical resistivity was 5.1 µΩ cm, which is 3.2 times larger than that of bulk Ag. Furthermore, microwave sintering at 150 °C for 4 min achieved much lower signal losses (1.1 dB at 20 GHz) than conventional sintering under the same conditions.

Hydrothermally Grown In-doped ZnO Nanorods on p-GaN Films for Color-tunable Heterojunction Light-emitting-diodes.

The incorporation of doping elements in ZnO nanostructures plays an important role in adjusting the optical and electrical properties in optoelectronic devices. In the present study, we fabricated 1-D ZnO nanorods (NRs) doped with different In contents (0% ~ 5%) on p-GaN films using a facile hydrothermal method, and investigated the effect of the In doping on the morphology and electronic structure of the NRs and the electrical and optical performances of the n-ZnO NRs/p-GaN heterojunction light emitting diodes (LEDs). As the In content increased, the size (diameter and length) of the NRs increased, and the electrical performance of the LEDs improved. From the electroluminescence (EL) spectra, it was found that the broad green-yellow-orange emission band significantly increased with increasing In content due to the increased defect states (oxygen vacancies) in the ZnO NRs, and consequently, the superposition of the emission bands centered at 415 nm and 570 nm led to the generation of white-light. These results suggest that In doping is an effective way to tailor the morphology and the optical, electronic, and electrical properties of ZnO NRs, as well as the EL emission property of heterojunction LEDs.

Effect of Radio Frequency Plasma Treatment on Evaporation Behavior and Characteristics of RuCr Alloy Powder.

The evaporation behavior and characteristics of jet milled RuCr alloy powders processed by radio-frequency (RF) plasma treatment were evaluated during this study. RF plasma treatment was found to be effective in eliminating internal pores and in manufacturing spherical powder. However, the RF plasma treatment resulted in the evaporation of Cr. The degree of evaporation of Cr was significantly affected by the powder feeding rate. As a result, it was found that controlling the torch power was more effective than controlling the powder feeding rate for obtaining desirable RuCr alloy powders.

Effect of Ag nanowire addition into nanoparticle paste on the conductivity of Ag patterns printed by gravure offset method.

This paper focuses on the effect of Ag nanowire addition into a commercial Ag nanopaste and the printability evaluation of the mixed paste by the gravure offset printing methodology. Ag nanowires were synthesized by a modified polyol method, and a small amount of them was added into a commercial metallic paste based on Ag nanoparticles of 50 nm in diameter. Two annealing temperatures were selected for comparison, and electrical conductivity was measured by four point probe method. As a result, the hybrid mixture could be printed by the gravure offset method for patterning fine lines up to 15 µm width with sharp edges and scarce spreading. The addition of the Ag nanowires was significantly efficient for enhancement of electrical conductivity of the printed lines annealed at a low temperature (150 degrees C), while the effect was somewhat diluted in case of high temperature annealing (200 degrees C). The experimental results were discussed with the conduction mechanism in the printed conductive circuits with a schematic description of the electron flows in the printed lines.

Electrical and electrochemical migration characteristics of Ag/Cu nanopaste patterns.

Since direct printing technology has developed intensively, low-cost fabrication and reliability have become critical challenges for mass production of printed electronic devices. The silver/copper (Ag/Cu) nanopaste was manufactured by Ag nanopaste mixed with different proportions of Cu nanoparticles ranging from 0 to 5 vol.% in order to investigate the influences of Cu content on the electrical properties and electrochemical migration (ECM) characteristics. The patterns were constructed on a glass wafer via screen printing with the Ag/Cu nanopaste. They were then annealed through debinding for 30 min in air followed by sintering for 30 min in a hydrogen atmosphere at various temperatures (150, 200, 250, and 300 degrees C). The electrical resistivity of printed patterns that were sintered at 150 degrees C grew with increases in the percentage of Cu content in the Ag/Cu nanopaste, while printed patterns that were sintered at 300 degrees C show similar electrical resistivity values of around 2-3 µΩ cm regardless of Cu content. The ECM characteristics of the printed patterns were evaluated by performing a water drop test. The printed patterns that were sintered at higher temperatures showed longer ECM times. At 300 degrees C, the ECM time was considerably lengthened when the Cu content was over 2 vol.%, and the 5 vol.% Cu pattern showed the longest ECM time of 305 s, which was around 1.65 times that of the Ag pattern.

Effect of atmospheric-pressure plasma treatment on the adhesion characteristics of screen-printed Ag nanoparticles on polyimide.

We investigated the adhesion characteristics of screen-printed silver (Ag) tracks on polyimide (PI) treated by atmospheric-pressure plasma (APP). Oxygen plasma was applied to the PI surface, and the APP-treated surface was exposed to air for various periods of time in order to evaluate the sustainability of the APP treatment. The adhesion of the Ag/PI interface was measured using a roll-type 90 degrees peel test. The peel strength was dramatically increased by the APP treatment, but the strength decreased by around 62.7% when the APP-treated PI surface was exposed to air for 2 h. The peeled PI surface showed ductile fracture immediately after the APP treatment; however, after 2 h of exposure to air, the fracture behavior returned what was observed before the APP treatment. To analyze the deterioration of adhesion, the interface between the printed Ag track and the APP-treated PI was investigated physically and chemically. The surface morphology became rougher after the APP treatment, but the roughness slightly decreased after being exposed to air for 2 h. X-ray photoelectron spectroscopy (XPS) was used to investigate the chemical bonding of the printed Ag and the PI interface. XPS analyses show that the concentration of oxygen-containing groups decreased as the exposure time to air increased.

Screen-printed Cu circuit for low-Cost fabrication and its electrochemical migration characteristics.

Circuit pitch has decreased due to the demand for high-performance and multi-functional electronic devices. This trend has increased the risk of short-circuit failures by electrochemical migration (ECM), which is the transportation of ions between the cathode and anode under electrical potential. While direct printing has emerged as a promising technology in terms of manufacturing cost and environmental issues, there are few studies about ECM in directly printed copper (Cu) nanopaste. We prepared screen-printed comb-type Cu patterns on a Si wafer with various sintering temperatures (200, 250, 300, 350 degrees C). ECM characteristics of the printed Cu were determined by water drop testing under various electrical potentials (3, 6, 9 V). The microstructures and the roughness profiles of the pattern surfaces were identified with field emission scanning electron microscopy (FE-SEM) and a three-dimensional surface profiler, respectively. While the electrical potential increased from 3 V to 9 V, the time to failure (ECM time) required for dendrites to grow from the cathode to the adjacent anode decreased by 63.0%. On the other hand, the ECM time increased by 205.1% when the sintering temperature increased from 200 degrees C to 350 degrees C. FE-SEM micrographs and energy-dispersive X-ray spectroscopy analysis of dendrites showed a mixture of trunk and lace types, which were mainly composed of Cu.

Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistance.

Direct printing such as inkjet, gravure, and screen printing is an attractive approach for achieving low-cost circuitry in the printed circuit board industry. One of the challenges for direct printing technology, however, is the poor resistance to electrochemical migration (ECM), especially for silver (Ag) which has been widely used in printed electronics. We demonstrate improved resistance to Ag electrochemical migration by adding palladium (Pd) nanoparticles to the Ag nanopaste. Conductive comb-type patterns were fabricated on a bismaleimide-triazine substrate via screen printing. Their ECM characteristics were assessed by water drop test with deionized water. These results showed that the ECM time required for dendritic growth from cathode to anode to cause short-circuit failure was affected by the Pd content and applied voltages: the ECM time of Ag-15wt.% Pd nanopaste was nearly threefold that of Ag nanopaste, and the ECM time decreased by 94.22%, on average, while the applied voltage increased from 3 V to 9 V.

Characterization of reliability of printed indium tin oxide thin films.

Recently, decreasing the amount of indium (In) element in the indium tin oxide (ITO) used for transparent conductive oxide (TCO) thin film has become necessary for cost reduction. One possible approach to this problem is using printed ITO thin film instead of sputtered. Previous studies showed potential for printed ITO thin films as the TCO layer. However, nothing has been reported on the reliability of printed ITO thin films. Therefore, in this study, the reliability of printed ITO thin films was characterized. ITO nanoparticle ink was fabricated and printed onto a glass substrate followed by heating at 400 degrees C. After measurement of the initial values of sheet resistance and optical transmittance of the printed ITO thin films, their reliabilities were characterized with an isothermal-isohumidity test for 500 hours at 85 degrees C and 85% RH, a thermal shock test for 1,000 cycles between 125 degrees C and -40 degrees C, and a high temperature storage test for 500 hours at 125 degrees C. The same properties were investigated after the tests. Printed ITO thin films showed stable properties despite extremely thermal and humid conditions. Sheet resistances of the printed ITO thin films changed slightly from 435 omega/square to 735 omega/square 507 omega/square and 442 omega/square after the tests, respectively. Optical transmittances of the printed ITO thin films were slightly changed from 84.74% to 81.86%, 88.03% and 88.26% after the tests, respectively. These test results suggest the stability of printed ITO thin film despite extreme environments.