ABSTRACT
We introduce a new configuration for large-core optical transceiver platforms based on asymmetric three-dimensional multimode Y junctions. We developed a simply structured bidirectional waveguide platform without using a wavelength division multiplexing filter or angled mirror. This structure was designed with two different size waveguides by using the three-dimensional ray-tracing method. This structure transmitted nearly 100% power in each direction, upstream and downstream. This simple and cost-effective structure was fabricated by the imprint process using a metallic master fabricated by an ultraprecision machining method. The experimental results show that this structure is suitable for bidirectional communications in large-core optical transceivers at 155 Mbits/s.
ABSTRACT
This study proposes a simple cost-effective method of optical interconnection between a planar lightwave circuit (PLC) device chip and an optical fiber. It was conducted to minimize and overcome the coupling loss caused by lateral offset which is due to the process tolerance and the dimensional limitation existing between PLC device chips and fiber array blocks with groove structures. A PLC device chip and a fiber array block were simultaneously fabricated in a series of polymer replication processes using the original master. The dimensions (i.e., width and thickness) of the under-clad of the PLC device chip were identical to those of the fiber array block. The PLC device chip and optical fiber were aligned by simple positional control for the vertical direction of the PLC device chip under a particular condition. The insertion loss of the proposed 1 x 2 multimode optical splitter device interconnection was 4.0 dB at 850 nm and the coupling loss was below 0.1 dB compared with single-fiber based active alignment.