Step-type quantum wells with slightly varied InN composition for GaN-based yellow micro light-emitting diodes.

In this work, we propose adopting step-type quantum wells to improve the external quantum efficiency for GaN-based yellow micro light-emitting diodes. The step-type quantum well is separated into two parts with slightly different InN compositions. The proposed quantum well structure can partially reduce the polarization mismatch between quantum barriers and quantum wells, which increases the overlap for electron and hole wave functions without affecting the emission wavelength. Another advantage is that the slightly decreased InN composition in the quantum well helps to decrease the valence band barrier height for holes. For this reason, the hole injection capability is improved. More importantly, we also find that step-type quantum wells can make holes spread less to the mesa edges, thus suppressing the surface nonradiative recombination and decreasing the leakage current.

Promoted Hole Transport Capability by Improving Lateral Current Spreading for High-Efficiency Quantum Dot Light-Emitting Diodes.

Carrier imbalance resulting from stronger electron injection from ZnO into quantum-dot (QD) emissive layer than hole injection is one critical issue that constrains the performance of QDs-based light-emitting diodes (QLEDs). This study reports highly efficient inverted QLEDs enabled by periodic insertion of MoO3 into (4,4'-bis(N-carbazolyl)-1,1'-biphenyl) (CBP) hole transport layer (HTL). The periodic ultrathin MoO3/CBP-stacked HTL results in improved lateral current spreading for the QLEDs, which significantly relieves the crowding of holes and thus enhances hole transport capability across the CBP in QLEDs. Comprehensive analysis on the photoelectric properties of devices shows that the optimal thickness for MoO3 interlayer inserted in CBP is only ≈1 nm. The resulting devices with periodic two insertion layers of MoO3 into CBP exhibit better performance compared with the CBP-only ones, such that the peak current efficiency is 88.7 cd A-1 corresponding to the external quantum efficiency of 20.6%. Furthermore, the resulting QLEDs show an operational lifetime almost 2.5 times longer compared to CBP-only devices.

Alternative Strategy to Reduce Surface Recombination for InGaN/GaN Micro-light-Emitting Diodes-Thinning the Quantum Barriers to Manage the Current Spreading.

Owing to high surface-to-volume ratio, InGaN-based micro-light-emitting diodes (µLEDs) strongly suffer from surface recombination that is induced by sidewall defects. Moreover, as the chip size decreases, the current spreading will be correspondingly enhanced, which therefore further limits the carrier injection and the external quantum efficiency (EQE). In this work, we suggest reducing the nonradiative recombination rate at sidewall defects by managing the current spreading effect. For that purpose, we properly reduce the vertical resistivity by decreasing the quantum barrier thickness so that the current is less horizontally spreaded to sidewall defects. As a result, much fewer carriers are consumed in the way of surface nonradiative recombination. Our calculated results demonstrate that the suppressed surface nonradiative recombination can better favor the hole injection efficiency. We also fabricate the µLEDs that are grown on Si substrates, and the measured results are consistent with the numerical calculations, such that the EQE for the proposed µLEDs with properly thin quantum barriers can be enhanced, thanks to the less current spreading effect and the decreased surface nonradiative recombination.

Enhancing the lateral current injection by modulating the doping type in the p-type hole injection layer for InGaN/GaN vertical cavity surface emitting lasers.

In this report, we propose GaN-based vertical cavity surface emitting lasers with a p-GaN/n-GaN/p-GaN (PNP-GaN) structured current spreading layer. The PNP-GaN current spreading layer can generate the energy band barrier in the valence band because of the modulated doping type, which is able to favor the current spreading into the aperture. By using the PNP-GaN current spreading layer, the thickness for the optically absorptive ITO current spreading layer can be reduced to decrease internal loss and then enhance the lasing power. Furthermore, we investigate the impact of the doping concentration, the thickness and the position for the inserted n-GaN layer on the lateral hole confinement capability, the lasing power, and the optimization strategy. Our investigations also report that the optimized PNP-GaN structure will suppress the thermal droop of the lasing power for our proposed VCSELs.

On the origin for the hole confinement into apertures for GaN-based VCSELs with buried dielectric insulators.

A better lateral current confinement is essentially important for GaN-based vertical-cavity-surface-emitting lasers (VCSELs) to achieve lasing condition. Therefore, a buried insulator aperture is adopted. However, according to our results, we find that the current cannot be effectively laterally confined if the insulator layer is not properly selected, and this is because of the unique feature for GaN-based VCSELs grown on insulating substrates with both p-electrode and n-electrode on the same side. Our results indicate that the origin for the current confinement arises from lateral energy band bending in the p-GaN layer rather than the electrical resistivity for the buried insulator. The lateral energy band in the p-GaN layer can be more flattened by using a buried insulator with a properly larger dielectric constant. Thus, less bias can be consumed by the buried insulator, enabling better lateral current confinement. On the other hand, the bias consumption by the buried insulator is also affected by the insulator thickness, and we propose to properly decrease the insulator layer thickness for reducing the bias consumption therein and achieving better lateral current confinement. The improved lateral current confinement will correspondingly enhance the lasing power. Thanks to the enhanced lateral current confinement, the 3dB frequency will also be increased if proper buried insulators are adopted.

Improving the Current Spreading by Locally Modulating the Doping Type in the n-AlGaN Layer for AlGaN-Based Deep Ultraviolet Light-Emitting Diodes.

In this report, we locally modulate the doping type in the n-AlGaN layer by proposing n-AlGaN/p-AlGaN/n-AlGaN (NPN-AlGaN)-structured current spreading layer for AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs). After inserting a thin p-AlGaN layer into the n-AlGaN electron supplier layer, a conduction band barrier can be generated in the n-type electron supplier layer, which enables the modulation of the lateral current distribution in the p-type hole supplier layer for DUV LEDs. Additionally, according to our studies, the Mg doping concentration, the thickness, the AlN composition for the p-AlGaN insertion layer and the NPN-AlGaN junction number are found to have a great influence on the current spreading effect. A properly designed NPN-AlGaN current spreading layer can improve the optical output power, external quantum efficiency (EQE), and the wall-plug efficiency (WPE) for DUV LEDs.

On the origin of enhanced hole injection for AlGaN-based deep ultraviolet light-emitting diodes with AlN insertion layer in p-electron blocking layer.

For the [0001] oriented AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs), the holes in the p-type electron blocking layer (p-EBL) are depleted due to the polarization induced positive sheet charges at the last quantum barrier (LQB)/p-EBL interface. The hole depletion effect significantly reduces the hole injection capability across the p-EBL. In this work, we propose inserting a thin AlN layer between the LQB and the p-EBL, which can generate the hole accumulation at the AlN/p-EBL interface. Meanwhile, the holes can obtain the energy when traveling from the p-EBL into the multiple quantum wells (MQWs) by intraband tunneling through the thin AlN layer. As a result, the hole injection and the external quantum efficiency (EQE) have been remarkably enhanced. Moreover, we point out that the thick AlN insertion layer can further generate the hole accumulation in the p-EBL and increase the hole energy which helps to increase the hole injection. We also prove that the intraband tunneling for holes across the thick AlN insertion layer is facilitated by using the optimized structure.

Impact of the surface recombination on InGaN/GaN-based blue micro-light emitting diodes.

In this work, the size-dependent effect for InGaN/GaN-based blue micro-light emitting diodes (µLEDs) is numerically investigated. Our results show that the external quantum efficiency (EQE) and the optical power density drop drastically as the device size decreases when sidewall defects are induced. The observations are owing to the higher surface-to-volume ratio for small µLEDs, which makes the Shockley-Read-Hall (SRH) non-radiative recombination at the sidewall defects not negligible. The sidewall defects also severely affect the injection capability for electrons and holes, such that the electrons and holes are captured by sidewall defects for the SRH recombination. Thus, the poor carrier injection shall be deemed as a challenge for achieving high-brightness µLEDs. Our studies also indicate that the sidewall defects form current leakage channels, and this is reflected by the current density-voltage characteristics. However, the improved current spreading effect can be obtained when the chip size decreases. The better current spreading effect takes account for the reduced forward voltage.

Optimization Strategy of 4H-SiC Separated Absorption Charge and Multiplication Avalanche Photodiode Structure for High Ultraviolet Detection Efficiency.

In this work, parametric investigations on structural optimization are systematically made for 4H-SiC-based separated absorption charge and multiplication (SACM) avalanche ultraviolet photodiode (UV APD). According to our results, the breakdown voltage can be strongly affected by the thickness for the multiplication layer and the doping concentration for the charge control layer. The thickness for the n-type ohmic contact layer, the absorption layer, and the charge control layer can remarkably affect the light penetration depth, which correspondingly influences the number of photo-generated electron-hole pairs, and therefore the aforementioned layer thickness has a strong impact on the responsivity for SACM APD. For enhancing the responsivity of the APD, we require a reduced energy band barrier height at the interface of the optical absorption layer and the charge control layer, so that the promoted carrier transport into the multiplication layer can be favored. In addition, we investigate positive beveled mesas with smaller angles so as to reduce the electric field at the mesa edge. Thus, the dark current is correspondingly suppressed.

On the p-AlGaN/n-AlGaN/p-AlGaN Current Spreading Layer for AlGaN-based Deep Ultraviolet Light-Emitting Diodes.

In this report, AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs) with different p-AlGaN/n-AlGaN/p-AlGaN (PNP-AlGaN) structured current spreading layers have been described and investigated. According to our results, the adopted PNP-AlGaN structure can induce an energy barrier in the hole injection layer that can modulate the lateral current distribution. We also find that the current spreading effect can be strongly affected by the thickness, the doping concentration, the PNP loop, and the AlN composition for the inserted n-AlGaN layer. Therefore, if the PNP-AlGaN structure is properly designed, the forward voltage, the external quantum efficiency, the optical power, and the wall-plug efficiency for the proposed DUV LEDs can be significantly improved as compared with the conventional DUV LED without the PNP-AlGaN structure.