ABSTRACT
A method of growing highly oriented MoS2 is presented. First, a Mo film is deposited on a graphene/SiC(0001) substrate and the subsequent annealing of it at 750 °C leads to intercalation of Mo underneath the graphene layer, which is confirmed by secondary ion mass spectrometry (SIMS) measurements. Formation of highly oriented MoS2 layers is then achieved by sulfurization of the graphene/Mo/SiC system using H2S gas. X-ray diffraction reveals that the MoS2 layers are highly oriented and parallel to the underlying SiC substrate surface. Further SIMS experiments reveal that the intercalation process occurs via the atomic step edges of SiC and Mo and S atoms gradually diffuse along SiC atomic terraces leading to the creation of the MoS2 layer. This observation can be explained by a mechanism of highly oriented growth of MoS2: nucleation of the crystalline MoS2 phase occurs underneath the graphene planes covering the flat parts of SiC steps and Mo and S atoms create crystallization fronts moving along terraces.
ABSTRACT
The application of secondary ion mass spectrometry (SIMS) in investigation and comparison of molybdenum disulfide (MoS2) films grown on SiO2, Al2O3 and BN substrates is presented. SIMS measurements of the MoS2/substrate interface reveals oxygen out-diffusion from the substrates containing oxygen and the formation of an amorphous MoOS layer in addition to MoS2. The total area of MoS2 domains covering the substrate is directly related to the type of substrate. For SiO2, small triangular domains of MoS2 separated by amorphous MoOS material are observed. For Al2O3, the sizes of the MoS2 domains are drastically improved due to the higher stability of sapphire. For a BN substrate, SIMS measurements reveal a uniform MoS2 coverage over the whole 2-inch wafer. These results show the destructive role of oxygen released from substrates such as SiO2 or Al2O3 during the growth process of MoS2. The fast and cheap growth process on a non-oxide substrate allows large wafer-scale uniform molybdenum disulfide material to be obtained, which is promising for device fabrication.
ABSTRACT
Further development and optimization of modern optoelectronic devices requires fast and reliable procedures that may evaluate the quality of interfaces. For thick multilayer devices, mixing effect may significantly prevent proper interpretation of secondary ion mass spectrometry depth profiles especially if a region of interest is located far from the sample surface. In this work, we present how to overcome this problem with a so-called a-crater-within-a-crater approach. In this notion, a high energetic primary ion beam is used to rapidly remove most of the material forming a large crater. Then, the energy is significantly reduced and a new smaller crater is formed at the bottom of the previous one. Close to the region of interest, the impact energy is decreased to 150 eV and thus an interface can be analyzed with minimal mixing effect and thus its quality can be adequately assessed. Usefulness of this approach is tested on an epitaxial structure of a triple-junction solar cell and reliable information about the structure imperfection has been obtained: p and n dopants in the tunnel junction overlapped, deteriorating the operation of the device.
