High-resolution angle sensor using multiple peak positions of a double slit interference pattern.

A high-resolution angle sensor which uses a double slit (DS) is proposed. By analyzing the positions of intensity peaks in the DS interference pattern, the incident angle of a collimated beam entering the DS is measured. The DS was designed to generate the multiple-order interference pattern with almost even modulation amplitude so that not only the central peak but also multiple side peaks could be used for the measurement. By averaging the incident angle values obtained from each peak position, the angle sensor achieved higher resolution and a smaller periodic nonlinearity error. The performance of the DS angle sensor was tested by comparison with a commercial autocollimator. The Allan deviation of the readout of the angle sensor was 0.0002 in. with the averaging time of 4 s, and the periodic nonlinearity error was evaluated to be less than 0.01 in.

Note: An absolute X-Y-Θ position sensor using a two-dimensional phase-encoded binary scale.

This Note presents a new absolute X-Y-Θ position sensor for measuring planar motion of a precision multi-axis stage system. By analyzing the rotated image of a two-dimensional phase-encoded binary scale (2D), the absolute 2D position values at two separated points were obtained and the absolute X-Y-Θ position could be calculated combining these values. The sensor head was constructed using a board-level camera, a light-emitting diode light source, an imaging lens, and a cube beam-splitter. To obtain the uniform intensity profiles from the vignette scale image, we selected the averaging directions deliberately, and higher resolution in the angle measurement could be achieved by increasing the allowable offset size. The performance of a prototype sensor was evaluated in respect of resolution, nonlinearity, and repeatability. The sensor could resolve 25 nm linear and 0.001° angular displacements clearly, and the standard deviations were less than 18 nm when 2D grid positions were measured repeatedly.

An interferometric system for measuring thickness of parallel glass plates without 2π ambiguity using phase analysis of quadrature Haidinger fringes.

An interferometric system is proposed for measuring the thickness of parallel glass plates by analyzing Haidinger fringes. Although a conventional Haidinger interferometer can measure thickness without 2π ambiguity using positions of peak and valley points in the interferogram, measurement accuracy is directly affected by the number of these points involved in the calculation. The proposed method obtains phase values over the entire interferogram by analyzing the quadrature Haidinger fringes generated by a current modulated laser diode. Therefore, it can achieve high speed measurement and nanometric resolution without mechanical rotation and thickness limitation of specimens. In the experiments, the standard deviation of repeated thickness measurement was evaluated as less than 0.3 nm, and the measured thickness profile of the proposed system agreed with that of a conventional thickness interferometer within ±15 nm. We also discussed the required accuracy of refractive index of specimens to implement the proposed method successfully and presented an exemplary measurement result of a multi-layer coated sample having a discontinuous thickness profile.

Vibration-insensitive measurements of the thickness profile of large glass panels.

We propose and realize a modified spectral-domain interferometer to measure the physical thickness profile and group refractive index distribution of a large glass substrate simultaneously. The optical layout was modified based on a Mach-Zehnder type interferometer, which was specially adopted to be insensitive to mechanical vibration. According to the measurement results of repeated experiments at a length of 820 mm along the horizontal axis, the standard deviations of the physical thickness and group refractive index were calculated to be 0.173 µm and 3.4 × 10(-4), respectively. To verify the insensitivity to vibration, the physical thickness values were monitored at a stationary point while the glass panel was swung at an amplitude exceeding 20 mm. The uncertainty components were evaluated, and the combined measurement uncertainty became 161 nm (k = 1) for a glass panel with a nominal thickness of 0.7 mm.

Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers.

We developed an optical interferometric probe for measuring the geometrical thickness and refractive index of silicon wafers based on a Fizeau-type spectral-domain interferometer, as realized by adopting the optical fiber components of a circulator and a sheet-type beam splitter. The proposed method enables us to achieve a much simpler optical composition and higher immunity to air fluctuations owing to the use of fiber components and a common-path configuration as compared to a bulk-type optical configuration. A femtosecond pulse laser having a spectral bandwidth of 80 nm at a center wavelength of 1.55 µm and an optical spectrum analyzer having a wavelength uncertainty of 0.02 nm were used to acquire multiple interference signals in the frequency domain without a mechanical phase-shifting process. Among the many peaks in the Fourier-transformed signals of the measured interferograms, only three interference signals representing three different optical path differences were selected to extract both the geometrical thickness and group refractive index of a silicon wafer simultaneously. A single point on a double-sided polished silicon wafer was measured 90 times repetitively every two seconds. The geometrical thickness and group refractive index were found to be 476.89 µm and 3.6084, respectively. The measured thickness is in good agreement with that of a contact type method within the expanded uncertainty of contact-type instruments. Through an uncertainty evaluation of the proposed method, the expanded uncertainty of the geometrical thickness was estimated to be 0.12 µm (k = 2).

Quadrature laser interferometer for in-line thickness measurement of glass panels using a current modulation technique.

A thickness measurement system is proposed for in-line inspection of thickness variation of flat glass panels. Multi-reflection on the surfaces of glass panel generates an interference signal whose phase is proportional to the thickness of the glass panel. For accurate and stable calculation of the phase value, we obtain quadrature interference signals using a current modulation technique. The proposed system can measure a thickness profile with high speed and nanometric resolution, and obtain higher accuracy through real-time nonlinear error compensation. The thickness profile, measured by a transmissive-type experimental setup, coincided with a comparative result obtained using a contact-type thickness measurement system within the range of ±40 nm. The standard deviations of the measured thickness profiles and their waviness components were less than 3 nm with a scanning speed of 300 mm/s.

Vibration-insensitive measurement of thickness variation of glass panels using double-slit interferometry.

A technique which can measure thickness variation of a moving glass plate in real-time with nanometric resolution is proposed. The technique is based on the double-slit interference of light. Owing to the nature of differential measurement scheme, the measurement system is immune to harsh environmental condition of a production line, and the measurement results are not affected by the swaying motion of the panel. With the preliminary experimental setup with scanning speed of 100 mm/s, the measurement repeatability was 3 nm for the waviness component of the thickness profile, filtered with a Gaussian filter with cutoff wavelength of 8 mm.

Note: Nonlinearity error compensated absolute planar position measurement using a two-dimensional phase-encoded binary grating.

This Note presents a new absolute planar position measurement method using a two-dimensional phase-encoded binary grating and a sub-division process where nonlinearity error is compensated inherently. Two orthogonally accumulated intensity profiles of the image of the binary grating are analyzed separately to obtain the absolute position values in each axis. The nonlinearity error caused by the non-ideal sinusoidal signals in the intensity profile is compensated by modifying the configuration of the absolute position binary code and shift-averaging the intensity profile. Using an experimental setup, we measured a circular trajectory of 100 nm radius, and compared the measurement result with that of a laser interferometer. Applying the proposed compensation method, the nonlinearity error was reduced to less than 15 nm.

An optical absolute position measurement method using a phase-encoded single track binary code.

We present a new absolute position measurement method using a single track binary code where an absolute position code is encoded by changing the phase of one binary state representation. It can be decoded efficiently using structural property of the binary code, and its sub-division is possible by detecting the relative positions of the binary state representation used for the absolute position encoding. Therefore, the absolute position encoding does not interfere with the sub-division process and so any pseudo-random sequence can be used as the absolute position code. Because the proposed method does not require additional sensing part for the sub-division, it can be realized with a simple configuration and efficient data processing. To verify and evaluate the proposed method, an absolute position measurement system was setup using a binary code scale, a microscopic imaging system, and a CCD camera. In the comparison results with a laser interferometer, the measurement system shows the resolution of less than 50 nm and the nonlinearity error of less than ±60 nm after compensation.

Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process.

We have proposed and demonstrated a novel method to measure depths of through silicon vias (TSVs) at high speed. TSVs are fine and deep holes fabricated in silicon wafers for 3D semiconductors; they are used for electrical connections between vertically stacked wafers. Because the high-aspect ratio hole of the TSV makes it difficult for light to reach the bottom surface, conventional optical methods using visible lights cannot determine the depth value. By adopting an optical comb of a femtosecond pulse laser in the infra-red range as a light source, the depths of TSVs having aspect ratio of about 7 were measured. This measurement was done at high speed based on spectral resolved interferometry. The proposed method is expected to be an alternative method for depth inspection of TSVs.

Note: high precision angle generator using multiple ultrasonic motors and a self-calibratable encoder.

We present an angle generator with high resolution and accuracy, which uses multiple ultrasonic motors and a self-calibratable encoder. A cylindrical air bearing guides a rotational motion, and the ultrasonic motors achieve high resolution over the full circle range with a simple configuration. The self-calibratable encoder can compensate the scale error of a divided circle (signal period: 20") effectively by applying the equal-division-averaged method. The angle generator configures a position feedback control loop using the readout of the encoder. By combining the ac and dc operation mode, the angle generator produced stepwise angular motion with 0.005" resolution. We also evaluated the performance of the angle generator using a precision angle encoder and an autocollimator. The expanded uncertainty (k = 2) in the angle generation was estimated less than 0.03", which included the calibrated scale error and the nonlinearity error.

Note: High speed optical profiler based on a phase-shifting technique using frequency-scanning lasers.

We present a high speed optical profiler (HSOP) using frequency-scanning lasers for three-dimensional profile measurements of microscopic structures. To improve upon previous techniques for implementing the HSOP, we developed frequency-scanning lasers and a compact microscopic interferometer. The controller of the HSOP was also modified to generate proper phase-shifting steps. For measurements of step height specimens, the HSOP showed results comparable with a commercial optical profiler, even with much higher measurement speeds (up to 30 Hz). The typical repeatability of step height measurement was less than 1 nm. We also present measurements of microscopic structures to verify the HSOP's ability to perform high speed inline inspection for the semiconductor and flat-panel display industries.

High-speed measurement of three-dimensional surface profiles up to 10 µm using two-wavelength phase-shifting interferometry utilizing an injection locking technique.

High-speed two-wavelength phase-shifting interferometry is presented. The technique is aimed at high-speed in-line inspection of spacers in liquid crystal display panels or wafer bumps where the measuring range is well determined and high-speed measurements are essential. With our test setup, the measuring range is extended to 10 µm by using two injection locked frequency scanning lasers that offer fast and equidistant phase shifting of interference fringes. A technique to determine the unwrapped phase map in a frequency scanning phase-shifting interferometry without the ordinary phase-unwrapping process is proposed.

Visibility enhanced interferometer based on an injection-locking technique for low reflective materials.

We propose and demonstrate a novel method to enhance the visibility of an optical interferometer when measuring low reflective materials. Because of scattering from a rough surface or its own low reflectivity, the visibility of the obtained interference signal is seriously deteriorated. By amplifying the weak light coming from the sample based on an injection-locking technique, the visibility can be enhanced. As a feasibility test, even with a sample having a reflectivity of 0.6%, we obtained almost the same visibility as a metal coated mirror. The suggested visibility enhanced interferometer can be widely used for measuring low reflective materials.

Thickness and refractive index measurement of a silicon wafer based on an optical comb.

We have proposed and demonstrated a novel method that can determine both the geometrical thickness and refractive index of a silicon wafer at the same time using an optical comb. The geometrical thickness and refractive index of a silicon wafer was determined from the optical thickness using phase information obtained in the spectral domain. In a feasibility test, the geometrical thickness and refractive index of a wafer were measured to be 334.85 microm and 3.50, respectively. The measurement uncertainty for the geometrical thickness was evaluated as 0.95 microm (k = 1) using a preliminary setup.

High resolution interferometer with multiple-pass optical configuration.

An interferometer having fourteen times higher resolution than a conventional single-pass interferometer has been developed by making multiple-pass optical path. To embody the multiple-pass optical configuration, a two-dimensional corner cube array block was designed, and its symmetric structure minimized the measurement error. The effect from the alignment error and the imperfection of corner cube is calculated as picometer level. An experiment proves that the suggested interferometer has about 45 nm of optical resolution and its nonlinearity is about 0.5 nm in peak-to-valley.

High speed phase shifting interferometry using injection locking of the laser frequency to the resonant modes of a confocal Fabry-Perot cavity.

We present a high speed phase shifting interferometer which utilizes the self injection locking of a frequency tunable laser diode. By using a confocal Fabry-Perot cavity made of ultra low expansion glass, and linearly modulating the laser diode current, the laser frequency could be injection locked to the resonant modes of the Fabry-Perot cavity consecutively. It provided equal phase steps to the interferograms which are ideal to be analyzed by the Carré algorithm. The phase step error was evaluated to be about 3 MHz which corresponds to 0.2 nm in length measurement. With this technique, profile measurements are insensitive to external vibration since four 640x480 pixels images can be acquired within 4 ms. Difference of two profile measurements, each made with and without vibration isolation, respectively, was evaluated to be 0.5 nm (rms).

A passive method to compensate nonlinearity in a homodyne interferometer.

This study presents an analysis of the nonlinearity resulting from polarization crosstalk at a polarizing beam splitter (PBS) and a wave plate (WP) in a homodyne interferometer. From a theoretical approach, a new compensation method involving a realignment of the axes of WPs to some specific angles according to the characteristics of the PBS is introduced. This method suppresses the nonlinearity in a homodyne interferometer to 0.36 nm, which would be 3.75 nm with conventional alignment methods of WPs.

A compact system for simultaneous measurement of linear and angular displacements of nano-stages.

We report on a novel compact interferometery system for measuring parasitic motions of a precision stage. It is a combination of a Michelson interferometer with an auto-collimator, of which full physical dimension is mere 70 mm x80 mm x35 mm (WxLxH) including optical components, photo-detectors, and electronic circuits. Since the beams, which measure displacement and angle, can be directed at the same position on the moving mirror, the system is applicable for testing small nano-stages where commercial interferometers are not able to be used. And thus, errors from nano-scale deformation of the moving mirror can be minimized. We find that the residual errors of linear and angular motion measurements are 2.5 nm in peak-to-peak and 0.2'', respectively.