Polarizing and depolarizing charge injection through a thin dielectric layer in a ferroelectric-dielectric bilayer.

Charge injection from the near-by-electrode can occur during ferroelectric switching in the ferroelectric-dielectric bilayer due to the high field applied to the adjacent dielectric layers. The aim of this study is to investigate the effect of the charge injection by separating the amount of switched polarization and the injected charge density. A dynamic model of the injection-involved switching is developed and exploited to elucidate the mechanism. The model demonstrates that the amount of injected charges, which compensates for the bound charge of the polarization, can be larger, smaller, or identical to that of the polarization. This model further describes the analytical conditions of this compensation state. The model predictions are validated by the newly introduced ramping pulse measurements involving the serially connected TiN/Hf0.5Zr0.5O2/TiN and TiN/amorphous Al2O3/TiN, which are capable of separating the injected charge from the switched polarization. The dynamic model, along with the electrical measurements, enables the quantitative prediction and estimation of the internal potential and the effective charge, which is the sum of the bound and injected charges in the bilayer. This work provides fundamental insights into field-effect devices such as the next-generation ferroelectric-field-effect-transistors with NAND architecture based on uncompensated ferroelectric charges.

A Comparative Study on the Ferroelectric Performances in Atomic Layer Deposited Hf0.5Zr0.5O2 Thin Films Using Tetrakis(ethylmethylamino) and Tetrakis(dimethylamino) Precursors.

The chemical, physical, and electrical properties of the atomic layer deposited Hf0.5Zr0.5O2 thin films using tetrakis(ethylmethylamino) (TEMA) and tetrakis(dimethylamino) (TDMA) precursors are compared. The ligand of the metal-organic precursors strongly affects the residual C concentration, grain size, and the resulting ferroelectric properties. Depositing Hf0.5Zr0.5O2 films with the TDMA precursors results in lower C concentration and slightly larger grain size. These findings are beneficial to grow more ferroelectric-phase-dominant film, which mitigates its wake-up effect. From the wake-up test of the TDMA-Hf0.5Zr0.5O2 film with a 2.8 MV/cm cycling field, the adverse wake-up effect was well suppressed up to 105 cycles, with a reasonably high double remanent polarization value of ~40 µC/cm2. The film also showed reliable switching up to 109 cycles with the 2.5 MV/cm cycling field without involving the wake-up effect but with the typical fatigue behavior.

Thickness effect of ultra-thin Ta2O5 resistance switching layer in 28 nm-diameter memory cell.

Resistance switching (RS) devices with ultra-thin Ta2O5 switching layer (0.5-2.0 nm) with a cell diameter of 28 nm were fabricated. The performance of the devices was tested by voltage-driven current-voltage (I-V) sweep and closed-loop pulse switching (CLPS) tests. A Ta layer was placed beneath the Ta2O5 switching layer to act as an oxygen vacancy reservoir. The device with the smallest Ta2O5 thickness (0.5 nm) showed normal switching properties with gradual change in resistance in I-V sweep or CLPS and high reliability. By contrast, other devices with higher Ta2O5 thickness (1.0-2.0 nm) showed abrupt switching with several abnormal behaviours, degraded resistance distribution, especially in high resistance state, and much lower reliability performance. A single conical or hour-glass shaped double conical conducting filament shape was conceived to explain these behavioural differences that depended on the Ta2O5 switching layer thickness. Loss of oxygen via lateral diffusion to the encapsulating Si3N4/SiO2 layer was suggested as the main degradation mechanism for reliability, and a method to improve reliability was also proposed.