High-performance Ge-on-insulator lateral p-i-n waveguide photodetectors for electronic-photonic integrated circuits at telecommunication wavelengths.

We report high-performance germanium-on-insulator (GeOI) waveguide photodetectors (WGPDs) for electronic-photonic integrated circuits (EPICs) operating at telecommunication wavelengths. The GeOI samples were fabricated using layer transfer and wafer-bonding techniques, and a high-quality Ge active layer was achieved. Planar lateral p-i-n WGPDs were fabricated and characterized, and they exhibited a low dark current of 0.1 µA. Strain-induced alterations in the optical properties were observed, resulting in an extended photodetection range up to λ = 1638 nm. This range encompasses crucial telecommunication bands. The WGPDs exhibited a high responsivity of 0.56 A/W and a high detectivity of D ∗ = 1.87 ×109cmHz1/2W - 1 at 1550 nm. A frequency-response analysis revealed that increasing the bias voltage from -1 to -9 V enhances the 3-dB bandwidth from 31 to 49 MHz. This study offers a comprehensive understanding of GeOI WGPDs, fostering high-performance EPICs with implications for telecommunications and beyond.

Enhanced light emission of germanium light-emitting-diode on 150 mm germanium-on-insulator (GOI).

Germanium-on-insulator (GOI) has emerged as a novel platform for Ge-based electronic and photonic applications. Discrete photonic devices, such as waveguides, photodetectors, modulators, and optical pumping lasers, have been successfully demonstrated on this platform. However, there is almost no report on the electrically injected Ge light source on the GOI platform. In this study, we present the first fabrication of vertical Ge p-i-n light-emitting diodes (LEDs) on a 150 mm GOI substrate. The high-quality Ge LED on a 150-mm diameter GOI substrate was fabricated via direct wafer bonding followed by ion implantations. As a tensile strain of 0.19% has been introduced during the GOI fabrication process resulting from the thermal mismatch, the LED devices exhibit a dominant direct bandgap transition peak near 0.785 eV (∼1580 nm) at room temperature. In sharp contrast to conventional III-V LEDs, we found that the electroluminescence (EL)/photoluminescence (PL) spectra show enhanced intensities as the temperature is raised from 300 to 450 K as a consequence of the higher occupation of the direct bandgap. The maximum enhancement in EL intensity is a factor of 140% near 1635 nm due to the improved optical confinement offered by the bottom insulator layer. This work potentially broadens the GOI's functional variety for applications in near-infrared sensing, electronics, and photonics.

A Route toward High-Detectivity and Low-Cost Short-Wave Infrared Photodetection: GeSn/Ge Multiple-Quantum-Well Photodetectors with a Dielectric Nanohole Array Metasurface.

High-detectivity and low-cost short-wave infrared photodetectors with complementary metal-oxide-semiconductor (CMOS) compatibility are attractive for various applications such as next-generation optical communication, LiDAR, and molecular sensing. Here, GeSn/Ge multiple-quantum-well (MQW) photodetectors with a dielectric nanohole array metasurface were proposed to realize high-detectivity and low-cost SWIR photodetection. The Ge nanohole array metasurface was utilized to enhance the light absorption in the GeSn/Ge MQW active layer. Compared with metallic nanostructures, the dielectric nanohole structure has the advantages of low intrinsic loss and CMOS compatibility. The introduction of metasurface architecture facilitates a 10.5 times enhanced responsivity of 0.232 A/W at 2 µm wavelength while slightly sacrificing the dark current density. Besides, the metasurface GeSn/Ge MQW photodetectors benefit 35% improvement in the 3 dB bandwidth compared to control GeSn/Ge MQW photodetectors, which can be attributed to the reduced RC delay. Due to the high responsivity and low dark current density, the room temperature specific detectivity at 2 µm is as high as 5.34 × 109 cm·Hz1/2/W, which is the highest among GeSn photodetectors and is better than commercial InSb and PbSe photodetectors operating at the similar wavelength. This work offers a promising approach for achieving low-cost and effective photodetection at 2 µm, contributing to the development of the 2 µm communication band.

Gourd-shaped hole array germanium (Ge)-on-insulator photodiodes with improved responsivity and specific detectivity at 1,550†nm.

Gourd-shaped hole array germanium (Ge) vertical p-i-n photodiodes were designed and demonstrated on a germanium-on-insulator (GOI) substrate with the excellent responsivity of 0.74 A/W and specific detectivity of 3.1 × 1010 cm·Hz1/2/W. It is calculated that the gourd-shaped hole design provides a higher optical absorption compared to a cylinder-shaped hole design. As a result, the external quantum efficiency for the gourd-shaped hole array photodetector was enhanced by ∼2.5× at 1,550 nm, comparing with hole-free array photodetectors. In addition, the extracted specific detectivity is superior to that of commercial bulk Ge photodiodes. The 3-dB bandwidth for the hole array photodetectors is improved by ∼10% due to a lower device capacitance. This work paves the way for low-cost and high-performance CMOS compatible photodetectors for Si-based photonic-integrated circuits.

High Performance Flexible Visible-Blind Ultraviolet Photodetectors with Two-Dimensional Electron Gas Based on Unconventional Release Strategy.

Interdigitated photodetectors (IPDs) based on the two-dimensional electron gas (2DEG) at the AlGaN/GaN interface have gained prominence as high sensitivity ultraviolet (UV) PDs due to their excellent optoelectronic performance. However, most 2DEG-IPDs have been built on rigid substrates, thus limiting the use of 2DEG-IPDs in flexible and wearable applications. In this paper, we have demonstrated high performance flexible AlGaN/GaN 2DEG-IPDs using AlGaN/GaN 2DEG heterostructure membranes created from 8 in. AlGaN/GaN on insulator (AlGaN/GaNOI) substrates. The interdigitated AlGaN/GaN heterostructure has been engineered to reduce dark current by disconnecting the conductive channel at the heterostructure interface. Photocurrent has been also boosted by the escaped carriers from the 2DEG layer. Therefore, the utilization of a 2DEG layer in transferrable AlGaN/GaN heterostructure membranes offers great promises for high performance flexible 2DEG-IPDs for advanced UV detection systems that are critically important in myriad biomedical and environmental applications.

Low-power and high-detectivity Ge photodiodes by in-situ heavy As doping during Ge-on-Si seed layer growth.

Germanium (Ge)-based photodetectors have become one of the mainstream components in photonic-integrated circuits (PICs). Many emerging PIC applications require the photodetectors to have high detectivity and low power consumption. Herein, we demonstrate high-detectivity Ge vertical p-i-n photodiodes on an in-situ heavily arsenic (As)-doped Ge-on-Si platform. The As doping was incorporated during the initial Ge-on-Si seed layer growth. The grown film exhibits an insignificant up-diffusion of the As dopants. The design results in a ∼45× reduction on the dark current and consequently a ∼5× enhancement on the specific detectivity (D*) at low reverse bias. The improvements are mainly attributed to the improved epi-Ge crystal quality and the narrowing of the device junction depletion width. Furthermore, a significant deviation on the AsH3 flow finds a negligible effect on the D* enhancement. This unconventional but low-cost approach provides an alternative solution for future high-detectivity and low-power photodiodes in PICs. This method can be extended to the use of other n-type dopants (e.g., phosphorus (P) and antimony (Sb)) as well as to the design of other types of photodiodes (e.g., waveguide-integrated).

Ge-on-insulator lateral p-i-n waveguide photodetectors for optical communication.

We report high-performance lateral p-i-n Ge waveguide photodetectors (WGPDs) on a Ge-on-insulator (GOI) platform that could be integrated with electronic-photonic integrated circuits (EPICs) for communication applications. The high-quality Ge layer affords a low absolute dark current. A tensile strain of 0.144% in the Ge active layers narrows the direct bandgap to enable efficient photodetection over the entire range of C- and L-bands. The low-index insulator layer enhances optical confinement, resulting in a good optical responsivity. These results demonstrate the feasibility of planar Ge WGPDs for monolithic GOI-based EPICs.

Resonant-cavity-enhanced responsivity in germanium-on-insulator photodetectors.

The germanium-on-insulator (GOI) has recently emerged as a new platform for complementary metal-oxide-semiconductor (CMOS)-compatible photonic integrated circuits. Here we report on resonant-cavity-enhanced optical responses in Ge photodetectors on a GOI platform where conventional photodetection is difficult. A 0.16% tensile strain is introduced to the high-quality Ge active layer to extend the photodetection range to cover the entire range of telecommunication C- and L-bands (1530-1620 nm). A carefully designed vertical cavity is created utilizing the insulator layer and the deposited SiO2 layer to enhance the optical confinement and thus optical response near the direct-gap absorption edge. Experimental results show a responsivity peak at 1590 nm, confirming the resonant cavity effect. Theoretical analysis shows that the optical responsivity in the C- and L-bands is significantly enhanced. Thus, we have demonstrated a new type of Ge photodetector on a GOI platform for CMOS-compatible photonic integrated circuits for telecommunication applications.

High speed and ultra-low dark current Ge vertical p-i-n photodetectors on an oxygen-annealed Ge-on-insulator platform with GeOx surface passivation.

Germanium (Ge) vertical p-i-n photodetectors were demonstrated with an ultra-low dark current of 0.57 mA/cm2 at -1 V. A germanium-on-insulator (GOI) platform with a 200-mm wafer scale was realized for photodetector fabrication via direct wafer bonding and layer transfer techniques, followed by oxygen annealing in finance. A thin germanium-oxide (GeOx) layer was formed on the sidewall of photodetectors by ozone oxidation to suppress surface leakage current. The responsivity of the vertical p-i-n annealed GOI photodetectors was revealed to be 0.42 and 0.28 A/W at 1,500 and 1,550 nm at -1 V, respectively. The photodetector characteristics are investigated in comparison with photodetectors with SiO2 surface passivation. The surface leakage current is reduced by a factor of 10 for photodetectors via ozone oxidation. The 3dB bandwidth of 1.72 GHz at -1 V for GeOx surface-passivated photodetectors is enhanced by approximately 2 times compared to the one for SiO2 surface-passivated photodetectors. The 3dB bandwidth is theoretically expected to further enhance to ∼70 GHz with a 5 µm mesa diameter.

High-efficiency GeSn/Ge multiple-quantum-well photodetectors with photon-trapping microstructures operating at 2 µm.

We introduced photon-trapping microstructures into GeSn-based photodetectors for the first time, and achieved high-efficiency photo detection at 2 µm with a responsivity of 0.11 A/W. The demonstration was realized by a GeSn/Ge multiple-quantum-well (MQW) p-i-n photodiode on a GeOI architecture. Compared with the non-photon-trapping counterparts, the patterning and etching of photon-trapping microstructure can be processed in the same step with mesa structure at no additional cost. A four-fold enhancement of photo response was achieved at 2 µm. Although the incorporation of photo-trapping microstructure degrades the dark current density which increases from 31.5 to 45.2 mA/cm2 at -1 V, it benefits an improved 3-dB bandwidth of 2.7 GHz at bias voltage at -5 V. The optical performance of GeSn/Ge MQW photon-trapping photodetector manifests its great potential as a candidate for efficient 2 µm communication. Additionally, the underlying GeOI platform enables its feasibility of monolithic integration with other photonic components such as waveguide, modulator and (de)multiplexer for optoelectronic integrated circuits (OEICs) operating at 2 µm.

Integrating GeSn photodiode on a 200 mm Ge-on-insulator photonics platform with Ge CMOS devices for advanced OEIC operating at 2 µm band.

High-performance GeSn multiple-quantum-well (MQW) photodiode is demonstrated on a 200 mm Ge-on-insulator (GeOI) photonics platform for the first time. Both GeSn MQW active layer stack and Ge layer (top Ge layer of GeOI after bonding) were grown using a single epitaxy step on a standard (001)-oriented Si substrate (donor wafer) using a reduced pressure chemical vapor deposition (RPCVD). Direct wafer bonding and layer transfer technique were then employed to transfer the GeSn MQW device layers and Ge layer to a 200 mm SiO2-terminated Si handle substrate. The surface illuminated GeSn MQW photodiode realized on this platform exhibits an ultra-low leakage current density of 25 mA/cm2 at room temperature and an enhanced photo sensitivity at 2 µm of 30 mA/W as compared to a GeSn MQW photodiode on Si at 2 µm. The underlying GeOI platform enables monolithic integration of a complete suite of photonics devices operating at 2 µm band, including GeOI strip waveguides, grating couplers, micro-ring modulators, Mach-Zehnder interferometer modulators, etc. In addition, Ge CMOS circuits can also be realized on this common platform using a "photonic-first and electronic-last" processing approach. In this work, as prototype demonstration, both Ge p- and n-channel fin field-effect transistors (FinFETs) were realized on GeOI simultaneously with decent static electrical characteristics. Subthreshold swings of 150 and 99 mV/decade at |VD| = 0.1 V and drive currents of 91 and 10.3 µA/µm at |VG-VTH| = 1 V and |VD| = 0.75 V were achieved for p- and n-FinFETs, respectively. This works illustrates the potential of integrating GeSn (as photo detection material) on GeOI platform for Ge-based optoelectronics integrated circuits (OEICs) targeting communication applications at 2 µm band.

GeSn lateral p-i-n photodetector on insulating substrate.

We report the first experimental demonstration of germanium-tin (GeSn) lateral p-i-n photodetector on a novel GeSn-on-insulator (GeSnOI) substrate. The GeSnOI is formed by direct wafer bonding and layer transfer technique, which is promising for large-scale integration of nano-electronics and photonics devices. The fabricated GeSnOI photodetector shows well-behaved diode characteristics with high Ion/Ioff ratio of ~4 orders of magnitude (at ± 1 V) at room temperature. A cutoff detection beyond 2 µm with photo responsivity (Rop) of 0.016 A/W was achieved at the wavelength (λ) of 2004 nm.

High-performance GeSn photodetector and fin field-effect transistor (FinFET) on an advanced GeSn-on-insulator platform.

We report the first demonstration of high-performance GeSn metal-semiconductor-metal (MSM) photodetector and GeSn p-type fin field-effect transistor (pFinFET) on an advanced GeSn-on-insulator (GeSnOI) platform by complementary metal-oxide-semiconductor (CMOS) compatible processes. The detection range of GeSn photodetector is extended beyond 2 µm, with responsivities of 0.39 and 0.10 A/W at 1550 nm and 2003 nm, respectively. Through the insertion of an ultrathin Al2O3 Schottky-barrier-enhancement layer, the dark current IDark of the GeSn photodetector is suppressed by more than 2 orders of magnitude. An impressive IDark of ~65 nA was achieved at an operating voltage of 1.0 V. A frequency response measurement reveals the achievement of a 3-dB bandwidth of ~1.4 GHz at an illumination wavelength of 2 µm. GeSn pFinFET with fin width (Wfin) scaled down to 15 nm was also fabricated on the GeSnOI platform, exhibiting a small subthreshold swing (S) of 93 mV/decade, a high drive current of 176 µA/µm, and good control of short channel effects (SCEs). This work paves the way for realizing compact, low-cost, and multi-functional GeSn-on-insulator opto-electronic integrated circuits.

Integration of InGaAs MOSFETs and GaAs/ AlGaAs lasers on Si Substrate for advanced opto-electronic integrated circuits (OEICs).

Lasers monolithically integrated with high speed MOSFETs on the silicon (Si) substrate could be a key to realize low cost, low power, and high speed opto-electronic integrated circuits (OEICs). In this paper, we report the monolithic integration of InGaAs channel transistors with electrically pumped GaAs/AlGaAs lasers on the Si substrate for future advanced OEICs. The laser and transistor layers were grown on the Si substrate by molecular beam epitaxy (MBE) using direct epitaxial growth. InGaAs n-FETs with an ION/IOFF ratio of more than 106 with very low off-state leakage and a low subthreshold swing with a minimum of 82 mV/decade were realized. Electrically pumped GaAs/AlGaAs quantum well (QW) lasers with a lasing wavelength of 795 nm at room temperature were demonstrated. The overall fabrication process has a low thermal budget of no more than 400 °C.

Low-threshold optically pumped lasing in highly strained germanium nanowires.

The integration of efficient, miniaturized group IV lasers into CMOS architecture holds the key to the realization of fully functional photonic-integrated circuits. Despite several years of progress, however, all group IV lasers reported to date exhibit impractically high thresholds owing to their unfavourable bandstructures. Highly strained germanium with its fundamentally altered bandstructure has emerged as a potential low-threshold gain medium, but there has yet to be a successful demonstration of lasing from this seemingly promising material system. Here we demonstrate a low-threshold, compact group IV laser that employs a germanium nanowire under a 1.6% uniaxial tensile strain as the gain medium. The amplified material gain in strained germanium can sufficiently overcome optical losses at 83 K, thus allowing the observation of multimode lasing with an optical pumping threshold density of ~3.0 kW cm-2. Our demonstration opens new possibilities for group IV lasers for photonic-integrated circuits.

Epitaxy and characterization of GaInP/AlInP light-emitting diodes on As-doped Ge/Si substrates.

We investigate the impact of threading dislocation density (TDD) and thermal conductivity of substrates on the performance of GaInP/AlInP light-emitting diodes (LEDs) for the integration of III-V optoelectronics on Si. We utilized an arsenic (As) doped Ge/Si substrate that showed a reduced TDD compared to undoped Ge/Si. Compared to LEDs on undoped Ge/Si, the leakage current density for LEDs on As-doped Ge/Si substrate is reduced by four orders of magnitude and the light output is increased six-fold. An increased junction temperature causes light output saturation for LEDs on bulk Ge at high injection current densities. The light output of LEDs on As-doped Ge/Si shows good linearity with injection current density and its junction temperature is ~25 ± 5 °C lower than that of LEDs on bulk Ge at high injection current densities due to better thermal conductivity of the Ge/Si substrate.

Variation of nanopore diameter along porous anodic alumina channels by multi-step anodization.

In order to form tapered nanocapillaries, we investigated a method to vary the nanopore diameter along the porous anodic alumina (PAA) channels using multi-step anodization. By anodizing the aluminum in either single acid (H3PO4) or multi-acid (H2SO4, oxalic acid and H3PO4) with increasing or decreasing voltage, the diameter of the nanopore along the PAA channel can be varied systematically corresponding to the applied voltages. The pore size along the channel can be enlarged or shrunken in the range of 20 nm to 200 nm. Structural engineering of the template along the film growth direction can be achieved by deliberately designing a suitable voltage and electrolyte together with anodization time.