Impact of radiation induced crystallization on programmable metallization cell electrical characteristics and reliability.

Chalcogenide-based, programmable metallization cells (PMC) cells have been characterized after exposure to increasing levels of absorbed dose (i.e., ionizing radiation exposure). We found, and show here for the first time, that total absorbed dose effects induce a slight modification of the switching phenomena with a moderate increase of the programmable low resistance state (LRS) of the PMCs after repeated switching depending on the processing conditions, while it does not impact the state programmed before exposure. We also show that an increase of the programmable high resistance state (HRS) occurs with irradiation. Such observations are discussed through correlation with crystallization observed in the concurrent X-ray diffraction (XRD) characterization of representative thin-film stacks of the PMCs. These new results are compared to previous results obtained on chalcogenide-based PMCs that did not identify/observe such effects.

A CMOS-compatible electronic synapse device based on Cu/SiO2/W programmable metallization cells.

In this work, the resistance plasticity of Cu/SiO2/W programmable metallization cell devices is experimentally explored for the emulation of biological synapses. PMC devices were fabricated with foundry friendly materials using standard processes. The resistance can be continuously increased or decreased with both dc and voltage pulse programming. Impedance spectroscopy results indicate that the gradual change of resistance is attributable to the expansion or contraction of a Cu-rich layer within the device. Pulse programming experiments further show that the pulse amplitude plays a more important role in resistance change than pulse width, which is consistent with the proposed 'dual-layer' device model. The dense resistance-state distribution, 1 V operating voltage and inherent CMOS-compatibility suggests its potential application as electronic synapse in neuromorphic computing.

Electrochemical metallization memories--fundamentals, applications, prospects.

This review focuses on electrochemical metallization memory cells (ECM), highlighting their advantages as the next generation memories. In a brief introduction, the basic switching mechanism of ECM cells is described and the historical development is sketched. In a second part, the full spectra of materials and material combinations used for memory device prototypes and for dedicated studies are presented. In a third part, the specific thermodynamics and kinetics of nanosized electrochemical cells are described. The overlapping of the space charge layers is found to be most relevant for the cell properties at rest. The major factors determining the functionality of the ECM cells are the electrode reaction and the transport kinetics. Depending on electrode and/or electrolyte material electron transfer, electro-crystallization or slow diffusion under strong electric fields can be rate determining. In the fourth part, the major device characteristics of ECM cells are explained. Emphasis is placed on switching speed, forming and SET/RESET voltage, R(ON) to R(OFF) ratio, endurance and retention, and scaling potentials. In the last part, circuit design aspects of ECM arrays are discussed, including the pros and cons of active and passive arrays. In the case of passive arrays, the fundamental sneak path problem is described and as well as a possible solution by two anti-serial (complementary) interconnected resistive switches per cell. Furthermore, the prospects of ECM with regard to further scalability and the ability for multi-bit data storage are addressed.