High performance organic light-emitting diodes employing ITO-free and flexible TiO x /Ag/Al:ZnO electrodes.

The broad application of flexible optoelectronic devices is still hampered by the lack of an ITO-free and highly flexible transparent electrode. Dielectric/metal/dielectric (DMD) transparent electrodes are promising candidates to replace ITO, especially in flexible devices due to their mechanical stability to bending, high optical transmittance and low sheet resistance (<6 Ω sq-1). This paper reports on organic light emitting diodes (OLEDs) employing a DMD electrode, specifically TiO x /Ag/Al:ZnO (doped with 2 wt% Al2O3) fabricated by sputter deposition, together with a solution-processed organic polymeric emitting layer. The electrodes were sputtered without substrate heating on rigid glass and flexible polyethylene terephthalate (PET). The results showed that the OLED devices on the DMD electrodes outperform the OLEDs on commercial ITO substrates in terms of maximum luminance as well as current efficacy. Specifically, DMD-based devices achieve up to 30% higher current efficacy on glass and up to 260% higher efficacy on PET, as compared to the ITO-based reference devices. Maximum luminance reaches up to 100 000 cd m-2 for the DMD-based OLEDs on glass and 43 000 cd m-2 for those on PET. This performance is due to the low sheet resistance of the electrodes combined with efficient light outcoupling and shows the potential of DMDs to replace ITO in optoelectronic devices. This outstanding type of optoelectronic device paves the way for the future high throughput production of flexible display and photovoltaic devices.

Gentle plasma process for embedded silver-nanowire flexible transparent electrodes on temperature-sensitive polymer substrates.

The present study investigates processing routes to obtain highly conductive and transparent electrodes of silver nanowires (AgNWs) on flexible polyethylene terephthalate (PET) substrate. The AgNWs are embedded into a UV-curable polymer to reduce the electrode roughness and enhance its stability. For the purpose of device integration, the AgNWs must partially protrude from the polymer, which demands that their embedding is followed by a transfer step from a host substrate to the final substrate. Since the AgNWs require some sort of curing (thermal or plasma) to reduce the electrode sheet resistance, a thermally stable host substrate is generally used. This study shows that both thermally stable polyimide, as well as temperature-sensitive PET can be used as flexible host substrates, combined with a gentle, AgNW plasma curing. This is possible by adjusting the fabrication sequence to accommodate the plasma curing step, depending on the host substrate. As a result, embedded AgNW electrodes, transferred from polyimide-to-PET and from PET-to-PET are obtained, with optical transmittance of ∼80% (including the substrate) and sheet resistance of ∼13 Ω/sq., similar to electrodes transferred from glass-to-glass substrates. The embedded AgNW electrodes on PET show superior performance in bending tests, as compared to indium-tin-oxide electrodes. The introduced approach, involving low-cost flexible substrates, AgNW spray-coating and plasma curing, is compatible with high-throughput, roll-to-roll processing.