1.
J Electron Microsc (Tokyo)
; 53(3): 277-80, 2004.
Article
in English
| MEDLINE
| ID: mdl-15332655
2.
J Electron Microsc (Tokyo)
; 52(3): 305-7, 2003.
Article
in English
| MEDLINE
| ID: mdl-12892220
ABSTRACT
Nanometre-scale interfacial oxides formed in contact-hole-bottom Si surfaces were investigated by analytical electron microscopy coupled with a field-emission transmission electron microscope. The results showed that the chemical state of the residual oxide formed during reactive-ion etching was mostly changed from the suboxide of Si2+ or Si3+ to the oxide of Si4+ by the following light-etch treatment. Consequently, the process of removing the residual oxide by light-etch treatment was improved and it contributed to the accomplishment of lower contact resistance.