ABSTRACT
The advancement of cellular communication technology has profoundly transformed human life. People can now watch high-definition videos anytime, anywhere, and aim for the implementation of advanced autonomous driving capabilities. However, the sustainability of such an environment is threatened by false base stations. False base stations execute attacks in the Radio Access Network (RAN) of cellular systems, adversely affecting the network or its users. To address this challenge, we propose a behavior rule specification-based false base station detection system, SMDFbs. We derive behavior rules from the normal operations of base stations and convert these rules into a state machine. Based on this state machine, we detect network anomalies and mitigate threats. We conducted experiments detecting false base stations in a 5G RAN simulator, comparing our system with seven machine learning-based detection techniques. The experimental results showed that our proposed system achieved a detection accuracy of 98% and demonstrated lower overhead compared to other algorithms.
ABSTRACT
Unmanned Aerial Vehicle (UAV) plays a paramount role in various fields, such as military, aerospace, reconnaissance, agriculture, and many more. The development and implementation of these devices have become vital in terms of usability and reachability. Unfortunately, as they become widespread and their demand grows, they are becoming more and more vulnerable to several security attacks, including, but not limited to, jamming, information leakage, and spoofing. In order to cope with such attacks and security threats, a proper design of robust security protocols is indispensable. Although several pieces of research have been carried out with this regard, there are still research gaps, particularly concerning UAV-to-UAV secure communication, support for perfect forward secrecy, and provision of non-repudiation. Especially in a military scenario, it is essential to solve these gaps. In this paper, we studied the security prerequisites of the UAV communication protocol, specifically in the military setting. More importantly, a security protocol (with two sub-protocols), that serves in securing the communication between UAVs, and between a UAV and a Ground Control Station, is proposed. This protocol, apart from the common security requirements, achieves perfect forward secrecy and non-repudiation, which are essential to a secure military communication. The proposed protocol is formally and thoroughly verified by using the BAN-logic (Burrow-Abadi-Needham logic) and Scyther tool, followed by performance evaluation and implementation of the protocol on a real UAV. From the security and performance evaluation, it is indicated that the proposed protocol is superior compared to other related protocols while meeting confidentiality, integrity, mutual authentication, non-repudiation, perfect forward secrecy, perfect backward secrecy, response to DoS (Denial of Service) attacks, man-in-the-middle protection, and D2D (Drone-to-Drone) security.
ABSTRACT
The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn-58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn-58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu-Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn-58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.
ABSTRACT
The immoderate growth of intermetallic compounds (IMCs) formed at the interface of a solder metal and the substrate during soldering can degrade the mechanical properties and reliability of a solder joint in electronic packaging. Therefore, it is critical to control IMC growth at the solder joints between the solder and the substrate. In this study, we investigated the control of interfacial reactions and IMC growth by the layer-by-layer transfer of graphene during the reflow process at the interface between Sn-3.0Ag-0.5Cu (in wt %) lead-free solder and Cu. As the number of graphene layers transferred onto the surface of the Cu substrate increased, the thickness of the total IMC (Cu6Sn5 and Cu3Sn) layer decreased. After 10 repetitions of the reflow process for 50 s above 217 °C, the melting temperature of Sn-3.0Ag-0.5Cu, with a peak temperature of 250 °C, the increase in thickness of the total IMC layer at the interface with multiple layers of graphene was decreased by more than 20% compared to that at the interface of bare Cu without graphene. Furthermore, the average diameter of the Cu6Sn5 scallops at the interface with multiple layers of graphene was smaller than that at the interface without graphene. Despite 10 repetitions of the reflow process, the growth of Cu3Sn at the interface with multiple layers of graphene was suppressed by more than 20% compared with that at the interface without graphene. The multiple layers of graphene at the interface between the solder metal and the Cu substrate hindered the diffusion of Cu atoms from the Cu substrate and suppressed the reactions between Cu and Sn in the solder. Thus, the multiple layers of graphene transferred at the interface between dissimilar metals can control the interfacial reaction and IMC growth occurring at the joining interface.
