ABSTRACT
To enhance the mechanical strength and bioactivity of poly(lactic acid) (PLA) to the level that can be used as a material for spinal implants, poly(glycolic acid) (PGA) fibers and hydroxyapatite (HA) were introduced as fillers to PLA composites. To improve the poor interface between HA and PLA, HA was grafted by PLA to form HA-g-PLA through coupling reactions, and mixed with PLA. The size of the HA particles in the PLA matrix was observed to be reduced from several micrometers to sub-micrometer by grafting PLA onto HA. The tensile and flexural strength of PLA/HA-g-PLA composites were increased compared with those of PLA/HA, apparently due to the better dispersion of HA and stronger interfacial adhesion between the HA and PLA matrix. We also examined the effects of the length and frequency of grafted PLA chains on the tensile strength of the composites. By the addition of unidirectionally aligned PGA fibers, the flexural strength of the composites was greatly improved to a level comparable with human compact bone. In the bioactivity tests, the growth of apatite on the surface was fastest and most uniform in the PLA/PGA fiber/HA-g-PLA composite.
ABSTRACT
To enhance the bioactivity of poly(lactic acid) (PLA), a potential bone repair material, without the lowering of mechanical strength, hydroxyapatite (HA) was introduced in the form of nanofibers as the filler for application in spinal implant materials. HA nanofibers (HANF) with aspect ratio as high as ~100 were synthesized by controlling the starting pH of the reaction. While the tensile and flexural strength of PLA/HANF composites were enhanced compared with those of PLA resin, and were higher for the composites with HANF of higher aspect ratio. To further strengthen the composites, HANF was grafted with PLA chain to form HANF-g-PLA, which could improve the interface between the HANF and matrix PLA. PLA/HANF-g-PLA composites showed even higher tensile and flexural strength than PLA/HANF composites, apparently due to the better dispersion and interfacial adhesion. The composite containing 10 wt% HANF-g-PLA showed the flexural strength of 124 MPa, which was 25% higher than that of PLA resin. In the bioactivity test using a simulated body fluid solution, the rate and uniformity of the apatite growth were observed to be higher for the composites with HANF, and were even higher for those with HANF-g-PLA. This study suggested the possibility of using the PLA/HANF-g-PLA composite in the field of spinal implant materials.
ABSTRACT
Herein, spinal fixation implants were constructed using degradable polymeric materials such as PGA-PLA block copolymers (poly(glycolic acid-b-lactic acid)). These materials were reinforced by blending with HA-g-PLA (hydroxyapatite-graft-poly lactic acid) and PGA fiber before being tested to confirm its biocompatibility via in vitro (MTT assay) and in vivo animal experiments (i.e., skin sensitization, intradermal intracutaneous reaction, and in vivo degradation tests). Every specimen exhibited suitable biocompatibility and biodegradability for use as resorbable spinal fixation materials.
ABSTRACT
Nanowire (NW) complementary inverters based on NW channels and NW electrodes are a promising core logic unit of future subminiature, high density and textile-type configured electronic circuits. However, existing approaches based on short NWs (<150 µm) or non-woven nanofibers cannot provide precisely-coordinated NW inverters due to the difficulty in the position and alignment control of each NW. In particular, the large-scale fabrication of highly-aligned metal nanoelectrode (NE) arrays with low resistivity is a challenging issue. Here, we developed large-scale-aligned AgNE arrays with very low resistivity by using printed NW lithography, and then demonstrated NW complementary inverters by combining with direct-printed organic semiconducting NWs. The width of the AgNEs was controlled from 250 to 1000 nm; their resistivity was 2.6 µΩ cm which is quite comparable with that of Ag films (1.6 µΩ cm). We expect that this approach will facilitate advances in the large-scale fabrication of nanoelectronics which will be compatible with printed electronics.
